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The sliding behavior of an amorphous silica sample between two rigid surfaces is in the focus of the present paper. Molecular Dynamics using a classical Tersoff’s potential and a recently developed ReaxFF potential was applied for simulating sliding within a thin film corresponding to a tribofilm formed from silica nanoparticles. The simulations were performed at different temperatures corresponding to moderate and severe tribological stressing conditions. Simulations with both potentials revealed the need of considering different temperatures in order to obtain a sound interpretation of experimental findings. The results show the striking differences between the two potentials not only in terms of magnitude of the resistance stress (about one order of magnitude) but also in terms of friction mechanisms. The expected smooth sliding regime under high temperature conditions was predicted by both simulations, although with Tersoff’s potential smooth sliding was obtained only at the highest temperature. On the other hand, at room temperature Tersoff-style calculations demonstrate stick-slip behavior, which corresponds qualitatively with our experimental findings. Nevertheless, comparison with a macroscopic coefficient of friction is not possible because simulated resistance stresses do not depend on the applied normal pressure.
The method of movable cellular automata (MCA) was applied to simulate the stress-strain behavior of a nano composite consisting of an epoxy matrix and 6 vol. % silica nano particles. The size of the elements used for modelling was fixed at 10 nm, corresponding approximately to the diameter of the filler particles. Since not only the stress-strain response of the two constituents but also debonding of neighboring particles and granular flow was taken into account, plastic deformation as well as crack initiation and propagation could be simulated with the model. Modelling results were compared with tensile test results of both, pure epoxy as well as the epoxy-6 vol. % SiO2 composite. Since assuming bulk properties of the two constituents did not yield satisfactory results, slight modifications of the nanoparticle response functions and nanostructures were tested numerically. Finally, it was observed that only the assumption of slightly increased strength properties of the epoxy yielded good correlation between experimental and modelling results. This was attributed to an increased cross linking of the epoxy caused by the presence of silica nano particles.
Heat accumulation induced by a succession of railway brakings leads to changes of the friction conditions occurring in pad-disc contact. Infrared thermography observations show a progressive increase of surface temperature over the succession, as well as a modification of the hot band migration phenomenon. From a tribological point of view, the heat accumulation, accompanied by a wear increase, progressively modifies the friction behaviour from one braking to the next. Post-mortem observations of pads are performed on surface by scanning electron microscopy and in depth after Focus Ion Beam cut by scanning ion microscopy. Observations show that, with heat accumulation, the third body quantity rises inside the contact, in accordance with wear increase. It is concluded that source flows of third body, which increase with temperature, feed aplenty the contact and modify its load-bearing capacity.
Weld metal microstructure for alloy 6060 aluminum welds, made using the gas-tungsten arc process and alloy 4043 filler metal, has been characterized using optical metallography, EPMA microprobe analysis, SEM/EBSD and STEM/EDX electron microscopy, and single-sensor differential thermal analysis (SS-DTA). In addition, alloy 6060 castings were solidified at variable cooling rates approaching that of welding, to provide a reference for comparison with weld microstructure. It was found that a major change in cast microstructure occurs at cooling rates higher than 27 K/s resulting in a structure similar to that observed in weld metal. Rapid cooling is believed to favor low temperature solidification reactions that normally would be achieved only at higher silicon content. Accordingly, additions of 4043 filler metal that increase the weld metal silicon content have only limited affect on weld solidification range and microstructure. This has direct implications regarding how 4043 filler additions improve weldability and weld quality.
NM 105, Ti02 (P25) could not be ignited as dust layer and dispersed in air as dust/air-mixture as well. This dust is not dust explosible and the burning behaviour corresponds to Burning Class 1 (no Ignition). The results have shown that the tested sample is thus not combustible at all, because it is already oxidized completely.
In the past few years, it has been discussed with increasing frequency, whether cube slip does occur in gamma' hardened nickel-base superalloys. Occurrence of cube slip has consequences for the modeling of orientation dependence of the CRSS. Until now, there are only few experimental investigations.
In principle, cube slip should be possible in primitive cubic lattices (e.g. L12 ordered gamma' phase) but not in face centered cubic ones (e.g. Ni solid solution). The most favourable specimen orientations are near [111], where the Schmid factors for this type of glide exceed those for octahedral systems.
There are two basic methods to detect cube slip: macroscopic slip trace analysis and Transmission electron microscopy (TEM) investigation of the dislocation structure. Few observations of cube slip by macroscopic slip traces are reported in the literature. But it is still uncertain under which test conditions cube slip occurs and what the dislocation mechanisms are. Cube slip was observed during tensile or compression tests of several first generation superalloys, but it seems not to occur during shear creep deformation (e.g. CMSX-4 at 980°C), and it is also lacking under conventional tensile or compression loading, if the gmma' particles are small. No observations were ever reported of dislocations gliding on {001} planes in matrix channels.