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- Aggregation (1)
- CMOS (1)
- Donoracceptor compound (1)
- Film morphology (1)
- Gold surface (1)
- Lab-on-a-chip (1)
- Microfluidics (1)
- Photonic Integrated Circuits (1)
- Photonic Sensor (1)
- Point-Of-Care-Diagnostics (1)
- Ring resonator (1)
- Silicon Photonics (1)
- Thiocarbonyl group (1)
Organisationseinheit der BAM
BioPIC - Integration of Biosensors based on Photonic Integrated Circuits by Local-Backside Etching
(2020)
Silicon photonic sensors are promising candidates for lab-on-a-chip solutions with versatile applications and scalable production prospects using complementary metal-oxide semiconductor (CMOS) fabrication methods. However, the widespread use has been hindered because the sensing area adjoins optical and electrical components making packaging and sensor handling challenging. In this work, a local back-side release of the photonic sensor is employed, enabling a separation of the sensing area from the rest of the chip. This approach allows preserving the compatibility of photonic integrated circuits in the front-end of line and metal interconnects in the back-end of line.
Substrate-induced self-assembly of donor-acceptor type compounds with terminal thiocarbonyl groups
(2013)
Two types of conjugated thiocarbonyl-terminated compounds have been synthesized and their ability to be adsorbed on surfaces of the different nature, namely, glass, polytetrafluoroethylene (PTFE), and gold has been studied. Different morphology of the films prepared by thermal vacuum evaporation and drop-casting from solutions has been observed depending on the surface used. It has been found that gold surface has a unique property to influence self-assembly of both monolayer and larger aggregates or crystals of the compounds, in contrast to glass and PTFE substrates. It was found that thiocarbonyl group is able to be chemisorbed to the gold surface. However, it was concluded that in spite of the fact that the thiocarbonyl groups are important for the chemical interaction with the gold surface, physical adsorption on the substrate surface, compoundcompound and compound–solvent (when using solution) interactions are of great significance to drive self-assembly of the final film.