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Dokumenttyp
Schlagworte
- Phenolic resin (3)
- DMA (2)
- High pressure DSC (2)
- Post curing (2)
- Reaction kinetic (2)
- DMTA (1)
- Fertigungskontrolle (1)
- Moulding compound (1)
- Post-curing (1)
- Qualitätssicherung (1)
- Schallgeschwindigkeit (1)
- Thermoset (1)
- Ultraschall (1)
- Vernetzungsreaktion (1)
Thermosetting moulding compounds are synthetic materials which can be easily formed in the molten state and achieve high temperature stability due to a cross-linking process which takes place during manufacture. To ensure thermal and mechanical properties, post-curing of moulded phenolic resin components is necessary for high quality applications. In the industrial practice, post-curing time-temperature-programs are heuristically acquired. In this paper, dynamical mechanical thermal analysis is employed to determine optimal post-curing conditions for injection moulded parts from phenolic resin.