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Calcium cobaltite is one of the most promising oxide p-type thermoelectric materials. The solid-state reaction (or calcination, respectively), which is well known for large-scale powder synthesis of functional materials, can also be used for the synthesis of thermoelectric oxides. There are various calcination routines in literature for Ca3Co4O9 powder synthesis, but no systematic study has been done on the influence of calcination procedure on thermoelectric properties. Therefore, the influence of calcination conditions on the Seebeck coefficient and the electrical conductivity was studied by modifying calcination temperature, dwell time, particle size of raw materials and number of calcination cycles. This study shows that elevated temperatures, longer dwell times, or repeated calcinations during powder synthesis do not improve but deteriorate the thermoelectric properties of calcium cobaltite. Diffusion during calcination leads to idiomorphic grain growth, which lowers the driving force for sintering of the calcined powder. A lower driving force for sintering reduces the densification. The electrical conductivity increases linearly with densification. The calcination procedure barely influences the Seebeck coefficient. The calcination procedure has no influence on the phase formation of the sintered specimens.
Shrinkage measurement of miniaturized low temperature co-fired
ceramics (LTCC) samples under load typically leads to a collapsing of
the sample due to the softening of the glassy phase, which hampers
the characterization of shrinkage up to full densification. In practical
sintering processes in contrast, LTCC panels are sintered under axial
loads of up to 1 MPa without lateral shrinkage or collapsing of the
structure. To characterize the shrinkage behavior during such
processes, a measurement setup was developed, which allows for in-situ
thickness shrinkage measurements of practical, large LTCC panels
during pressure-assisted sintering in a sintering press. Using this setup,
the shrinkage behavior of two commercial LTCC tapes (GreenTape 951
and Ceramtape GC) has been measured under loads of up to 1 MPa.
No crushing of the specimens was observed and reproducible
characterization of shrinkage up to full densification has been
performed. Based on comparisons to thermomechanical analyzer
measurements in this and other studies, it is concluded that the in-situ
approach is much better suited for shrinkage characterization of LTCC
under load.
Structural Health Monitoring (SHM) is an important part of buildings surveillance and maintenance to detect material failure as early as possible and to contribute in protection of structures and their users.
The implementation of Radio Frequency Identification (RFID) sensor systems without cable connection and battery into building components offers innovative possibilities to enable long-term in-situ SHM of addressed structures, bridges. The objectives of the presented study are complete embedding of RFID sensors systems in concrete, full passive communication with the systems, at best for the whole life span of structures. One challenge for this task is the highly alkaline environment in concrete, which requires non-degrading and robust encapsulation. Further Requirements are passive communication and energy supply, appropriate antenna design, placement and fixation in concrete, and the selection and implementation of sensors and connections. The concept is to develop and optimize a simple and robust system, which meets the requirements, as well as comprehensive validation in concrete specimen and real world applications. Two different systems were developed (HF and UHF RFID, respectively).
First tasks were the implementation of analog sensors using the superposition principle for the signal adaption. Investigation of suitable materials for robust encapsulation and sensor protection against basic environments.
Four materials were investigated in pH 13 solution for 14 days
- 3D-Printer-Polymer was completely resolved
- PVC has no noticeable decrease in weight
- (VitaPro) glass filter for the sensor protector, has weight loss 2.7 %
- The epoxy resin has increased by 1.8 % due to moisture expansion
Different concrete samples were prepared for the validation of the systems.
RFID sensors were embedded in different integration depths. Investigate the energy- and data transfer through concrete, also with varying moisture content. Additionally, signal strength data was used to optimize and validate the antenna characteristics in concrete. Next steps are to guarantee a sufficient energy supply for UHF RFID systems embedded in different concrete mixtures and further embedding the HF and UHF RFID systems in real bridges and buildings to validate the long term monitoring.
Structuring of LTCC substrates by a combination of pressure-assisted sintering and hot-embossing
(2015)
A novel technology for the structuring of LTCC surfaces is introduced. The material is shaped in a zero-shrinkage process by embossing a glassy carbon mold into the softened LTCC directly after termination of the shrinkage. Three commercially available LTCC compositions (Ceramtape GC, Heratape CT707, and DP951) were tested. Diverse raised and lowered structures including rings, grids, and characters were fabricated. Different material behavior was observed for the tested compositions. Promising results were achieved with Ceramtape GC. Embossing of precise, 40 µm deep circular cavities and 50 µm high raised characters is demonstrated. Processing of 100 × 100 mm² substrates is possible. DP951 showed very good moldability, but also unwanted material displacement due to evaporating lead. A high displacement capacity but uneven heights of embossed structures were observed on CT707 samples. SEM investigations proved the precise transfer of surface contours from the mold to the LTCC. Thereby, the high potential of the hot-embossing process for micro-patterning of LTCC is illustrated.
Glass-ceramic composite multilayer structures - modeling of densification and shrinkage mismatch
(2016)
Low temperature co-fired ceramics (LTCC) are glass-ceramic composites that are processed by tape casting and multilayer technology to create multilayer circuit boards and electronic packages for high frequency applications, microsystems, and sensors. Pressure-assisted sintering (PAS) enables the densification of LTCC without lateral shrinkage, and thereby the manufacturing of miniaturized modules with minimal shrinkage tolerances. Co-firing of LTCC with other functional ceramics facilitates the implementation of innovative module concepts. The master sintering curve model is a useful tool to supplement the empirical optimization of such sintering processes. Two applications of the model are presented. Firstly, an algorithm is deduced that allows the simulation of shrinkage mismatch in a combined multilayer structure. Based on this simulation, an optimized process for the co-firing of LTCC and ferrite is derived. Secondly, the pressure-assisted sintering of LTCC is modeled. A comprehensive description of the densification behavior of LTCC during PAS is thereby possible.
Structuring of LTCC Substrates by a Combination of Pressure-Assisted Sintering and Hot Embossing
(2015)
A novel technology for the structuring of low temperature co-fired ceramic (LTCC) surfaces is introduced. The commercial LTCC Ceramtape GC is shaped in a zero-shrinkage process by embossing a glass-like carbon mold into the softened LTCC during pressure-assisted sintering. Diverse raised and lowered structures including rings, grids, and characters were fabricated. It was found that de-airing of mold cavities is crucial for the molding of embossments. De-airing is possible through pore channels in the LTCC if embossing is performed at intermediate temperatures. The influence of LTCC viscosity on the mold filling behavior during the formation of raised structures is discussed. For accurate molding and proper densification of the LTCC, hot embossing with 0.41 MPa at 775 °C and subsequent heating under load to 850 °C is proposed. Embossing of precise, 40 µm deep circular cavities and 50 µm high raised bars and characters is demonstrated. Thereby, the high potential of the hot-embossing process for micro-patterning of LTCC is illustrated.
A novel process to structure the surfaces of low temperature co-fired ceramics (LTCC) is presented. Lowered and raised structures are formed by hot-embossing with glass-like carbon molds during pressure-assisted sintering. Molding is driven by viscous flow of the LTCC glassy phase above the glass transition temperature. For accurate molding of embossments on the LTCC surface, proper filling of cavities in the glass-like carbon mold is necessary. Therefore, de-airing of the mold cavity has to be assured. Two strategies have been investigated: (i) hot-embossing at 850 °C after termination of LTCC shrinkage with de-airing through vent holes in the mold; and (ii) hot-embossing of open porous LTCC at 775 °C with dense molds, de-airing through pore channels in the LTCC, and subsequent densification by further heating to 850 °C. Circular embossments with 10 mm diameter were molded on a commercially available LTCC (Ceramtape GC, CeramTec GmbH, Marktredwitz, Germany). The sintered height was measured using optical profilometry. Image processing was used to evaluate porosity distributions in the sintered structures. The influence of embossing temperature on LTCC viscosity and mold filling behavior is discussed. Successful molding of 47 µm high raised grids and characters by hot embossing with 0.41 MPa at 775 °C and further heating to 850 °C under constant load is demonstrated. Thereby, the high potential of hot-embossing for precise structuring of LTCC surfaces is illustrated.
Recent advances in the development of high gauge factor thin films for strain gauges prompt the research on advanced substrate materials. A glass ceramic composite has been developed in consideration of a high coefficient of thermal expansion (9.4 ppm/K) and a low modulus of elasticity (82 GPa) for the application as support material for thin-film sensors. In the first part, constantan foil strain gauges were fabricated from this material by tape casting, pressure-assisted sintering, and subsequent lamination of the metal foil on the planar ceramic substrates. The accuracy of the assembled load cells corresponds to accuracy class C6. That qualifies the load cells for the use in automatic packaging units and confirms the applicability of the low-temperature co-fired ceramic (LTCC) substrates for fabrication of accurate strain gauges. In the second part, to facilitate the deposition of thin-film sensor structures to the LTCC substrates, pressure-assisted sintering step is modified using smooth setters instead of release tapes, which resulted in fabrication of substrates with low average surface roughness of 50 nm. Titanium thin films deposited on these substrates as test coatings exhibited low surface resistances of 850 Ω comparable to thin films on commercial alumina thin-film substrates with 920 Ω. The presented material design and advances in manufacturing technology are important to promote the development of high-performance thin-film strain gauges.