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For co-firing of MnZn-ferrite tapes and LTCC dielectric tapes, the sintering shrinkage curves and the coefficient of thermal expansion of ferrite and dielectric tapes were matched. Highly densified embedded ferrite without any cracks could be manufactured by co-firing at 900 °C in nitrogen atmosphere. However, the permeability of MnZn-ferrite co-fired between dielectric tapes is significantly reduced (µ´=100) compared to that of the separately sintered ferrite (µ´=500). Changes in the phase stability and microstructure of MnZn-ferrite were investigated to explain the permeability reduction in the embedded ferrite. It is supposed that early densification of the dielectric tapes on the top and bottom of the ferrite layer prevent the gas exchange during sintering which is necessary for (Mn,Zn)Fe2O4 spinel formation. As a result, high amount of Fe2O3 secondary phase and a Mn-rich spinel phase with low permeability remain in the embedded ferrite layer.
The sintering temperature of BaTiO3 powder was reduced to 900 °C due to the ZnO-B2O3-Li2O-Nb2O5-Co2O3 addition. Excellent densification was achieved after sintering at 900 °C for 2 h. The low sintering temperature of newly developed capacitor materials allows a co-firing with pure silver electrodes. The dielectric constant and the temperature stability of the dielectric constant are strongly correlated with the composition of the ZnO-B2O3-Li2O additives. A high dielectric constant up to 3000 and a dielectric loss less than 0.024 were measured on multilayer capacitors sintered at 900 °C with silver inner electrodes.
By addition of LiF-containing sintering additives to commercial BaTiO3 powder, more than 98% of the theoretical density was reached at a sintering temperature of 900 °C both on powder compacts and laminates. Dielectric measurements were performed on ceramic samples in the temperature and frequency ranges from -20 °C to 125 °C and from 103 to 106 Hz, respectively. High relative permittivity (εr ~ 3160) and low dielectric loss (tan δ ~ 0.014) were measured for tapes of the favoured material. The breakdown strength for tapes with a thickness of about 80 µm is 30 kV/mm. The microprobe analysis showed, that no interfacial reaction between the dielectric layer and the Ag-electrode had occurred.
The newly developed barium titanate ceramics completely densifying at 900 °C turned out to be promising for integration of buried capacitors in LTCC multilayers.