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Visualisierung von mikro- und nanoskalierten Oberflächenstrukturen mittels abbildender Ellipsometry
(2019)
In den letzten Jahren hat die Einbindung der abbildenden Ellipsometrie in die Gruppe der optischen Verfahren zur Oberflächencharakterisierung ein enormes Potential bei der Analyse von topologischen Strukturänderungen gezeigt. Der dabei abgebildete Kon-trast wurde typischerweise auf Änderungen im Brechungsindex, Absorptionseffekte oder Schichtdickenänderungen zurückgeführt. In späteren Studien wurde festgestellt, dass auch andere Faktoren, wie etwa die Krümmung der Oberfläche oder Kanten von Struktu-ren einen signifikanten Einfluss auf die Messung der ellipsometrischen Paramater haben. Um diese Effekte aus der ellipsometrischen Messung extrahieren zu können, wird auf die Analyse der Müller-Matrix zurückgegriffen.
In dem hier vorliegenden Beitrag wird gezeigt, wie die Müller-Matrix-Imaging Ellipsomet-rie (MM-IE) zur Charakterisierung von Oberflächenstrukturen verwendet werden kann. Dazu werden mikro- und nanoskaliert gekrümmte Oberflächen zunächst mit verschiede-nen Referenzmethoden, wie Rasterelektronenmikroskopie (SEM), Lichtmikroskopie (OM), Weißlichtinterferenzmikroskopie (WLIM) und Rasterkraftmikroskopie (AFM) vali-diert erfasst. Der anschließende Vergleich mit den Ergebnissen der Müller-Matrix-Ima-ging-Ellipsometrie ermöglicht eine Korrelation der zugrunde liegenden Strukturphäno-mene mit den ellipsometrischen Daten. In diesem Artikel wird das Prinzip an drei industriell relevanten Strukturgruppen demonstriert: Sub-Mikropartikel, Mikropartikel und sub-mikroskalierte Vertiefungen.
Ellipsometry is a powerful tool, which allows the investigation of material properties over a broad spectral range. Over the course of several years, the ellipsometry lab at BAM has become an accredited testing lab according to ISO/IEC 17025 laying bare the need of better methods for accuracy and traceability. Despite its wide range of application in both research and development as well as industry, there have been no generally accepted standards dealing with model validation and measurement uncertainties.
Based on the first German standard DIN 50989 – 1: 2018 Ellipsometry - Part 1: Principles (currently international standard ISO 23131: 2021) and under consideration of GUM [1] a series of standards for ellipsometry was developed. The entire 6-part series covers several model-based application cases. This standards series avoids having narrow and material specific application cases but instead classifies applications of ellipsometry according to the sample complexity. The concept of ellipsometric transfer quantities (Ψ and Δ or alternatively the elements of transfer matrices) is implemented in the series. For each application case a model-based validation strategy was developed. Thus, the standards are applicable to all materials, instruments and measuring principles.
The uniform structure concept of the series facilitates its practical applicability for users. The standards include the model-based GUM-compliant determination/estimation of the measurement uncertainties. In addition, the appendices of the documents contain numerous measurement and simulation examples as well as recommendations for measuring practice.
In this contribution we present the application cases and basic structure of the standards developed in collaboration with Accurion GmbH and SENTECH Instruments GmbH in the project SNELLIUS.
Ellipsometry has become a powerful measurement tool in semiconductor industry since the sixties of the last century.
Early standardization activities focused exclusively on SiO2/Si (ASTM F 576-01, SEMI 3624). The first generic standard dealing with ellipsometry is DIN 50989-1:2018 Ellipsometry – Part 1: Principles. Standardization is a prerequisite for accreditation according to DIN EN ISO/IEC 17025 and the evaluation of uncertainty budgets.
For the vast majority of ellipsometric measurements, the application of planar substrates is mandatory and requires a proper sample alignment prior to the measurement. Here, the authors present a generalized approach of how to extract the isotropic ellipsometric sample parameters from an imaging Mueller-matrix measurement even if the sample is significantly misaligned. They validate the method by layer-thickness calculations based on imaging Mueller-matrix measurements of flat crystalline silicon samples that were misaligned on purpose. Furthermore, they also exploit this method’s capabilities to perform spatially resolved layer-thickness measurements of a single-layer indium-tin-oxide coating on a fused-silica microlens without the need of realignment or repositioning of the sample during the measurement.
Crystalline Silicon undergoes a complex phase-change dynamic of melting, amorphization, ablation and re-crystallization upon irradiation with high intensity ultra-short laser pulses [1]. The final state of such a modified surface spot depends on many factors, most notably the local fluence and the surface’s crystal orientation. In this study, we induced superficial structure and phase changes in Silicon <111> and <100> wafers using single femtosecond laser pulses (790 nm, 30 fs) for a range of different peak fluences. The resulting surface modifications were studied in great detail using a number of different techniques, including spectroscopic imaging ellipsometry (SIE), atomic force microscopy, high-resolution transmission electron microscopy (HRTEM), and energy dispersive X-ray spectroscopy within scanning transmission electron microscopy (STEM-EDX).
Playing a pivotal role in this work, SIE provided non-destructive measurements for the calculation of the radial amorphous layer-thickness profiles of the irradiated spots using a two-layer thin-film model (Silicon dioxide and amorphous Silicon on a crystalline Silicon substrate). The measurements further allowed for the analysis of the oxide-layer modifications induced by the laser treatment. The results of the SIE-calculations were cross-checked by an in-depth material lamella via HRTEM and STEM-EDX.
Outline
- maging ellipsometry: oncept and setup
- Basic theory: ellipsometry on tilted/curved surfaces
- Geometric considerations
- Tilt-induced cross-polarization
- Application: coating analysis on microlensarray
- Mueller-Matrix Imaging
- Conversion to Delta-Psi Image
- Layer-thickness of ITO coating
Morphology and structure of TixOy nanoparticles generated by femtosecond laser ablation in water
(2018)
In this work femto-second pulsed laser ablation in liquid (PLAL) procedure for the generation of titanium oxide nanoparticles (NP) is reported with the purpose of understanding morphology and structure of the newly generated NPs. Ablation duration was varied for optimization of NP generation processes between 10 and 90 min. Surface morphology of NPs as well as their size and shape (distribution) were analysed by various complementary electron microscopy techniques, i.e. SEM, TSEM and TEM. The crystalline structure of titanium oxide particles was investigated byXRD(two instruments operated in different geometries) and HR-TEM. Concentration of generated titanium oxide NPs in liquid was analysed by ICP-MS. A mix of crystalline (mainly anatase), partly crystalline and amorphous spherical titanium oxide NPs can be reported having a mean size between 10 and 20 nm, which is rather independent of the laser ablation (LA) duration. A second component consisting of irregularly shaped, but crystalline titanium oxide nanostructures is co-generated in the LA water, with more pronounced occurrence at longer LA times. The provenance of this component is assigned to those spherical particles generated in suspension and passing through the converging laser beam, being hence subject to secondary irradiation effects, e. g. fragmentation.
A femto-second pulsed laser ablation in liquid (PLAL) procedure for the generation of titanium oxide nanoparticles (NP) is reported with the purpose of understanding morphology and structure of the newly generated NPs. Ablation duration was varied for optimization of NP generation processes between 10 and 90 min. Surface morphology of NPs as well as their size and shape (distribution) were analysed by various complementary electron microscopy techniques, i.e. SEM, TSEM and TEM. The crystalline structure of titanium oxide particles was investigated by XRD(two instruments operated in different geometries) and HR-TEM. Concentration of generated titanium oxide NPs in liquid was analysed by ICP-MS. A mix of crystalline (mainly anatase), partly crystalline and amorphous spherical titanium oxide NPs can be reported having a mean size between 10 and 20 nm, which is rather independent of the laser ablation (LA) duration. A second component consisting of irregularly shaped, but crystalline titanium oxide nanostructures is co-generated in the LA water, with more pronounced occurrence at longer LA times. The provenance of this component is assigned to those spherical particles generated in suspension and passing through the converging laser beam, being hence subject to secondary irradiation effects, e. g. fragmentation.
Im Fokus des Vorhabens steht das mit dem Innovationspreis Berlin-Brandenburg 2012 ausgezeichnete Mehr-Proben-Prüfverfahren zur Festigkeitsprüfung unter Verwendung einer analytischen Zentrifuge mit dem Ziel des Einsatzes in der Qualitätssicherung. Nachdem im MNPQ-Projekt QUO VADIS die grundsätzliche Anwendbarkeit der Zentrifugentechnologie auf Beanspruchungen auf Zug (Kleb-, Haft- und Verbundfestigkeit) nachgewiesen worden war, wurden im Vorhaben QUO VADIS PLUS folgende erweiterte Prüfszenarien und technische Weiterentwicklungen etabliert: 1. Beanspruchung auf Druck (Härte von Materialien, Kompressibilität von Schäumen, Kompaktierbarkeit von Pulvern), 2. Erweiterung der Beanspruchung auf Zug (Kombination von Normal- und Lateralkräften), 3. Erweiterung auf die Bewertung plasto-elastischenn Materialverhaltens, 4. Vermeidung von Schockwellen im Hochlastbereich
Auf dem Weg zu Industrie 4.0: Bestimmung von Messunsicherheitsbudgets in der Oberflächentechnik
(2019)
Vorgestellt wurde die Bestimmung von Messunsicherheitsbudgets für sehr unterschiedliche physikalische Größen, die in der Oberflächentechnik von hoher Relevanz sind: Stufenhöhe h, Schichtdicke d, Eindringhärte HIT und Haftfestigkeit. Die Unterschiede betreffen die Art der Prüfmethodik (optisch zerstörungsfrei vs. mechanisch invasiv/zerstörend), die laterale Größe des Integrationsgebietes der Messung (lokal: nano bis sub-mikro vs. global: mikro bis makro) und die Art der Bestimmung von Messunsicherheitsbudgets (physikalische Größen: direkt rückführbar; Werkstoffkenngröße: genormt; Systemkenngröße: genormt).
Im Rahmen von Industrie 4.0 werden ausgehend der geforderten Spezifikation des beschichteten Produkts (Mittelwert mit Vertrauensbereich oder Mindestwert) durchgehende Toleranzbänder zur Oberflächenmodifizierung/Beschichtung des Substrats, einhergehend mit Prozessfenstern, die diese Toleranzbänder garantieren, erforderlich, die zuverlässig erfasst werden müssen. Die Frage der anzuwendenden Mess- und Prüftechnik und die damit notwendige Betrachtung von Messunsicherheitsbudgets ist für die Digitalisierung von Konditionierungs-, Zustands-, Regel- und Steuergrößen unverzichtbar. Mit Blick auf die Einhaltung von Prozessfenstern und die dafür notwendige Prozessführung wird technologisches Kern-Know-how digitalisiert, das es unbedingt zu schützen gilt. Nur lokale Netze können diese Sicherheit garantieren, in globalen Netzen ist die Datensicherheit bestenfalls maximierbar
MISTRAL-Müller-Matrix-basierte Identifizierung von Inhomogenitäten und strukturellen Anomalien
(2020)
Mit abbildender Ellipsometrie (imaging ellipsometry: IE) können Nanometer-Beschichtungen/ Degradationen visualisiert und bezüglich Brechungsindex n, Extinktionskoeffizient k und Schichtdicke d charakterisiert werden. Materialseitig werden lokal Homogenität und Isotropie innerhalb eines/mehrerer Bildpunkte (field of analysis: FOA) und messtechnisch global die Ebenheit der Proben bezüglich aller Bildpunkte des Messfeldes vorausgesetzt. Für die Müller-Matrix-basierte abbildende Ellipsometrie (MM-IE), die den optischen Response anisotroper Materialien in jedem Bildpunkt über die bis zu 16 Müller-Matrix-Elemente erfasst, ist dies von besonderer Relevanz. Reale Substrate sind aber oft nicht eben, können lokal Noppen/Mulden (im FOA) aufweisen oder sind global konvex/ konkav im möglichen Messfeld (field of view: FOV) gekrümmt. Diese lokalen/globalen strukturellen Anomalien des Substrats werden schon für die IE messtechnisch/modellseitig oft nicht beherrscht und sind für die MM-IE in der Wirkung auf die MM-Elemente unbekannt. Diese Defizite sollen messtechnisch bzw. modellmäßig behoben und somit die Messung lokal/global gekrümmter Oberflächen ermöglicht werden (MM-CSIE, CS curved surface).
Im Vorhaben SNELLIUS wurden in enger Zusammenarbeit der BAM mit den Firmen Accurion und SENTECH Instruments aufbauend auf der Norm DIN 50989-1 „Ellipsometrie - Teil 1: Grundlagen; Ellipsometry – Part 1: Principles“ insgesamt fünf Normenentwürfe erarbeitet, die fünf Modell-basierten Anwendungsfällen der Ellipsometrie entsprechen. Unter Berücksichtigung des neuartigen Modell-basierten Normungskonzepts wurde in den Normenentwürfen erstmals eine GUM- und DIN EN ISO/IEC 17025:2018 konforme Bestimmung bzw. Abschätzung der Messunsicherheit umgesetzt. Dies erforderte neben der textlichen Erstellung auch umfangreiche experimentelle Arbeiten bei den Firmen, Vergleichsversuche und komplementäre Modell- und Datenevaluierungen, da sowohl die verwendete ellipsometrische Hardware (unterschiedliche ellipsometrische Funktionsprinzipien) als auch die ellipsometrische Software (Modell-Randbedingungen, Fitalgorithmus) firmenspezifisch zum Teil sehr unterschiedlich sind. Hierbei mussten in einem Konsensprozess Lösungen gefunden werden, die die beiden deutschen Ellipsometer-Anbieter Accurion (Imaging-Ellipsometrie) und SENTECH Instruments (Mapping Ellipsometrie) gleichermaßen akzeptieren konnten und die zudem einen Transfer auf die Internationale Ebene (ISO Norm) ermöglichen, also vom Grundsatz her auch auf weitere Ellipsometerhersteller wie (J. A. Woollam Co., USA; SEMILAB, Ungarn; HORIBA, Japan) mit wieder anderen ellipsometrischen Funktionsprinzipien, Hard- und Softwarelösungen anwendbar sind. Die weitgehende Unabhängigkeit von ellipsometrischen Funktionsprinzipien, Hard- und Softwarelösungen wurde dadurch erreicht, dass normativ festgelegt wurde, dass die ellipsometrischen Größen PSI und DELTA im Sinne von DIN ENISO/IEC 17025 als Rohdaten fungieren.
Der Vortrag widmet sich der „ELLIPSOMETRISCHE KLASSIFIZIERUNG VON KOHLENSTOFFSCHICHTEN“ und beschreibt die Punkte: 1. Anwendungen Kohlenstoffschichten–Carbon–based films (DLC) aus dem Vortrag N. Ohtakeet. al. (ISO TC 107, Tokyo 2017),2. Präparation der Kohlenstoffschichten für ISO TC 107 Ringversuch aus Vortrag M. Hiratsuka et. al. (ISO TC 107, Tokyo 2017), 3. Ellipsometrische Charakterisierung von Kohlenstoffschichten, Ergebnisse des Ringversuchs (ISO TC 107, Tokyo 2017) Vortrag Beck et. al. und 4.Deutsche Normungsaktivitäten national/international zur Ellipsometrie DIN NA 062-01-061 (DIN 50989-1)/TC 107 (PWI DE)“ im Einzelnen.
The paper addresses “WHITE LIGHT INTERFERENCE MICROSCOPY, ELLIPSOMETRY, AND INSTRUMENTED INDENTATION TESTING AS REFERENCE PROCEDURES“ and is subdivided in the following sections: 1. Measurement vs. testing vs. reference procedures, 2. White light interference microscopy (WLIM) for determination of step height h, 3. Spectroscopic ellipsometry (SE) for determination of layer thickness d and 4. Instrumented indentation testing (IIT) for determination of indentation hardness HIT. The following points are discussed in more detail: methodology of measurement and testing, uncertainty budgets for direct (WLIM), model-based (SE) and formula-based (IIT) reference procedures by means of specific examples. It is shown that standardization efforts are connected to reference procedures.
Mit der Zentrifugentechnologie ist seit einigen Jahren ein neuartiges Mehr-Proben-Prüf-verfahren auf dem Markt etabliert, welches die klassische Zugprüfung in den Trommelrotor einer Tischzentrifuge überträgt. In der Beanspruchung auf Zug ist die Prüfung der Verbundfestigkeit mittels CAT-Technologie (centrifugal adhesion testing) an der BAM seit 2017 nach DIN EN ISO/IEC 17025 akkreditiert, wobei die Verbundfestigkeit von Klebungen direkt bestimmt wird und in Abhängigkeit von den Versagensformen Rückschlüsse auf die Klebfestigkeit von Klebstoffen/Klebebändern oder die Haftfestigkeit von Beschichtungen gezogen werden können.
Imaging of surfaces regarding topographical, morphological, micro-structural, and chemical features is a key requirement for quality control for the identification of contaminated, degraded, damaged or deliberately modified surface areas vs. clean, virgin, undamaged or unmodified regions. As optical functions may represent any of these changes on the micro- and nano-scale, imaging ellipsometry (IE) is the technique of choice using either intensity, phase, or/and amplitude contrast for visualization of low-contrast surface modifications [1, 2]. Defects or surface and film features whether native or artificial, intended or unintended, avoidable or unavoidable as well as surface pattern are of interest for quality control. In contrast to microscopic techniques operated at normal incidence, ellipsometry as oblique-incidence technique provides improved contrast for vertically nano-scaled add-on or sub-off features such as ultra-thin transparent films, metallic island films, carbon-based thin films, laser modification or laser induced damage, dried stain, cleaning agent or polymeric residue. Two-sample reference techniques, i.e. referenced spectroscopic ellipsometry (RSE) may further increase sensitivity and decrease measurement time. In case of particulate accumulations depolarization contrast imaging (DCI) may improve the lateral resolution beyond the Abbe limit. This has been proven for silica spheres as reference in terms of single particles, particulate accumulations or particulate monolayers and layer stacks. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were used for reference measurements of particle diameter, particle height, or particulate layer/accumulation thickness. It has been shown that single silica particles of 250 nm in diameter, i.e. at least a factor of 4 better than the lateral resolution limit as of now, can be visualized on even substrates. However, the ellipsometric measurement of particle diameters of this size needs further efforts interpretation.
The application of PVD-coatings ranges from mechanical engineering, i.e. thicker tribological coatings, to precision optics, i.e. thinner optical coatings. For physical vapor deposition (PVD) technologies such as evaporation, sputtering, ion beam assisted/driven deposition, vacuum is a prerequisite for two reasons: at first process-related ones (evaporation source, plasma discharge, and mean free path) and at second coating-related ones (pure, perfect, and dense films). Usually, the goal is a homogenous coating of defined stoichiometry and micro-structure without any imperfection.
However, the implementation of micro- or nano-particles may occur accidentally or delibe-rately. Independent of the particle origin, there are two fundamental rules regarding coating functionality: at first, the larger the particle diameter to coating thickness ratio the more affected the functionality of the coating, and at second, the larger the material contrast in terms of the functional feature of interest the more affected the coating performance. Hence, embedded particles have to be avoided for the majority of thin films by all means. The unintended implementation of particles usually results in a malfunction of the coating from the beginning or is at least considered as a weak point of the coating creating a time-dependent defect under service conditions. The intended implementation of particles on surfaces and in coatings may create add-on features, topographic ones and functional ones, however, the facts mentioned hold true.
Examples of particle-initiated coating defects are demonstrated in dependence on the origin and the field of application. Strategies for deliberate attachment/embedding of particles on surfaces/in coatings are discussed regarding process compatibility and coating integrity. For industrial applications, both the validation of process compatibility of particle injection and the plasma resistance of particles under vacuum and plasma conditions have to be confirmed. Further points of interest are the homogeneity of particle distribution and the avoidance of particle agglomeration which is still a crucial point for dry dispersed particles. So far, technical applications are limited to PVD hybrid coatings, plasma dispersion coatings are still a challenge except for applications where homogeneity is not required as in case of product authentication.
Multi-functional coatings are a key requirement for surface engineering. General demands are adhesion and long-term stability under service conditions. The modification of surfaces by means of PVD-, ECD- or hybrid processes allows an add-on functionalization of surfaces by a huge diversity of materials with both lateral and vertical micro-/nano-designs. This fact is a prerequisite for micro- and sensor-systems in lab-on-chip and sensor-on-chip technology. Two layer-based sensor principles are presented, i.e. surface plasmon resonance enhanced spectroscopic ellipsometry (SPREE) for detection of hazardous gases and magneto-optical sensors on smart-coated fiber Bragg gratings (FBG) for structural health monitoring (SHM).
The interdependence of substrate features, coating properties, and layer design is discussed firstly for gas sensitivity and selectivity of SPREE-sensors and secondly for sensitivity and selectivity of magneto-strictive coatings to mechanical strain or external magnetic fields resulting in an optical displacement of the Bragg wavelength of FBG-sensors. Moreover, generic features such long-term stability, crucial process-related fabrication conditions, and effects of operational and environmental parameters are discussed with respect to the sensor performance. It has been shown that appropriate layer design and adapted selection of layer materials (SnOx/Au, Fe/Ni:SnOx/Au; Ni/NiFe-Cu-Cr) result in improved sensor parameters and may enable new sensor applications.
The talk addresses the STANDARDIZATION OF ELLIPSOMETRY and the following points are discussed in more detail: historical background of ellipsometry, history of International Conferences on Ellipsometry, Workshops Ellipsometry in Germany and Europe, information on German/European Working Group Ellipsometry, technical/industrial importance of ellipsometry, applications on non-ideal material systems and standardization activities on ellipsometry.
Sufficient adhesion/tensile strength are basic requirements for any coating/composite material. For coatings, adhesive strength in N/mm2 is of Major interest for various applications such as decorative and water-repellent coatings on wood (paints and varnishes), optical coatings on glass and polymers (reflectors and filters), electrical coatings on semiconductors, glass and polymers (conducting and bondable layers), mechanical coatings on metals and polymers (wear-reduction, scratch-resistance) and adhesion-promoting layers. For composite materials, tensile strength in N/mm2 is also a key quantity for carbon fiber reinforced composites (CFC), laminates and adhesive-bonded joints. Centrifugal adhesion testing (CAT) transfers the single-sample tensile test from a tensile or universal testing machine into an analytical centrifuge as multiple-sample test of up to eight test pieces. The one-sided sample support instead of a two-sided sample clamping and the absence of mounting- and testing-correlated shear forces provides fast and reliable results both for adhesive strength and bonding strength by means of bonded test stamps. For bonding strength, the evaluation of failure pattern from microscopic inspection is required in order to determine the failure pattern according to ISO 10365 such as adhesive failure (AF), delamination failure (DF) and cohesive failure (CF). Hence, one test run by CAT-technology provides either statistics or ranking of up to eight samples at once. For adhesive strength of coatings, a variety of examples is discussed such as ALD-Al203 layers as adhesion promoters, evaporated Ag-layers on N-BK7 glass, sputtered Cr- and Al-layers on Borofloat 33 glass, evaporated Au-films on N-BK7 glass and sputtered SiO2 -layers on CR39 Polymer. Provided adhesive or bonding strength are high enough, the substrate or the joining part may also fail.
Der Vortrag widmet sich der „Zentrifugentechnologie zur statistischen Untersuchung von Stumpfklebungen“ und beschreibt drei wesentlich verschiedene Realsysteme (Fügefläche 1/Klebstoff/ Fügefläche 2), um die Statistik ZPM (wiederholte Ein-Proben-Prüfung) vs. CAT (Mehr-Proben-Prüfung) zu vergleichen. Dazu wurden drei unterschiedliche Klebstoff-klassen mit typischen Fügeteilmaterialkombinationen ausgewählt und in einem Vorversuch mit jeweils 3 unterschiedlichen Prüfgeschwindigkeiten sowohl im Weg-geregelten als auch Kraft-geregelten Mode beansprucht. Die Ergebnisse ZPM vs. CAT und Kraft- vs. Weg-Regelung des Vorversuches zeigten keinerlei Unterschiede auf. Im Ergebnis wurde ein Ringversuch im Kraft-geregelten Mode (6xZPM vs. 8xCAT) für ein Referenzsystem durchgeführt, der nachwies, dass die CAT-Technologie statistisch relevante Prüfergebnisse zur Klebfestigkeit bereitstellt. Es zeigte sich, dass für zwei ZPM-Teilnehmer im Vertrauensbereich 99% statistisch signifikant etwas kleinere Werte der Klebfestigkeit bestimmt wurden, was auf geringfügige Abweichungen von der axialen Ausrichtung des eingespannten Prüflings bei der Ein-Proben-ZPM-Zugprüfung zurückgeführt wird.
Mechanische, topometrische und optische Charakterisierung von Schichten mit Stand der Normung
(2019)
Der Vortrag „MECHANISCHE, TOPOMETRISCHE UND OPTISCHE CHARAKTERISIERUNG VON SCHICHTEN MIT STAND DER NORMUNG“ widmet sich unterschiedlichen Beschichtungssystemen und deren mechanischer, topometrischer und optischer Charakterisierung. Über die entsprechenden aktuellen Normen wird informiert. Es betrifft Verfahren wie die Instrumentierte Eindringprüfung (IIT), Centrifugal Adhesion Testing, Weißlichtinterferenzmikroskopie, Tastschnittverfahren und Ellipsometrie (SE).
Der Vortrag gibt den aktuellen Stand der Normung im Bereich der Oberflächentechnik insbesondere der Oberflächenanalytik und der Oberflächenmess- und -prüftechnik wider. Vorgestellt wird der Status technischer Berichte, Normenentwürfe und Normen u.a. zur Bewertung von Auflösung und Schärfe mit strahlbasierten Methoden im Nanometer- und Mikrometerbereich, zur Messung von Schichtdicken und Nanopartikeln in kritischen Dimensionen einschließlich Größen- und Formverteilungen mittels REM, zur Messung der Schichtdicke von Nanomaterialien und zur Klassifizierung von Kohlenstoffschichten mittels Ellipsometrie, zur Standardisierung der Ellipsometrie, zur Kalibrierung von Konfokalmikros-kopen für die Formmessung, zur linear elastisch dynamischen instrumentierten Eindringprüfung, zur Messung der flächenbezogenen Masse mittels AAS und ICP, zur Schichtpotentialmessung von Mehrfach-Nickelschichten, zur Schichtdicken und Flächen-widerstandsbestimmung sowie zur Bestimmung der Schichthaftung mittels Zentrifugentechnologie.
Der Vortrag gibt den aktuellen Stand der Normung im Bereich der Oberflächen-technik insbesondere der Oberflächenanalytik und der Oberflächenmess- und -prüftechnik wider. Vorgestellt wird der Status technischer Berichte, Normenentwürfe und Normen u.a. zur Charakterisierung von funktionellen Glasoberflächen für bioanalytische Anwendungen, zur Messung der Schichtdicke von Nanomaterialien mittels Ellipsometrie, zur Kalibrierung von Interferometern und Interferenzmikroskopen für die Formmessung, zur Rockwelleindringprüfung zur Bewertung der Schicht-haftung, zu den Grundlagen der Ellipsometrie, zur Messung der Schichtdicke mittels Wirbelstromverfahren, zur Schichtpotentialmessung von Mehrfach-Nickelschichten, zu Filtern und Augenschutzgeräten gegen Laserstrahlung sowie zur Bestimmung der Schichthaftung mittels Zugversuch.
Up until several years ago, tensile and compressive tests have been exclusively carried out as single-sample tests within a tensile, hardness or universal testing machine. The availability of centrifuge technology changed this situation in 2013 in several ways because centrifugal force is used as testing force within a rotational reference frame.
Firstly, multiple-sample strength testing became feasible for both tensile load condi-tions, e.g. determination of composite, bonding or adhesive strength, and compressive load conditions, e.g. hardness, compressibility and compactibility. Secondly, there is no need for a two-sided sample clamping and double-cardanic suspensions as samples are simply inserted using a one-sided sample support. Thirdly, shear forces can be avoided by means of guiding sleeves which steer test stamps acting as mass bodies for either tensile or compressive testing. Fourthly, up to eight samples can be tested under identical conditions within a very short period of time, typically within 15 minutes including sample loading and unloading. Hence, either a reliable statistics (of identical samples) or a ranking (of different samples) can be derived from one test run.
The bench-top test system is described in detail and demonstrated that centrifugal force acts as testing force in an appropriate way because Euler and Coriolis force do not affect the testing results. Examples for both tensile strength testing, i.e. bonding strength of adhesives-bonded joints and adhesive strength of coatings, and compres-sive strength testing, i.e. Vickers-, Brinell- and ball indentation hardness and deter-mination of spring constants, are presented, discussed and compared with conven-tional tests within tensile, hardness or universal testing machines.
At present, a maximum testing force of 6.5 kN can be realized which results at test stamp diameters of 5 mm, 7 mm, and 10 mm in tensile or compressive stress values of 80 MPa, 160 MPa, and 320 MPa. For tensile strength, this is already beyond bonding strength of cold- and warm-curing adhesives. Moreover, centrifuge technology is compliant to standards such as EN 15870, EN ISO 4624, EN ISO 6506/6507 and VDI/VDE 2616. Programmable test cycles allow both short-term stress and log-term fatigue tests. Based on a variety of examples of surface and bonding technology, applications in both fields R&D and QC are presented. Meanwhile, centrifuge technology is also accredited according to DIN EN ISO/IEC 17025.
Bonding strength is crucial on polymers of low surface energy, for clean surfaces limited to 0.5, 1, and 2 MPa for PTFE, PP, and PE. Plasma treatment may improve bonding strength by a factor of 2 (PTFE) or 5 (PP and PE). The efficiency of treatment is usually 10% as both low pressure and atmospheric pressure processes show low topographic conformity.
Besides, lifetime of activation/modification is rather short. Hence, bonding has to be carried out immediately after plasma treatment.
The concept of plasma-assisted ALD (atomic layer deposition) interlayers was introduced in the project HARFE of SENTECH (modification/deposition/in-situ monitoring) and BAM (bonding, characterization, testing). ALD deposition has a high surface conformity and for dielectric films of Al2O3 also a good long-term stability given that the films are dense enough.
Based on TMA and O2/O3 precursors, ALD layer stacks from 60 to 375 monolayers were prepared under different conditions. For a transfer time of 24 hours from deposition to measurement, bonding strength could be increased up to 5 MPa (PTFE) respectively 10 MPa (PP, PE). The huge potential of ALD layers as adhesive interlayers was demonstrated for Al2O3 on stainless steel with bonding strength beyond 15 MPa, i.e. interface
strength within the ALD stack is also in this range.
This is a prerequisite for subsequent PVD/CVD-deposition in hybrid systems. By means of the SI ALD LL system of SENTECH thermal and plasma-supported ALD processes can be alternatively realized.
Ellipsometric in-situ monitoring provides monolayer sensitivity and reveals that the efficient bonding of the lower ALD layers on the polymer has to be further improved. Testing of bonding strength was realized by CAT (centrifugal adhesion testing) technology. It was shown that ALD modification correlates with the increase of surface energy and bonding strength.
Transparent conductive oxide (TCO) films are a vital part of a large part of modern technology. The production of TCO materials has sparked much development in plasma coating technology. Quality control measurements of these layers are therefore important in many fields of optics and electronics such as high efficiency thin film photovoltaics. In this presentation, we report on optical measurements of ZnSnOx layers generated by DC/RF magnetron plasma co-sputtering. By changing the respective power on two different targets, the overall power, the gas composition and post-treatment, the properties of this type of layers can be varied in a number of parameters. The optical, electrical, and chemical properties of TCO layers are the technically most important properties together with the layer thickness. The dielectric function of layers is accessible by means of spectroscopic ellipsometry, which also yields the very important value for the layer thickness at the same time. It would be a significant step forward in quality control to use this non-destructive method also as a fast test for electrical properties. Therefore, we report on the optical properties connected to the production parameters, and also on our preliminary results connecting the optical dielectric function (in the visible and near infrared) to the electrical conductivity of the layers. We discuss the effect of deposition parameters on the optical properties of the layers and present an approach for correlating optical and electrical properties. Further, we discuss the question of accuracy of optical properties gained from model-fit-based optical methods and the use of different parameterised models for the dielectric function to achieve this.
The paper addresses the “State-of-the-Art in Multiple-Sample Evaluation of Adhesive and Bonding Strength” and the following points are discussed in more detail:
1. Motivation (coatings, varnishes, tapes, laminates, CFRP, adhesive-bonded joints)
2. Conventional single-sample testing (evaluation of adhesive and bonding strength; failure pattern)
3. Multiple-sample handling (MSH), bonding (MSB), and testing: centrifugal adhesion testing (CAT) (multiple-sample approach, tensile test within a centrifuge)
4. Application examples of CAT-Technology™ (laminates, optical coatings, CFRP joints)
Finally, a summary is given regarding status quo and benefits of CAT-technology under tensile stress conditions whereas examples of testing in a centrifuge under compressive stress conditions are mentioned in the outlook.
Der Vortrag widmet sich der „CAT-TECHNOLOGIE ZUR BESTIMMUNG DER HAFTFESTIGKEIT DÜNNER SCHICHTEN“ und beschreibt die Punkte „Motivation –CAT-Technologie“ (CAT: Centrifugal Adhesion Testing) und die „Haftfestigkeit von Schichten“, (Ag-Schichten auf N-BK7 Glas, Cr- und Al-Schichten auf Borofloat 33 Glas, Au-Schichten auf N-BK7 Glas und SiO2-Schichten auf CR39 Polymer) im Einzelnen.
Der Vortrag widmet sich der „ CAT-TECHNOLOGIE ZUR BESTIMMUNG DER KLEBFESTIGKEIT“ und beschreibt die Punkte „Motivation –CAT-Technologie (Centrifugal Adhesion Testing), Klebfestigkeit ( Materialscreening verschiedener Werkstoffklassen, Klebstoffscreening fürV2A gegenV2A als Referenz, Klebstoffscreening für Niedrigenergie-Polymere und Oberfächenmodifizierung von Niedrigenergie-Polymeren) und Verbundfestigkeit (“Stirnabzug vs. Zug-Scher-Prüfung an CFK) im Einzelnen.
The oxides, hydroxides, and oxo-hydroxides of iron belong to the most abundant materials on earth. They also feature a wide range of practical applications. In many environments, they can undergo facile phase transformations and crystallization processes.
Water appears to play a critical role in many of these processes. Despite numerous attempts, the role of water has not been fully revealed yet. We present a new approach to study the influence of water in the crystallization and phase transformations of iron oxides.
The approach employs model-type iron oxide films that comprise a defined homogeneous nanostructure. The films are exposed to air containing different amounts of water reaching up to pressures of 10 bar. Ex situ analysis via scanning electron microscopy, Transmission electron microscopy, selected area electron diffraction, and X-ray diffraction is combined with operando near-ambient pressure X-ray photoelectron spectroscopy to follow water-induced changes in hematite nd ferrihydrite. Water proves to be critical for the nucleation of ematite domains in ferrihydrite, the resulting crystallite orientation, and the underlying crystallization mechanism.