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Eingeladener Vortrag
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New applications of low-temperature co-fired ceramics (LTCC), such as pressure sensors or integrated functional layers, require materials that possess higher coefficients of thermal expansion (CTE). To fabricate LTCC with elevated CTE, two methods of material design are examined: firstly, glass ceramic composites (GCC), which consist of >50 vol% glass in the starting powder, and, secondly, glass-bonded ceramics (GBC), where glass is added as a sintering aid only. The CTE of GBC is mainly determined by the crystalline component. For GCC, the CTE can be well predicted, if CTE and elastic data of each phase in the microstructure are known. A nonlinear characteristic of the CTE versus phase composition was found with increasing Ecrystals/Eglass ratio and absolute CTE difference between the components. The glass composition and glass amount can be used to compensate the fixed properties of a crystalline material in a desired way. However, because the CTE and permittivity of a glass cannot be chosen independently, an optimum glass composition has to be found. For a given LTCC, it is possible to control the devitrification by shifting the glass composition. In this way, the resulting CTE values can be predicted more exactly and tailoring becomes possible. Different LTCC materials, based on the crystalline compounds Ba(La,Nd)2Ti4O12, ZrO2 (Y-TZP), SiO2 (quartz), and specially developed glasses, possessing an elevated CTE of around 10 × 10-6 K-1 while showing permittivity εr between 6 and 63, are introduced.
LTCC-modules with integrated ferrite layers - Strategies for material development and co-sintering
(2008)
Sintering of LTCC
(2008)
Low Temperature Co-fired Ceramic materials (LTCC) have attracted growing interest in recent years since they are promising candidates for highly integrated ceramic packaging. This paper surveys materials concepts of related glass ceramic composites (GCC) and discusses unsolved problems and challenges. The densification of GCC based on "viscous sintering" may be affected by steric effects and partial dissolution of dispersed crystal particles, crystallization and phase boundary reactions.
The finite element method was used to simulate the thermo-mechanical behaviour of a flip chip under thermocyclic loading between -55°C (-67°F) and 125°C (257°F). In order to simulate realistically the inelastic material response of the solder bump, Chaboche's viscoplastic material model instead of a classical ORNL-theory was implemented into the finite element code ABAQUS and applied to a flip chip configuration. This so-called unified constitutive model is able to describe the Bauschinger effect as well as the creep/plasticity interaction. Herewith the influence of the substrate material on the inelastic deformation behaviour of a tin-lead solder bump was analysed. A comparison is given with respect to the influence of the two substrate materials namely Al<sub>2</sub>O<sub>3 </sub> and our self-developed Low Temperature Co-fired Ceramics (LTCC) on the inelastic response of the Sn60Pb40 eutectic solder material. It may be shown that the thermoelastic behaviour of the LTCC substrate significantly reduces the cyclic stresses in the bump compared to Al<sub>2</sub>O<sub>3</sub> as well as the cumulative inelastic strain which is responsible for the development of damage and hence flip chip failure