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Advancements in pressure-assisted sintering technology for low temperature co-fired ceramics (LTCC)
(2016)
Steadily increasing demands on design and dimensional accuracy of ceramic multilayer modules, as well as the processing of new materials, require continuous improvements of manufacturing technology, especially thermal processes. The capabilities of pressure-assisted sintering (PAS) for the manufacturing of highly integrated low temperature co-fired ceramics (LTCC) multilayer have been considerably extended in the last years by procedural and device-related advancements. A lambda probe has been integrated in a sintering press prototype to monitor and control the process atmosphere. Thereby, the development of oxygen partial pressure during binder burnout of real modules can be observed. On the other hand, the oxygen partial pressure can be regulated during densification, for example to prevent diffusion of silver from circuit paths into the surrounding LTCC. Thin-film capable surfaces can be produced without post-processing by using setter plates made of glass-like carbon in an advanced PAS process under nitrogen. A newly developed advancement of this approach enables in-situ hot-embossing of LTCC during PAS by using structured glass-like carbon molds. The prototype press is further extended by a sensitive displacement transducer for monitoring the thickness shrinkage of real modules with an edge length of up to 8 inch.
A novel process to structure the surfaces of low temperature co-fired ceramics (LTCC) is presented. Lowered and raised structures are formed by hot-embossing with glass-like carbon molds during pressure-assisted sintering. Molding is driven by viscous flow of the LTCC glassy phase above the glass transition temperature. For accurate molding of embossments on the LTCC surface, proper filling of cavities in the glass-like carbon mold is necessary. Therefore, de-airing of the mold cavity has to be assured. Two strategies have been investigated: (i) hot-embossing at 850 °C after termination of LTCC shrinkage with de-airing through vent holes in the mold; and (ii) hot-embossing of open porous LTCC at 775 °C with dense molds, de-airing through pore channels in the LTCC, and subsequent densification by further heating to 850 °C. Circular embossments with 10 mm diameter were molded on a commercially available LTCC (Ceramtape GC, CeramTec GmbH, Marktredwitz, Germany). The sintered height was measured using optical profilometry. Image processing was used to evaluate porosity distributions in the sintered structures. The influence of embossing temperature on LTCC viscosity and mold filling behavior is discussed. Successful molding of 47 µm high raised grids and characters by hot embossing with 0.41 MPa at 775 °C and further heating to 850 °C under constant load is demonstrated. Thereby, the high potential of hot-embossing for precise structuring of LTCC surfaces is illustrated.