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Structuring of LTCC substrates by a combination of pressure-assisted sintering and hot-embossing
(2015)
A novel technology for the structuring of LTCC surfaces is introduced. The material is shaped in a zero-shrinkage process by embossing a glassy carbon mold into the softened LTCC directly after termination of the shrinkage. Three commercially available LTCC compositions (Ceramtape GC, Heratape CT707, and DP951) were tested. Diverse raised and lowered structures including rings, grids, and characters were fabricated. Different material behavior was observed for the tested compositions. Promising results were achieved with Ceramtape GC. Embossing of precise, 40 µm deep circular cavities and 50 µm high raised characters is demonstrated. Processing of 100 × 100 mm² substrates is possible. DP951 showed very good moldability, but also unwanted material displacement due to evaporating lead. A high displacement capacity but uneven heights of embossed structures were observed on CT707 samples. SEM investigations proved the precise transfer of surface contours from the mold to the LTCC. Thereby, the high potential of the hot-embossing process for micro-patterning of LTCC is illustrated.
A novel process to structure the surfaces of low temperature co-fired ceramics (LTCC) is presented. Lowered and raised structures are formed by hot-embossing with glass-like carbon molds during pressure-assisted sintering. Molding is driven by viscous flow of the LTCC glassy phase above the glass transition temperature. For accurate molding of embossments on the LTCC surface, proper filling of cavities in the glass-like carbon mold is necessary. Therefore, de-airing of the mold cavity has to be assured. Two strategies have been investigated: (i) hot-embossing at 850 °C after termination of LTCC shrinkage with de-airing through vent holes in the mold; and (ii) hot-embossing of open porous LTCC at 775 °C with dense molds, de-airing through pore channels in the LTCC, and subsequent densification by further heating to 850 °C. Circular embossments with 10 mm diameter were molded on a commercially available LTCC (Ceramtape GC, CeramTec GmbH, Marktredwitz, Germany). The sintered height was measured using optical profilometry. Image processing was used to evaluate porosity distributions in the sintered structures. The influence of embossing temperature on LTCC viscosity and mold filling behavior is discussed. Successful molding of 47 µm high raised grids and characters by hot embossing with 0.41 MPa at 775 °C and further heating to 850 °C under constant load is demonstrated. Thereby, the high potential of hot-embossing for precise structuring of LTCC surfaces is illustrated.