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Impulse and lock-in thermography have been applied to detect delaminations of prototype solder joints, similar to those to be produced between Cu shunts and Cu busbar stabilisers at the Large Hadron Collider (LHC) at CERN. Two infrared cameras with different detector materials and with different spectral ranges and two excitation techniques have been tested and compared for their ability to detect delaminations behind 2 and 3 mm thick Cu shunts. We have analyzed the signal to noise ratio (SNR) for each detected defect and are able to detect defects down to a nominal edge length of 4 mm behind 2 mm thick Cu shunts by using fast impulse thermography and a camera with a microbolometer array. For the 3 mm thick Cu shunt, on the other hand, the nominal 4 mm defect is only visible in the lock-in thermography phase images and the highest SNR has been achieved with a cooled InSb-based camera. In addition, numerical simulations show the influence of the minimum detectable defect size on the shunt thickness and that the developed on-site testing technique is sufficient to find all defects that are detectable theoretically.
Systematic errors in the evaluation of uncorrected data from thermographic lock-in measurements
(2018)
Lock-in thermography (LT) is based on the correct evaluation of phase differences between the temperature oscillations at different surface regions of the object under test during periodic heating. Since the usual heating procedures contain a DC component, the actual heating pattern achieved is not harmonic. This causes systematic deviations when phase differences are determined by means of harmonic analysis, e.g. with FFT analysis. The resulting errors depend clearly on the ratio between DC and AC amplitude, which is demonstrated at simulated and experimentally recorded temperature transients. Further experimental LT data obtained by different oscillating energy inputs showed a variety of possible shapes of transients with different DC components.