5 Werkstofftechnik
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Low-temperature co-fired ceramics (LTCC) are used to fabricate robust multilayer circuits. Typically, thick-film technology is applied for metallization. For specific sensor applications, thin films are deposited directly on the as-fired LTCC-surface. These deposited thin films are structured either by lift-off or by etching. The latter is less error-prone and thus preferred in industry provided the selected materials allow it.
200 nm Ni-thin films were deposited on three different commercial constrained-sintered LTCC (CT708, CT800 and DP951) by electron beam physical vapour deposition. The thin-films were structured by covering corresponding sections with a UV-curable photo resisn and subsequent etching of the uncovered surface, leaving behind the desired structure. The etched Ni-thin film showed high difference in failure rate and sheet resistance regarding the used LTCC-material. DP951 had the lowest sheet resistance and no failure, whereas the CT800 had a failure rate of 40 %. The LTCC with high failure rate showed a strong chemical attack by the used etching medium. To address this phenomenon, the chemical resistance of the three different commercial LTCC (CT708, CT800 and DP951) against four different commonly used etching media (sulphuric acid, phosphoric acid, aqua regia, and hydrofluoric acid) is investigated. The dissolved ions are analyzed by ICP-OES to correlate the LTCC-composition and its chemical resistance.
Destructive and non-destructive 3D-characterization of inner metal structures in ceramic packages
(2023)
Ceramic multilayer packages provide successful solutions for manifold
applications in telecommunication, microsystem, and sensor technology. In such packages, three-dimensional circuitry is generated by combination of structured and metallized ceramic layers by means of tape casting and multilayer technology. During development and for quality assurance in manufacturing, characterization of integrity, deformation, and positioning of the inner metal features is necessary.
Visualization with high resolution and material contrast is needed.
Robot-assisted 3D-materialography is a useful technique to characterize such multimaterial structures. In that, many sections of the specimen are polished and imaged automatically. A three-dimensional representation of the structure is created by digital combination of the image stack. A quasi non-destructive approach is to perform X-ray computer tomography (CT) with different beam energies. The energies are chosen to achieve a good imaging of either the metal features, or the ceramic matrix of the structure. The combination of the respective tomograms results in a high contrast representation of the entire structure. Both methods were tested to characterize Ag and Ag/Pd conductors in a ceramic multilayer package. The results were compared in terms of information content, effort, and applicability of the methods.
Oxide thermoelectric semiconducting materials like p-type calcium cobaltite Ca3Co4O9 are investigated as oxidation- and temperature-resistant thermoelectric materials for thermoelectric generators (TEGs). To realize TEGs in planar film technology, the powder aerosol deposition (PAD) method is emerging recently. PAD is a method to obtain dense ceramic films directly from the synthesized starting powders without a subsequent high temperature step.
In the present work, Ca3Co4O9 (CCO) powders are processed by PAD to ceramic films at room temperature. The thermoelectric properties of the films (film thickness 10 – 20 µm) are characterized from room temperature to 900°C. Additionally, the layer morphology and texture of the films will be investigated.
As result, the Seebeck coefficient of the CCO-PAD film is comparable to pressed and sintered CCO-bulk materials during the 1st heating cycle to 900°C. The morphology of the films after the thermal treatment shows strong aligned crystallites resulting in a strong texture of the films. The electrical conductivity increases strongly during the 1st heating cycle to 900°C and stays almost constant afterwards. Compared to CCO-bulks, the films provide higher electrical conductivity which could be explained by the oriented crystal growth in-plane direction of the film.
The relationship between thermoelectric properties and layer morphology as a function of thermal annealing parameters will be further investigated.
Low-temperature co-fired ceramics (LTCC) are used to fabricate multilayer circuits which are robust in harsh environments. Thick-film technology is well established for the metallization of circuit boards and microsystems. For specific sensor applications, the combination of LTCC and thin-film technology is advantageous to reach higher structure resolutions. Due to the high roughness of as-fired LTCC surfaces compared with silicon-wafers, the deposition of low-defect- films with narrowly specified properties is challenging. The deposited thin-films are structured either by lift-off or by etching. The latter is less error-prone and thus preferred in industry provided the selected materials allow it. There is spare literature about thin films on commercial LTCC comparing different material systems or sintering techniques. For developing thin-film sensors on multilayer circuits it is crucial to identify thin-film-compatible commercial LTCC material as well as the crucial surface properties. In this work we evaluate the thin-film capability of different LTCC compositions and surface qualities.
To evaluate the influence of the material composition on the thin film capability, 200 nm Ni-thin films were deposited on three different constrained-sintered LTCC (CT708, CT800 and DP951) by electron beam physical vapour deposition. The effect of surface quality was assessed by thin-film deposition on free-sintered, pressure-assisted sintered, and polished DP951. The thin-films were structured by covering corresponding sections with a UV-curable photo resin and subsequent etching of the uncovered surface, leaving behind the desired structure.
The etched Ni-thin films showed high difference in failure rate and sheet resistance regarding the used LTCC-material. DP951 had the lowest sheet resistance and no failure, whereas CT800 had a high sheet resistance and a failure rate of 40 %. These results are correlated with surface roughness of the LTCC, scanning electron micrographs of the deposited thin-films, and the chemical resistance of the LTCC against commonly used etching media. Contrary to the expectations, no correlation between roughness and thin-film capability was found. The LTCC with high failure rate showed a strong chemical attack by the used etching medium. Additionally, the adhesion of thin-films on DP951 is better than on CT708 and CT800.
Im Rahmen des 2. BAM-Akademie Info-Tages "Nano or not Nano" wurde die OECD TG 124 "Volume Specific Surface Area of Manufactured Nanomaterials" vorgestellt.
Der Vortrag beschreibt die Bestimmung der spezifischen Oberfläche von dispersen und/oder porösen Pulvern mittels Gasadsorption nach dem BET-Verfahren.
Es wird auf die Anwendbarkeit der Methode eingegangen und es werden praktische Hinweise zur Probenvorbereitung und Messung von Nanomaterialien gegeben.
The Laser-Induced Slip Casting is an additive manufacturing technology specifically developed for ceramic materials using water-based ceramic slurries. The process takes place layer-by-layer in a similar fashion as top-down vat photopolymerization, selectively consolidating each layer by means of a laser energy source positioned on the top. Contrary to vat photopolymerization, in which the consolidation is achieved by selectively cross-linking a ceramic-filled resin, LIS uses water-based slurries with a low amount of organic additives (typically < 5 wt%) as feedstocks.
In LIS, a green body is formed by local evaporation of water which causes the suspension to collapse forming a cast, following a mechanism similar to slip casting. Only a small content of organic additives is needed to effectively disperse the ceramic particles and to increase the green strength.
The technology is very versatile and can be applied to all ceramic systems that can be dispersed in water. One of the main advantages is that even dark materials such as silicon carbide can be processed without issues related to light scattering and absorption.
The presentation will discuss strengths and limitations of LIS compared to other AM technologies and will highlight the latest results for alumina and for silicon carbide ceramics.
Powder bed technologies are amongst the most successful Additive Manufacturing (AM) techniques. The application of these techniques to most ceramics has been difficult so far, because of the challenges related to the deposition of homogeneous powder layers when using fine powders.
In this context, the "layerwise slurry deposition" (LSD) has been developed as a layer deposition method enabling the use of powder bed AM technologies also for advanced ceramic materials. The layerwise slurry deposition consists of the layer-by-layer deposition of a ceramic slurry by means of a doctor blade, in which the slurry is deposited and dried to achieve a highly packed powder. Not only very fine, submicron powders can be processed with low organics, but also the dense powder bed provides excellent support to the parts built. The LSD technology can be combined with binder jetting to develop the so-called “LSD-print” process. LSD-print combines the high-speed printing of binder jetting with the possibility of producing a variety of high-quality ceramics with properties comparable to traditional processing.
The latest development of this technology shows that it is possible to print ceramic parts in a continuous process by depositing a layer onto a rotating platform, growing a powder bed following a spiral motion. The unique mechanical stability of the layers in LSD-print allows to grow a powder bed several centimeters thick without any lateral support. The continuous layer deposition allows to achieve a productivity more than 10X higher compared to the linear deposition, approaching a build volume of 1 liter/hour.
Einführungsvortrag im Rahmen der Veranstaltung der BAM-Akademie zur Anwendung der OECD TG 124 "Volume Specific Surface Area of Manufactured Nanomaterials" zu Herausforderungen bei der Granulometrie von Nanopulvern. Es werden die Einflüsse von Partikelform, Breite der Partikelgrößenverteilung und Agglomeration/ Aggregation auf das Messergebnis sowie die Vergleichbarkeit der Ergebnisse verschiedener Messverfahren dargelegt.
Im Rahmen des 2. BAM-Akademie Info-Tages "Nano or not Nano" wurde die OECD TG 124 "Volume Specific Surface Area of Manufactured Nanomaterials" vorgestellt. Der Vortrag beschreibt detailliert das Messverfahren der He-Gaspyknometrie zur Bestimmung der Skelettdichte von Pulvern und geht auf Anwendbarkeit, Besonderheiten bei Nanopulvern und wichtige Einstellparameter für die Messung ein.