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- nein (3)
Platinum does not form any adherent oxides and can be easily wetted by tin-based solders. Platinum is also an available metallization in semiconductor laboratories. Therefore we investigated the diffusion of platinum thin-film metallizations into eutectic tin–lead solder by using a high-resolution secondary ion mass spectroscopy (SIMS) profiling from the back side. It is shown that an intermetallic phase (PtSn4) is formed during soldering, which controls the consumption of platinum during soldering and in operation. The consumption of platinum follows the well-known parabolic diffusion law. The activation energy of this process is 0.63 eV. Even at extended heating cycles of 2 min at 250°C, 190 nm from the original 300 nm of the platinum film remain undissolved. This high stability makes platinum a very attractive thin-film metallization for flip-chip (FC) bonding of new microsystems.
An extended model of the tension-compression asymmetry of single crystal nickel-base superalloys
(1996)
Interrupted LCF-tests at 850 deg C for Inconel 738LC have been carried out and the specimens have been intensively examined by REM to quantify the evolution of fatigue damage. Surface crack nucleation at oxidatized grain boundaries and coalescence of neighboring flaws occurred during the whole experiment. An anomalous fast single crack growth is observed just after nucleation, followed by a relative stagnation of the propagation in absence of coalescence. A statistical model is proposed that describes these pheonmena. It leads to an integro-differential equation for the crack density f(c,n) after n cycles, similar to the Bolzmann equation which describes the collision of molecules in a dilute gas.
Transmission electron microscopy study of rapid thermally annealed Pd/Ge contacts on In0.53Ga0.47As
(1996)
Phase formation in rapid thermally annealed Pd/Ge contacts on In0.53Ga0.47As has been investigated by means of cross-sectional transmission electron microscopy, convergent-beam electron diffraction, and energy-dispersive x-ray analysis. Solid-phase regrowth is observed to occur similarly as in Pd/Ge contacts on GaAs or InP. The reaction starts at low temperatures with the formation of an amorphous Pd–In–Ga–As layer, which crystallizes at elevated temperatures yielding hexagonal Pd4In0.53Ga0.47As being first described in this work. At temperatures .250 °C, this phase decomposes due to epitaxial solid-phase regrowth of In0.53Ga0.47As and formation of Pd–Ge phases. The stable composition is reached at temperatures .350 °C with excess Ge diffused through top Pd–Ge to the contact interface and growing epitaxially on the semiconductor.
TEM study on the effect of machining on the microstructure of a soft magnetic Ni76Fe17Cu5CrMo2 alloy
(1991)
The role of grain size and ferrite substructure in respect to mechanical properties of an HSLA steel
(1986)
Several heat treatments were applied to an HSLA steel on type StE460 (German standard) to produce four ferrite substructures of different strength and at least two different grain sizes respectively. Whereas the ferrite substructure has a strong influence on yield strength the effect of grain size was negligible though probably to some extent masked by different pearlite volume fractions. The different strength levels could be explained by regarding the arrangement of dislocations and vanadium carbonitride particles and their mutual interaction. Increasing both grain size and pearlite volume fraction leads to a remarkable shift of transition temperature T sub 27J which was further enhanced by increasing ferrite strength. 16 ref.--AA
Optical and electron metallography have been used to investigate the development of different microstructures in Armco Fe after rolling reductions between 0 and 90%. Simultaneously, the orientation distribution functions have been calculated from pole figures obtained by X-ray diffraction. Different stages of texture development could be assigned to typical microstructures. Strain inhomogeneities, such as microbands and shear bands, caused some broadening of the texture and a slight deviation of one skeleton line from the predicted fibre texture component. The decomposition of orientations near {111} < 121 > , and the strengthening of {211} < 011 > after high rolling reductions, was not due to mechanical twinning but could rather be explained by assuming {211} < 111 > slip. 30 ref.--AA