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Secondary fluorescence is an inevitable effect that has to be taken into account in any algorithm for quantitative electron probe microanalysis (EPMA) as an additional correction. Moreover, secondary fluorescence worsens spatial resolution of EPMA. Secondary fluorescence is excited both by characteristic radiation and by the X-ray continuum. In most cases the correction is small. There are, however, cases, e.g. the determination of low heavy metal concentration in a light matrix, where the contribution of secondary fluorescence exceeds 10% of the measured X-ray line intensity.
For secondary fluorescence correction the measured X-ray line intensity has to be divided by the correction factor (1+I_flchar/I_p +I_flcont/I_p )≈(1+I_flchar/I_p )(1+I_flcont/I_p ) in order to get those intensity I_p, which is excited only by the primary electrons. I_flchar and I_flcont mean the calculated characteristic and continuums fluorescence intensities. In order to get the intensity of fluorescence radiation, the absorption of the exciting radiation in the specimen, the photoionization probability and the self-absorption of the emitted line must be calculated. The critical quantity is the X-ray yield of the exciting atoms in case of fluorescence by characteristic radiation and the bremsstrahlung yield of the specimen in case of continuum fluorescence. In the former case it is reasonable to apply the same physical model to calculate I_flchar and I_p.
There are different ways how to prove the quality of the results obtained by electron microscopy and related microanalysis techniques, e.g. use of validated standard operation procedures, participation in proficiency testing exercises, use of certified reference materials, etc. International standards are able to provide requirements, specifications, guidelines or characteristics of methods, instruments or samples with the final goal that these can be used consistently in accredited laboratories. In the field of electron microscopy and microbeam analysis standardization and metrology are terms which are encountered rather seldom at major conferences and scientific publications. Nevertheless, spectra formats like EMSA/MSA for spectral-data exchange or tagged image file format (TIFF) for SEM, guidelines for performing quality assurance procedures or for the specification of X-ray spectrometers as well as of certified reference materials (CRMs) in EPMA, or measurement of average grain size by electron backscatter diffraction (EBSD), or guidelines for calibrating image magnification in SEM or TEM are ISO standards already published and used successfully by a large part of the electron microscopy and microbeam analysis community. A main and continuous task of ISO/TC 202 and its subcommittees is to identify and evaluate feasible projects/proposals needed to be developed into new international standards, particularly in respect to recent but established technology, such the silicon drift detector (SDD) EDS one.
Another international platform in the frame of which pre-standardization work can be organized is VAMAS (Versailles Project on Advanced Materials and Standards). International collaborative projects involving aim at providing the technical basis for harmonized measurements, testing, specifications, and standards to be further developed at ISO level. One key point of VAMAS activities is constituted by inter-laboratory comparisons for high-quality data. In the field of microbeam analysis, the technical working area (TWA) 37 Quantitative Microstructural Analysis deals with corresponding projects. Good ideas, e.g. on analysis of low-Z materials/elements and at low energies are particularly encouraged by directly contacting the author. Support and already available guidance will be supplied.