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Catastrophic optical damage (COD) is analyzed during single current pulse excitation of 975 nm emitting diode lasers. Power transients and thermal images are monitored during each pulse. The COD process is unambiguously related to the occurrence of a thermal flash of Plancks radiation. We observe COD to ignite multiple times in subsequent pulses. Thermography allows for tracing a spatial motion of the COD site on the front facet of the devices. The time constant of power decay after the onset of COD has values from 400 to 2000 ns, i.e., an order of magnitude longer than observed for shorter-wavelength devices.
Single-pulse tests of the catastrophic optical damage (COD) are performed for three batches of diode lasers with different gain-regions. The tests involve in situ inspection of front, rear, and side of the devices by a thermocamera. Devices with an Al-containing gain-region show COD at the front facet, as expected for strong facet heating via surface recombination and reabsorption of laser light. In contrast, Al-free devices with low surface recombination rates tend to fail at the rear facet, pointing to a different heating scenario. The high carrier density at the rear facet favors heating and COD via Auger recombination processes.
The early stages of catastrophic optical damage (COD) in 808 nm emitting diode lasers are mapped by simultaneously monitoring the optical emission with a 1 ns time resolution and deriving the device temperature from thermal images. COD occurs in highly localized damage regions on a 30 to 400 ns time scale which is determined by the accumulation of excess energy absorbed from the optical output. We identify regimes in which COD is avoided by the proper choice of operation parameters.
In dieser Arbeit wird ein kameragestütztes Verfahren zur Flying-
Spot-Thermografie vorgestellt. Die Anregung wird über einen Diodenlaser mit einem optischen Scanner realisiert. Bei der Auswertung kommt ein effizienter und robuster Algorithmus zum Einsatz, der direkt auf die mit der Kamera aufgenommene Thermografiesequenz angewendet werden kann, ohne auf eine
Synchronisation zwischen Kamera und Lasersystem angewiesen zu sein. Daher eignet sich diese Herangehensweise besonders zur Nachrüstung bestehender Thermografiesysteme.
Die prinzipielle Eignung dieser Methode wird anhand einer Messung an einem Schienenstück mit Rollkontaktermüdungsrissen gezeigt. Als Referenzverfahren werden die Magnetpulverprüfung und eine auf GMR (Giant Magnetoresistance)- Sensoren basierende Streufeldmessung herangezogen. Mit dem thermografischen Verfahren konnten sämtliche enthaltenen Fehler erkannt werden. Dabei wurden Risse im mm-Abstand getrennt nachgewiesen, was etwa der geometrischen Auflösung der eingesetzten Kamera entspricht.
Die aktive Thermografie wird in der Industrie zunehmend in verschiedenen Bereichen zur Qualitätssicherung, Zustandsdiagnose und Zustandsüberwachung eingesetzt. Bestehende Normen zur Thermografie beschreiben die Grundlagen, Geräte und Begriffe. In diesem Beitrag wird über ein Projekt berichtet, dessen Ziel die Erarbeitung einer Prüfnorm zur Blitzthermografie ist. Diese sollte neben der Auswahl geeigneter Gerätekomponenten, der Auswertungsverfahren und der Vorgehensweise bei der Prüfung auch die Beschreibung geeigneter Referenzprobekörper enthalten, die eine Bewertung der Messapparatur und eine Qualitätssicherung der Prüfung ermöglichen.
In diesem Beitrag werden die Möglichkeiten der Ortung von Fehlstellen in Cu Lötverbindungen unterhalb verschiedener Cu Blechdicken mit aktiver Thermografie demonstriert. Dabei wurden die Anregung mit Blitzlicht und die periodische Anregung mit der Lock-In Technik miteinander verglichen. Die Vor- und Nachteile der Anwendung unterschiedlicher IR-Kamerasysteme, einer gekühlten InSb-Quantendetektor IR-Kamera und einer Mikrobolometer IR-Kamera, werden dargestellt. Als objektives Kriterium wurde das SNR für unterschiedliche Fehlstellengrößen herangezogen.
The spontaneous emission of a GaAs-based tapered laser diode emitting at λ = 1060 nm was measured through a window in the transparent substrate in order to study the carrier density distribution inside the device. It is shown that the tapered geometry is responsible for nonuniform amplification of the spontaneous/stimulated emission which in turn influences the spatial distribution of the carriers starting from below threshold. The carrier density does not clamp at the lasing threshold and above it the device shows lateral spatial hole-burning caused by high stimulated emission along the cavity center.
Mechanisms and fast kinetics of the catastrophic optical damage (COD) in GaAs-based diode lasers
(2011)
COD diagram determined for a batch of broad-area AlGaAs diode lasers. The time to COD within a single current pulse is plotted versus the actual average optical power in the moment when the COD takes place. Full circles stand for clearly identified COD events (right ordinate), whereas open circles (left ordinate) represent the pulse duration in experiments, where no COD has been detected. A borderline (gray) exists between two regions, i. e., parameter sets, of presence (orange) and absence of COD (blue). This borderline is somewhat blurred because of the randomness in filamentation of the laser nearfield and scatter in properties of the involved individual devices.
We present an all-purpose crack detection algorithm for flying spot thermography which is directly applicable to a thermogram sequence without the need of any additional information about the experimental setup. A single image containing distinct crack signatures is derived in two steps. Firstly, the spatial derivative is calculated for each frame of the sequence and, secondly, the resulting data set is sorted pixel wise along the time axis. The feasibility of the proposed procedure is proven by testing a piece of rail that comprises roll contact fatigue cracks and by comparing the results with magnetic particle testing.
We report on recent developments in the detection of surface breaking cracks using
flying laser spot thermography. Application of an infrared camera for mapping the
thermal radiation after excitation with a diode laser equipped with an optical scanner
allows us to examine a surface containing cracks in an entirely non-destructive,
contactless and fast way, without even moving the camera. We developed an efficient
and robust algorithm that can be applied directly to the recorded thermal sequences,
and that derives a single image containing all crack signatures. For this crack detection
technique, no specific synchronisation between laser and camera is required. Hence,
our approach is suitable for an upgrade of existing thermographic systems. The
feasibility of the proposed procedure is proven by testing an artificial test sample and a
piece of rail that comprises roll contact fatigue cracks and by comparing the results
with magnetic particle testing.
Impulse and lock-in thermography have been applied to detect delaminations of prototype solder joints, similar to those to be produced between Cu shunts and Cu busbar stabilisers at the Large Hadron Collider (LHC) at CERN. Two infrared cameras with different detector materials and with different spectral ranges and two excitation techniques have been tested and compared for their ability to detect delaminations behind 2 and 3 mm thick Cu shunts. We have analyzed the signal to noise ratio (SNR) for each detected defect and are able to detect defects down to a nominal edge length of 4 mm behind 2 mm thick Cu shunts by using fast impulse thermography and a camera with a microbolometer array. For the 3 mm thick Cu shunt, on the other hand, the nominal 4 mm defect is only visible in the lock-in thermography phase images and the highest SNR has been achieved with a cooled InSb-based camera. In addition, numerical simulations show the influence of the minimum detectable defect size on the shunt thickness and that the developed on-site testing technique is sufficient to find all defects that are detectable theoretically.
Double-side cooled high-power diode laser bars packaged by different techniques on different types of passive heat sinks are analyzed in terms of packaging-induced strain. Reference data from standard devices being single-side cooled only and packaged by conventional soft and hard soldering are also presented. Thermal profiling across the devices complements the results. The most suitable packaging architecture and technique for double-side cooled bars is identified. Measurements of the laser emission near field and electroluminescence pattern provide direct reference to the functionality of the devices. Furthermore, a type of cross calibration of the methods used for strain analysis is made, since all techniques are applied to the same set of bars. This involves micro photoluminescence, micro Raman, and degree-of-polarization electroluminescence spectroscopy.