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On the influence of crystallography on creep of circular notched single crystal superalloy specimens
(2020)
The present work contributes to a better understanding of the effect of stress multiaxiality on the creep behavior of single crystal Ni-base superalloys. For this purpose we studied the creep deformation and rupture behavior of double notched miniature creep tensile specimens loaded in three crystallographic directions [100], [110] and [111] (creep conditions: 950 °C and 400 MPa net section stress). Crystal plasticity finite element method (CPFEM) was used to analyze the creep stress and strain distributions during creep. Double notched specimens have the advantage that when one notch fails, the other is still intact and allows to study a material state which is close to rupture. No notch root cracking was observed, while microstructural damage (pores and micro cracks) were frequently observed in the center of the notch root region. This is in agreement with the FEM results (high axial stress and high hydrostatic stress in the center of the notched specimen). Twinning was observed in the notch regions of [110] and [111] specimens, and <112> {111} twins were detected and analyzed using orientation imaging scanning electron microscopy. The present work shows that high lattice rotations can be detected in SXs after creep fracture, but they are associated with the high strains accumulated in the final rupture event.
The thermal shock behavior of three commercial-advanced ceramics (SSiC, MgO–PSZ, Al2O3) is characterized in air and vacuum applying a laser thermal shock. The available testing system permits the reproducible setting of defined temperature profiles in thin disks and allows a heating-up thermal shock in various media. Due to the accurate determination of the time- and space-resolved temperature distribution, the local stress state can be calculated as a function of time. It is shown that the thermal shock strength is highest for SSiC and lowest in Al2O3 with MgO–PSZ in between. The approach presented in this work allows quantifying the stress state at failure in terms of tangential tensile stress. The investigated environment does not affect the thermal shock resistance under the studied experimental conditions.