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Organisationseinheit der BAM
We have studied the integration of Ni-Cu-Zn ferrite spinels as well as substituted hexagonal Co2Y-and M-type ferrites into LTCC (Low Temperature Ceramic Co-firing) modules. The cofiring behavior and the magnetic properties of these materials were investigated and evaluated for multilayer applications. Ni-Cu-Zn ferrites exhibit permeabilities of µ=300–500 for operating frequencies in the MHz range. Cu-substituted Y-type ferrites Ba2Co2-x-yZnxCuyFe12O22 in combination with sintering additives display sufficient shrinkage and densification at 900°C. A permeability of µ=10 is observed; however, substituted Co2Y-type ferrites do not exhibit long-term stability at 900°C. Co/Ti-substituted M-type ferrites BaFe12-2yCoyTiyO19 (y=1.2) with planar magneto-crystalline anisotropy exhibit excellent soft magnetic behavior. Using sintering additives, complete densification is reached at 900°C and a permeability of µ=15 and a resonance frequency of larger than 1?GHz are observed. Integration of ferrite multilayer inductor components into LTCC modules using free and constrained cofiring technologies is demonstrated.
Low-κ dielectric LTCC was developed, to realize successful co-firing with NiCuZn ferrite tapes. A critical high-temperature process in the production of highly integrated LTCC modules is the migration of silver from inner conductors into the LTCC glass phase. Intensive silver migration causes strong deformation of LTCC multilayers during firing in air.
Silver migration into the LTCC glass phase depends on oxygen content of the sintering atmosphere and can be minimized by sintering in nitrogen atmosphere. However, partial decomposition of NiCuZn-ferrite and formation of cuprite was observed during sintering in nitrogen and, consequently, the permeability of the ferrite decreases. As shown by a combined XRD/thermogravimetric study the co-firing of LTCC modules with silver metallization and integrated ferrite layer demands precise adjustment of oxygen partial pressure.
The sintering behavior of sub-micron Ni0.30Cu0.20Zn0.52Fe1.98O3.99 ferrite with and without Bi2O3 addition was studied. Ferrites with 0.5 wt% Bi2O3 exhibit enhanced shrinkage at T < 900 °C with significant grain growth. Additive-free ferrite powders also sinter to high density at 900 °C, however, grain growth is very limited. Both ferrites exhibit a permeability of µ = 400–450. Multilayers consisting of ferrite and low-k dielectric LTCC layers were prepared by co-firing at 900–915 °C. The shrinkage and thermal expansion characteristics of ferrite and LTCC tapes are similar. However, the permeability of integrated ferrite layers, made from ferrite tapes with Bi2O3 additive, significantly drops after co-firing with LTCC layers compared to separately fired monolithic ferrite multilayers. Contrarily, the permeability of integrated, Bi2O3-free ferrite layers, co-fired with dielectric tapes, is identical to that of monolithic ferrite multilayers. This finding is an important step toward ferrite integration into complex LTCC multilayer architectures.
Recent advances in the development of high gauge factor thin films for strain gauges prompt the research on advanced substrate materials. A glass ceramic composite has been developed in consideration of a high coefficient of thermal expansion (9.4 ppm/K) and a low modulus of elasticity (82 GPa) for the application as support material for thin-film sensors. In the first part, constantan foil strain gauges were fabricated from this material by tape casting, pressure-assisted sintering, and subsequent lamination of the metal foil on the planar ceramic substrates. The accuracy of the assembled load cells corresponds to accuracy class C6. That qualifies the load cells for the use in automatic packaging units and confirms the applicability of the low-temperature co-fired ceramic (LTCC) substrates for fabrication of accurate strain gauges. In the second part, to facilitate the deposition of thin-film sensor structures to the LTCC substrates, pressure-assisted sintering step is modified using smooth setters instead of release tapes, which resulted in fabrication of substrates with low average surface roughness of 50 nm. Titanium thin films deposited on these substrates as test coatings exhibited low surface resistances of 850 Ω comparable to thin films on commercial alumina thin-film substrates with 920 Ω. The presented material design and advances in manufacturing technology are important to promote the development of high-performance thin-film strain gauges.
Integration of magnetic functional components in LTCC Circuit boards calls for co-firing of dielectric and ferrite tapes. Ni-Cu-Zn ferrites with permeability of p=900 were developed which can be fully densified at the Standard LTCC sintering temperature of 900 °C. Successful co-firing of this ferrite with dielectric tapes requires the adaptation of the shrinkage behavior of the materials as well as the thermal expansion during the cooling period - especially in the temperature range below the transformation point of the glassy phase of the dielectric tape. To match these preconditions, a new dielectric LTCC material with steep sintering curve and high thermal expansion coefficient was designed. Sintered multilayer composed of Ni-Cu-Zn ferrite and tailored dielectric tapes are free of cracks and possess no open porosity. No significant interdiffusion between the ferrite and dielectric tapes was found by EDX measurements. Compared to pure ferrite laminates the permeability of co-sintered Ni-Cu-Zn ferrite layers is drastically reduced to 400, i.e. a decrease of more than 50 %.
To investigate the origin of this permeability reduction, Ni-Cu-Zn ferrite laminates were sintered separately, and in combination with alumina release tapes or dielectric tapes, respectively. SEM and EDX analysis of co-fired laminates reveal differences in the ferrite grain growth behavior. Ferrite laminates with homogeneous microstructure and grain size up to 50 pm exhibit large permeability. However, growth of ferrite grains does not take place near the interface between ferrite and release or dielectric tapes. There is a strong correlation between high permeability and volume fraction of large ferrite grains. Regions of fine and coarse grains inside the ferrite layers show different bismuth concentration; the Bi-content is larger in regions of fine ferrite grains.
Further miniaturization of electronic packaging calls for integration of magnetic functional components into LTCC modules. For integration of magnetic function into LTCC, low fired MnZn- and NiCuZn-ferrites which can be fully densified at the standard LTCC sintering temperature of 900°C were developed. To co-fire these ferrite tapes with dielectric tapes the sintering shrinkage and the coefficient of thermal expansion of ferrite and dielectric tapes must be matched. For each ferrite material a new LTCC dielectric material was designed. The embedded ferrite tapes into new LTCC dielectric tapes can be sufficiently densified during co-firing at 900°C without any cracking. Compared to separately sintered ferrites the permeability of embedded ferrite tapes is reduced. For embedded NiCuZn ferrites permeabilities between 230 and 570 (at 2 MHz) according to the thickness of the embedded ferrite layer were measured. For embedded MnZn ferrites a permeability of 300 was measured.
Recent advances in the development of high gauge factor thin-films for strain gauges prompt the research on advanced substrate materials. A glass ceramic composite has been developed in consideration of a high coefficient of thermal expansion and a low modulus of elasticity for the application as support material for thin-film sensors. Constantan foil strain gauges were fabricated from this material by tape casting, pressure-assisted sintering and subsequent lamination of the metal foil on the planar ceramic substrates. The sensors were mounted on a strain gauge beam arrangement and load curves and creep behavior were evaluated. The accuracy of the assembled load cells correspond to accuracy class C6. That qualifies the load cells for the use in automatic packaging units and confirms the applicability of the LTCC substrates for fabrication of accurate strain gauges. To facilitate the deposition of thin film sensor structures onto the LTCC substrates, the pressure-assisted sintering technology has been refined. By the use of smooth setters instead of release tapes substrates with minimal surface roughness were fabricated. Metallic thin films deposited on these substrates exhibit low surface resistances comparable to thin films on commercial alumina thin-film substrates. The presented advances in material design and manufacturing technology are important to promote the development of high performance thin-film strain gauges.
Integration of magnetic functional components in LTCC circuit boards calls for co-firing of dielectric and ferrite tapes. Ni-Cu-Zn ferrites with permeability of µ = 900 were fully densified at the standard LTCC sintering temperature of 900°C. Co-firing of this ferrite with dielectric tapes requires the adaptation of the shrinkage behavior of the materials as well as the thermal contraction during the cooling period – especially in the temperature range below the transformation point of the glass phase of the dielectric tape. To match these preconditions, a new dielectric LTCC material with steep sintering curve and high thermal expansion coefficient was designed. Sintered multilayer laminates composed of Ni-Cu-Zn ferrite and tailored dielectric tapes are free of cracks and possess no open porosity. No significant interdiffusion between the ferrite and dielectric tapes was found using microprobe analysis. Pure ferrite laminates show homogeneous microstructure with large grains up to 50 µm in diameter. However, growth of ferrite grains does not take place near the interface between ferrite and release or dielectric tapes. There is a strong correlation between permeability and volume fraction of large ferrite grains. Compared to pure ferrite laminates the permeability of co-sintered Ni-Cu-Zn ferrite layers is drastically reduced to 400, that is a decrease of more than 50%.