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This paper presents the results of a study of the morphology and structure at the weld interface in a brass–Invar bimetal, which belongs to the class of so-called thermostatic bimetals, or thermobimetals. The structure of the brass–Invar weld interface was analyzed using optical microscopy and scanning electron microscopy (SEM), with the use of energy-dispersive X-ray (EDX) spectrometry and back-scattered electron diffraction (BSE) to identify the phases. The distribution of the crystallographic orientation of the grains at the weld interface was obtained using an e-Flash HR electron back-scatter diffraction (EBSD) detector and a forward-scatter detector (FSD). The results of the study indicated that the weld interface had the wavy structure typical of explosive welding. The wave crests and troughs showed the presence of melted zones consisting of a disordered Cu–Zn–Fe–Ni solid solution and undissolved Invar particles. The pattern quality map showed that the structure of brass and Invar after explosive welding consisted of grains that were strongly elongated towards the area of the highest intensive plastic flow. In addition, numerous deformation twins, dislocation accumulations and shear bands were observed. Thus, based on the results of this study, the mechanism of Cu–Zn–Fe–Ni structure formation can be proposed.
The elemental dissolution of Cu-Zn alloys was investigated as a function of Zn content ranging from 0 to 45 wt%. Atomic emission spectroelectrochemistry (AESEC) was utilized to directly monitor Cu2+ and Zn2+ release and oxide growth as function of time during potentiodynamic experiments. It was determined that Cu dissolution undergoes a simultaneous mechanism of Cu2O formation and Cu2+ release. The addition of Zn in Cu-Zn alloy does not measurably change the dissolution mechanism of Cu2+ and the rate of aqueous Cu2+ was only dependent on the potential. Zn dissolution was however blocked by the formation of a Cu(0) film which shifted the Zn dissolution in the anodic direction.
The elemental dissolution of Cu-Zn alloys was investigated as a function of Zn content ranging from 0 to 45 wt%. Atomic emission spectroelectrochemistry (AESEC) was utilized to directly monitor Cu2+ and Zn2+ release, oxide growth, and the enrichment of Cu metal as function of time during potentiodynamic experiments. It was determined that Cu dissolution undergoes a simultaneous mechanism of Cu2O formation and Cu2+ release. The addition of Zn in Cu-Zn alloy does not measurably change the dissolution mechanism of Cu2+ and the rate of aqueous Cu2+ was only dependent on the potential. Zn dissolution was however blocked by the formation of a Cu(0) film which shifted the Zn dissolution in the anodic direction.
The book „Electropolishing“ by M. Buhlert is dealing with the electrolytic brightening, smoothing and deburring of technical materials like steel, copper, brass, aluminum, titanium and magnesium. The book content covers the basics and the main influencing parameters of the electropolishing process and provides detailed and application orientated procedure information for technical relevant materials.
After a brief introduction into the topic of electrolytic polishing in the first chapter, the author gives a detailed description of the basic electrochemical reaction mechanisms in the second chapter. The reader will also be informed about the physical and chemical parameters, which control the electrochemical removal process. Additionally, the author reports about the advantages and disadvantages of electropolishing.
The third chapter provides a detailed insight into the influencing manufacturing parameters affecting the results of the electropolishing process. Distinct aspects of the manufacturing e.g. workpiece preparation, electrolyte composition, polishing time, electrolyte temperature and alloy compositions will be discussed in detail by the author.
In the fourth and fifth chapter, the author gives useful hints and information about the parameter variation and the suitable handling of hull cells for the optimization of the removal process, followed by a particular overview about material specific electrolyte mixtures for common-used technical metals and alloys, like steel, aluminum, brass, magnesium, copper and titanium.
The sixth chapter of the book provides many selected manufacturing results and investigations on electropolishing of different metals and alloys, which allows the reader the opportunity to develop a systematic understanding of the topic and to adopt the knowledge on the optimization of his own electropolishing process.
Finally, the book concludes with a brief chapter about some remarks with respect to the work safety and environmental efforts.
In summary, this book contains a very detailed and clear arranged overview about the electropolishing method for the surface optimization process. For this reason, it is a suitable and useful lecture for people, which want to take an in depth look into the topic in order to start using this method or are interested in optimize their existing electropolishing processes.
The kinetics of the anodic dissolution of brass (CuZn42 and CuZn21Si3P) in synthetic tap water were investigated by atomic emission spectroelectrochemistry. Elemental Cu and Zn dissolution rates were measured in situ and in real time during galvanostatic dissolution. A complete mass/charge balance for the system yielded, as a function of applied current and a function of time, the quantity of Cu in the dezincification layer and the quantity of Cu and Zn in the oxide layer. In this way, a complete kinetic characterization of the fundamental chemical processes occurring during dezincification was realized for the first time. The oxide layer was composed primarily of Cu2O as indicated by grazing incidence XRD and Raman analysis. The soluble Cu oxidation product was determined to be Cu(II) by a mass/charge balance. Zn was oxidized to soluble Zn(II) leaving behind a trivial amount of solid Zn corrosion product on the surface. The kinetic analysis depicts a two-stage dissolution process of dezincification: a first stage of a rapid growth of the dezincified layer and a second stage where the growth of dezincified layer was much slower. The Cu2O layer grows continually during the exposure.