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Erscheinungsjahr
- 2012 (8) (entfernen)
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- Vortrag (4)
- Zeitschriftenartikel (2)
- Beitrag zu einem Tagungsband (2)
Schlagworte
- Active thermography (2)
- Thermography (2)
- Copper (1)
- Cracks (1)
- FFT (1)
- Flash lamp (1)
- Flying spot (1)
- High-power diode lasers (1)
- Laser (1)
- Non-destructive testing (1)
Eingeladener Vortrag
- nein (4)
Impulse and lock-in thermography have been applied to detect delaminations of prototype solder joints, similar to those to be produced between Cu shunts and Cu busbar stabilisers at the Large Hadron Collider (LHC) at CERN. Two infrared cameras with different detector materials and with different spectral ranges and two excitation techniques have been tested and compared for their ability to detect delaminations behind 2 and 3 mm thick Cu shunts. We have analyzed the signal to noise ratio (SNR) for each detected defect and are able to detect defects down to a nominal edge length of 4 mm behind 2 mm thick Cu shunts by using fast impulse thermography and a camera with a microbolometer array. For the 3 mm thick Cu shunt, on the other hand, the nominal 4 mm defect is only visible in the lock-in thermography phase images and the highest SNR has been achieved with a cooled InSb-based camera. In addition, numerical simulations show the influence of the minimum detectable defect size on the shunt thickness and that the developed on-site testing technique is sufficient to find all defects that are detectable theoretically.
We report on recent developments in the detection of surface breaking cracks using
flying laser spot thermography. Application of an infrared camera for mapping the
thermal radiation after excitation with a diode laser equipped with an optical scanner
allows us to examine a surface containing cracks in an entirely non-destructive,
contactless and fast way, without even moving the camera. We developed an efficient
and robust algorithm that can be applied directly to the recorded thermal sequences,
and that derives a single image containing all crack signatures. For this crack detection
technique, no specific synchronisation between laser and camera is required. Hence,
our approach is suitable for an upgrade of existing thermographic systems. The
feasibility of the proposed procedure is proven by testing an artificial test sample and a
piece of rail that comprises roll contact fatigue cracks and by comparing the results
with magnetic particle testing.
Double-side cooled high-power diode laser bars packaged by different techniques on different types of passive heat sinks are analyzed in terms of packaging-induced strain. Reference data from standard devices being single-side cooled only and packaged by conventional soft and hard soldering are also presented. Thermal profiling across the devices complements the results. The most suitable packaging architecture and technique for double-side cooled bars is identified. Measurements of the laser emission near field and electroluminescence pattern provide direct reference to the functionality of the devices. Furthermore, a type of cross calibration of the methods used for strain analysis is made, since all techniques are applied to the same set of bars. This involves micro photoluminescence, micro Raman, and degree-of-polarization electroluminescence spectroscopy.