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Plane LTCC substrates can be produced in zeroshrinkage technology by pressure-assisted sintering. The application of axial pressure during sintering supports densification, enhances cofiring of different materials, and restrains deformation. However, the sintered surfaces are affected by the release tapes and by the setters used in the pressure-assisted sintering process. In this study, the effect of release tape particle size on the surface properties of sintered substrates was investigated. Moreover, the substitution of release tape by the use of a vitreous carbon setter was tested. Surface roughness and sheet resistances of metallic thin films on the respective samples were determined. It was found that the roughness of the substrates is not directly correlated with the adequacy of the surface for thin-film deposition. Compared with a freely sintered sample with an average roughness (Ra) of 0.31 μm, pressure-assisted sintering created smoother surfaces using finegrained release tapes (Ra = 0.18 μm) and rougher surfaces using coarse release tapes (Ra = 0.46 μm). Still, sheet resistances were higher on all sinter-pressed samples. The vitreous carbon setter created unusual trenched surface structures, characterized by varying roughness values and intermediate sheet resistances on the LTCCs tested.
Dielectric strength testing of ceramics is simple and yet challenging. The execution of a breakthrough voltage measurement of a given sample is fast and straightforward. ASTM D149 describes the standardized procedure. But, there are versatile effects of test conditions and sample properties that affect the result of such a measurement. As one example, ASTM D149 allows different sizes of test electrodes and does not unambiguously prescribe the condition of the electrodes. Thus, different electrode configurations are used in the field. We conducted several test series on alumina samples to comprehensively quantify the effect of test conditions and sample properties on dielectric strength results. In our study, testing of alumina substrates using different electrode configurations resulted in differences of mean values of up to 20%. Further test series on alumina focused on the effect of voltage ramp rate. The results are complemented by calculations of failure probability at different voltage levels and corresponding withstand voltage tests. We conclude that a communication and comparison of single dielectric strength values is insufficient and may be misleading. A meaningful comparison of dielectric strength studies from different sources requires a thorough consideration of test conditions.
The 5G technology promises real time data transmission for industrial processes, autonomous driving, virtual and augmented reality, E-health applications and many more. The Low Temperature Co-fired Ceramics (LTCC) technology is well suited for the manufacturing of microelectronic components for such applications. Still, improvement of the technology such as further miniaturization is required. This study focuses on the characterization of inner metallization of LTCC multilayer modules, especially on the vertical interconnect access (VIA). Critical considerations for this characterization are delamination, pore clustering in and at the edge of the VIA, deformation, and stacking offset. A LTCC multilayer consisting of a glassy crystalline matrix with silver based VIAs was investigated by synchrotron x-ray tomography (CT). The aim of this study is to propose a multitude of structural characteristic values to maximize the information gained from the available dataset. Data analysis has been done with the open source software ImageJ as well as several additional plugins. The high-resolution CT data was evaluated through 2D slices for accessibility reasons. The segmentation of all 2000 slices to assess the different regions e.g. pores, silver and glass ceramic was done by a supervised machine learning algorithm. A quantitative evaluation of shape, deformation, and porosity of the VIA with respect to its dimensions is presented and the suitability of the characterization approach is assessed.
A novel process to structure the surfaces of low temperature co-fired ceramics (LTCC) is presented. Lowered and raised structures are formed by hot-embossing with glass-like carbon molds during pressure-assisted sintering. Molding is driven by viscous flow of the LTCC glassy phase above the glass transition temperature. For accurate molding of embossments on the LTCC surface, proper filling of cavities in the glass-like carbon mold is necessary. Therefore, de-airing of the mold cavity has to be assured. Two strategies have been investigated: (i) hot-embossing at 850 °C after termination of LTCC shrinkage with de-airing through vent holes in the mold; and (ii) hot-embossing of open porous LTCC at 775 °C with dense molds, de-airing through pore channels in the LTCC, and subsequent densification by further heating to 850 °C. Circular embossments with 10 mm diameter were molded on a commercially available LTCC (Ceramtape GC, CeramTec GmbH, Marktredwitz, Germany). The sintered height was measured using optical profilometry. Image processing was used to evaluate porosity distributions in the sintered structures. The influence of embossing temperature on LTCC viscosity and mold filling behavior is discussed. Successful molding of 47 µm high raised grids and characters by hot embossing with 0.41 MPa at 775 °C and further heating to 850 °C under constant load is demonstrated. Thereby, the high potential of hot-embossing for precise structuring of LTCC surfaces is illustrated.
Glass-ceramic composite multilayer structures - modeling of densification and shrinkage mismatch
(2016)
Low temperature co-fired ceramics (LTCC) are glass-ceramic composites that are processed by tape casting and multilayer technology to create multilayer circuit boards and electronic packages for high frequency applications, microsystems, and sensors. Pressure-assisted sintering (PAS) enables the densification of LTCC without lateral shrinkage, and thereby the manufacturing of miniaturized modules with minimal shrinkage tolerances. Co-firing of LTCC with other functional ceramics facilitates the implementation of innovative module concepts. The master sintering curve model is a useful tool to supplement the empirical optimization of such sintering processes. Two applications of the model are presented. Firstly, an algorithm is deduced that allows the simulation of shrinkage mismatch in a combined multilayer structure. Based on this simulation, an optimized process for the co-firing of LTCC and ferrite is derived. Secondly, the pressure-assisted sintering of LTCC is modeled. A comprehensive description of the densification behavior of LTCC during PAS is thereby possible.
Structuring of LTCC Substrates by a Combination of Pressure-Assisted Sintering and Hot Embossing
(2015)
A novel technology for the structuring of low temperature co-fired ceramic (LTCC) surfaces is introduced. The commercial LTCC Ceramtape GC is shaped in a zero-shrinkage process by embossing a glass-like carbon mold into the softened LTCC during pressure-assisted sintering. Diverse raised and lowered structures including rings, grids, and characters were fabricated. It was found that de-airing of mold cavities is crucial for the molding of embossments. De-airing is possible through pore channels in the LTCC if embossing is performed at intermediate temperatures. The influence of LTCC viscosity on the mold filling behavior during the formation of raised structures is discussed. For accurate molding and proper densification of the LTCC, hot embossing with 0.41 MPa at 775 °C and subsequent heating under load to 850 °C is proposed. Embossing of precise, 40 µm deep circular cavities and 50 µm high raised bars and characters is demonstrated. Thereby, the high potential of the hot-embossing process for micro-patterning of LTCC is illustrated.