Datei im Netzwerk der BAM verfügbar ("Closed Access")
Filtern
Dokumenttyp
- Zeitschriftenartikel (1)
- Vortrag (1)
Sprache
- Englisch (2)
Schlagworte
- Viscoelasticity (2) (entfernen)
Eingeladener Vortrag
- nein (1)
Epoxy resins are frequently used for advanced fiber reinforced composites applications. Even though the fibers are dominating strength and stiffness of the composites, specifically when loaded in fiber direction, the failure usually initiates in the matrix near or directly at the interface. Especially in plies loaded transverse to the fiber direction, the mechanical behaviour is highly influenced by the mechanical properties of the epoxy matrix. Accordingly the mechanical properties of the matrix are of great importance.
In this contribution, we present an efficient approach for the transient and time-causal modeling of guided waves in viscoelastic cylindrical waveguides in the context of ultrasonic material characterization. We use the scaled boundary finite element method (SBFEM) for efficient computation of the phase velocity dispersion. Regarding the viscoelastic behavior of the materials under consideration, we propose a decomposition approach that considers the real-valued frequency dependence of the (visco-)elastic moduli and, separately, of their attenuation. The modal expansion approach is utilized to take the transmitting and receiving transducers into account and to propagate the excited waveguide modes through a waveguide of finite length. The effectiveness of the proposed simulation model is shown by comparison with a standard transient FEM simulation as well as simulation results based on the exact solution of the complex-valued viscoelastic guided wave problem. Two material models are discussed, namely the fractional Zener model and the anti-Zener model; we re-interpret the latter in terms of the Rayleigh damping model. Measurements are taken on a polypropylene sample and the proposed transient simulation model is used for inverse material characterization. The extracted material properties may then be used in computer-aided design of ultrasonic systems.