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Organisationseinheit der BAM
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- 2 Prozess- und Anlagensicherheit (1)
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- 8 Zerstörungsfreie Prüfung (1)
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The CCQM-K148.a comparison was coordinated by the BIPM on behalf of the CCQM Organic Analysis Working Group for NMIs and DIs which provide measurement services in organic analysis under the CIPM MRA. It was undertaken as a "Track A" comparison within the OAWG strategic plan. CCQM-K148.a demonstrates capabilities for assigning the mass fraction content of a solid organic compound having moderate molecular complexity, where the compound has a molar mass in the range (75 - 500) g/mol and is non-polar (pKow < −2), when present as the primary organic component in a neat organic solid and where the mass fraction content of the primary component in the material is in excess of 950 mg/g.
Participants were required to report the mass fraction of Bisphenol A present in one supplied unit of the comparison material. Participants using a mass balance method for the assignment were also required to report their assignments of the impurity components present in the material. Methods used by the seventeen participating NMIs or DIs were predominantly based on either stand-alone mass balance (summation of impurities) or qNMR approaches, or the combination of data obtained using both methods. The results obtained using thermal methods based on freezing-point depression methods were also reported by a limited number of participants. There was excellent agreement between assignments obtained using all three approaches to assign the BPA content.
The assignment of the values for the mass fraction content of BPA consistent with the KCRV was achieved by most of the comparison participants with an associated relative standard uncertainty in the assigned value in the range (0.1 - 0.5)%.
The lead authors failed to name two collaborators as co-authors. The authors listed should include:
Miss Claudia L. Compean-Gonzalez (ORCID:
0000-0002-2367-8450) and Dr. Giacomo Ceccone (ORCID:
0000-0003-4637-0771).
These co-authors participated in VAMAS project A27, provided data that were analyzed and presented in this publication (and supporting information), and reviewed the manuscript before submission.
Thermoelectric generator (TEG) has been proved as a promising technology for directly converting heat into electricity based on Seebeck effect. On the contrary, this electricity can trigger a solid-state cooling based on conventional Peltier effect. However, these two effects induce a coupling between heat and electric flux, especially for the quantitative relationship still remaining a mystery. Here, we show experimental evidence and theoretical calculation for the coupling by monitoring transient response of fluid temperature and output power. The experimental maximum heat flow in open circuit is 1162 W at cold fluid flow rate = 0.3 m3/h and fluid temperature difference ΔTf = 70 °C, enhanced by 13% owing to heat compensation from intrinsic coupling in closed-loop circuit. Meanwhile, the measured maximum output power of TEG is 18.2 W, and subsequently decreases to 15.4 W due to the objective existence of coupling. This double-edged sword in coupling vigorously inspires the potential applications in heat-dissipation situation such as spacecraft, electronic components, photovoltaic, refrigerator and etc. Present findings open a novel avenue for manipulating heat-electricity conversion in practical engineering.
This article is an outcome of a workshop on Fatigue of Additive Manufactured Metallic Components jointly organized by the Federal Institute for Materials Research and Testing (BAM) Berlin, Germany and the National Institute of Standards and Technology (NIST) Boulder, CO, U.S.A. The aim of the workshop was a comprehensive discussion of the specific aspects of additively manufactured (AM) components in regard to failure under cyclic loading. Undoubtedly, a better understanding and the further development of approaches for damage tolerant component design of AM parts are among the most significant challenges currently facing the use of these new technologies.
This article presents a thorough overview of the workshop discussions. It aims to provide a review of the parameters affecting the damage tolerance of AM parts with special emphasis on the process parameters intrinsic to the AM technologies, the resulting defects and residual stresses. Based on these aspects, concepts for damage tolerant component design for AM are reviewed and critically discussed.
A pilot study for the thickness measurement of HfO2 films was performed by the Surface Analysis Working Group (SAWG) of the Consultative Committee for Amount of Substance (CCQM). The aim of this pilot study was to ensure the equivalency in the measurement capability of national metrology institutes for the thickness measurement of HfO2 films. In this pilot study, the thicknesses of six HfO2 films with nominal thickness from 1 nm to 4 nm were measured by X-ray Photoelectron Spectroscopy (XPS), X-ray Reflectometry(XRR), X-ray Fluorescence Analysis (XRF), Transmission Electron Spectroscopy (TEM), Spectroscopic Ellipsometry (SE) and Rutherford Backscattering Spectrometry (RBS). The reference thicknesses were determined by mutual calibration of a zero-offset method (Medium Energy Ion Scattering Spectroscopy (MEIS) of KRISS) and a method traceable to the length unit (the average thicknesses of three XRR data except the thinnest film). These reference thicknesses are traceable to the length unit because they are based on the traceability of XRR. For the thickness measurement by XPS, the effective attenuation length of Hf 4f electrons was determined. In the cases of XRR and TEM, the offset values were determined from a linear fitting between the reference thicknesses and the individual data by XRR and TEM. The amount of substance of HfO2, expressed as thickness of HfO2 films (in both linear and areal density units), was found to be a good subject for a CCQM key comparison.
To reach the main text of this paper, click on Final Report.
The final report has been peer-reviewed and approved for publication by the CCQM.