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Paper des Monats
- ja (3)
The formation of nearly wavelength-sized laser-induced periodic surface structures (LIPSS) on
single-crystalline silicon upon irradiation with single (N = 1) and multiple (N ≤ 1000) linearly
polarized femtosecond (fs) laser pulses (pulse duration τ = 130 fs, central wavelength λ = 800 nm)
in air is studied experimentally. Scanning electron microscopy (SEM) and optical microscopy are
used for imaging of the ablated surface morphologies, both revealing LIPSS with periodicities close
to the laser wavelength and an orientation always perpendicular to the polarization of the fs-laser
beam. It is experimentally demonstrated that these LIPSS can be formed in silicon upon irradiation
by single fs-laser pulses—a result that is additionally supported by a recent theoretical model.
Two-dimensional Fourier transforms of the SEM images allow the detailed analysis of the
distribution of the spatial frequencies of the LIPSS and indicate, at a fixed peak fluence, a
monotonous decrease in their mean spatial period between ~770 nm (N = 1) and 560 nm (N
= 1000). The characteristic decrease in the LIPSS period is caused by a feedback-mechanism acting
upon excitation of surface plasmon polaritons at the rough silicon surface which is developing under
the action of multiple pulses into a periodically corrugated surface.
A new approach is presented to quantify the so-called "heat affected zone" (HAZ) during
femtosecond laser pulse processing. Ablation of titanium nitride (TiN) thin films (~3 μm
thickness) by multiple femtosecond laser pulses (τ=130 fs, λ=800 nm) in air environment was
studied by means of two different surface analytical methods both being sensitive to chemical
alterations at the surface. Scanning Auger electron microscopy was applied for a visualization of the
spatial distribution of specific elements (Ti, O) within the laser-modified areas. The chemical state
of the irradiated surface was revealed by complementary x-ray photoelectron spectroscopy. Both
methods were used for a depth-profiling chemical analysis (tracking the elements Ti, N, O, and C)
using an Ar-ion beam for surface sputtering. In a narrow laser fluence range slightly below the
ablation threshold of TiN significant superficial oxidation can be observed leading to the formation
of substoichiometric TiO2-x. At fluences above the ablation threshold, an increased titanium
concentration is observed within the entire ablation craters. Following upon sputter removal the
elemental distribution into the depth of the nonablated material, the results allow an estimation of
the heat-affected zone for femtosecond laser ablation in air environment. According to our analyses,
the HAZ extends up to a few hundreds of nanometers into the nonablated material.
Hochleistungsfasern am Limit - Laserinduzierte Zerstörung als Einsatzgrenze bei Lichtwellenleitern
(2012)
Aufgrund der steigenden Anforderungen an Fasern für Hochleistungsanwendungen hat die Business Unit Fiber Optics der Leoni Gruppe gemeinsam mit der BAM Bundesanstalt für Materialforschung und -prüfung die Herausforderung angenommen, erstmalig die Zerstörschwellen eigener large core Spezialfasern zu untersuchen.
The formation of laser-induced periodic surface structures (LIPSS) upon irradiation of fused silica with multiple irradiation sequences consisting of laser pulse pairs (50 fs single-pulse duration) of two different wavelengths (400 and 800 nm) is studied experimentally. Parallel polarized double-pulse sequences with a variable delay Δt between -10 and +10 ps and between the individual fs-laser pulses were used to investigate the LIPSS periods versus Δt. These two-color experiments reveal the importance of the ultrafast energy deposition to the silica surface by the first laser pulse for LIPSS formation. The second laser pulse subsequently reinforces the previously seeded spatial LIPSS frequencies.
The removal of a 75- to 90-nm-thick passivating silicon nitride antireflection coating from standard textured multicrystalline silicon photovoltaic wafers with a typical diffused 90-Ω/sq-emitter upon irradiation with near-infrared femtosecond laser pulses (790 nm central wavelength, 30 fs pulse duration) is studied experimentally. The laser irradiation areas are subsequently characterized by complementary optical microscopy, scanning electron microscopy and depth profiling chemical analyses using secondary ion mass spectrometry. The results clarify the thin-film femtosecond laser ablation scenario and outline the process windows for selective antireflection coating removal.
Ultrashort pulse laser micromachining at repetition rates of several hundreds of kHz allows a cost-effective high precision manufacturing, which makes this method attractive for many industrial applications. Upon exceeding a critical laser intensity, hard X-ray radiation is generated as a side effect. Even if the emitted X-ray dose per laser pulse is low, for currently available high-repetition-rate laser systems the accumulated X-ray dose becomes significant and radiation safety must be considered. Influences of the processing parameters are discussed and radiation protection aspects will be outlined
Modern life and global communication would not be possible without technologically tailored thin films; they are omnipresent in daily life applications. In most cases, the films are deposited entirely at the carrying substrates in a specific processing step of the device or sample. In some cases, however, removal or modification must be performed locally, i.e., site-controlled and material selective through an additional laser processing step. For that ultrashort laser pulses with durations in the femtosecond and picosecond range can provide unique advantages and capabilities in industrially scalable schemes. This article reviews the current state of the research and corresponding industrial transfer related to the structuring of thin films by ultrashort pulsed lasers. It focuses on the pertinent historic developments, reveals the relevant physical and chemical effects, explores the ultimate limits, and discusses selected industrial and scientific applications.
Ultrashort pulse laser processing can result in the secondary generation of unwanted X-rays if a critical laser irradiance of about 10^13 W/cm^2 is exceeded. Spectral X-ray emissions were investigated during the processing of tungsten and steel using three complementary spectrometers (based on CdTe and silicon drift detectors) simultaneously for the identification of a worst-case spectral scenario. Therefore, maximum X-ray photon energies were determined, and corresponding dose equivalent rates were calculated. An ultrashort pulse laser workstation with a pulse duration of 274 fs, a center wavelength of 1030 nm, pulse repetition rates between 50 kHz and 200 kHz, and a Gaussian laser beam focused to a spot diameter of 33 µm was employed in a single pulse and burst laser operation mode. Different combinations of laser pulse energy and repetition rate were utilized, keeping the average laser power constant close to the maximum power of 20 W. Peak irradiances ranging from 7.3 × 10^13 W/cm^2 up to 3.0 × 10^14 W/cm^2 were used. The X-ray dose equivalent rate increases for lower repetition rates and higher pulse energy if a constant average power is used. Laser processing with burst mode significantly increases the dose rates and the X-ray photon energies. A maximum X-ray photon energy of about 40 keV was observed for burst mode processing of tungsten with a repetition rate of 50 kHz and a peak irradiance of 3 × 10^14 W/cm^2.
X-ray emission hazards from ultrashort pulsed laser material processing in an industrial setting
(2021)
Interactions between ultrashort laser pulses with intensities larger than 10^13 W/cm^2 and solids during material processing can lead to the emission of X-rays with photon energies above 5 keV, causing radiation hazards to operators. A framework for inspecting X-ray emission hazards during laser material processing has yet to be developed. One requirement for conducting radiation protection inspections is using a reference scenario, i.e., laser settings and process parameters that will lead to an almost constant and high level of X-ray emissions. To study the feasibility of setting up a reference scenario in practice, ambient dose rates and photon energies were measured using traceable measurement equipment in an industrial setting at SCHOTT AG. Ultrashort pulsed (USP) lasers with a maximum average power of 220 W provided the opportunity to measure X-ray emissions at laser peak intensities of up to 3.3 × 10^15 W/cm^2 at pulse durations of ~1 ps. The results indicate that increasing the laser peak intensity is insufficient to generate high dose rates. The investigations were affected by various constraints which prevented measuring high ambient dose rates. In this work, a list of issues which may be encountered when performing measurements at USP-laser machines in industrial settings is identified.
Ultrashort pulse laser materials processing can be accompanied by the production of X-rays. Small doses per laser pulse can accumulate to significant dose rates at high laser pulse repetition rates which may exceed the permitted X-ray limits for human exposure. Consequently, a proper radiation shielding must be considered in laser machining. A brief overview of the current state of the art in the field of undesired generation of X-ray radiation during ultrashort pulse laser material processing in air is presented.
Laser-induced periodic surface structures (LIPSS) are a universal phenomenon and can be generated on almost any material by irradiation with linearly polarized radiation. This chapter reviews the current state in the field of LIPSS, which are formed in a “self-ordered” way and are often accompanying materials processing applications. LIPSS can be produced in a single-stage process and enable surface nanostructuring and, in turn, adaption of optical, mechanical, and chemical surface properties. Typically, they feature a structural size ranging from several micrometers down to less than 100 nm and show a clear correlation with the polarization direction of the light used for their generation. Various types of LIPSS are classified, relevant control parameters are identified, and their material-specific formation mechanisms are analyzed for different types of inorganic solids, i.e., metals, semiconductors, and dielectrics. Finally, technological applications featuring surface functionalization in the fields of optics, fluidics, medicine, and tribology are discussed.
Review of x-ray exposure and safety issues arising from ultra-short pulse laser material processing
(2021)
Laser processing with ultra-short laser pulses enables machining of materials
with high accuracy and throughput. The development of novel laser Technologies with laser pulse repetition rates up to the MHz range opened the way for industrial manufacturing processes. From a radiological point of view this evolution is important, because x-ray radiation can be generated as an unwanted side effect in laser material processing. Even if the emitted x-ray dose per pulse is comparably low, the x-ray dose can become hazardous to health at high laser repetition rates. Therefore, radiation protection must be considered. This article provides an overview on the generation and detection of x-rays in laser material processing, as well as on the handling of this radiation risk in the framework of radiological protection.
The use of ultrashort laser pulses for material processing in air has many advantages. Due to the progressive development in the laser sector, average powers in the kW range with pulse repetition rates exceeding the MHz-level are available. The machining with high-intensity laser pulses can be accompanied by the generation of a near-surface electron plasma due to absorption and ionization of the material, a subsequent plasma heating by the laser pulse, and finally an interaction of “hot” plasma electrons with the workpiece leading to continuous and characteristic X-ray radiation. The amount of this unwanted X-ray radiation is determined by the laser parameters (pulse duration, intensity, wavelength, polarization), the workpiece (atomic number, surface preparation), and the laser process management (scanning or stationary regime, laser turning). The use of laser intensities above 10^13 W/cm^2 in combination with laser pulse repetition rates in the few 100 kHz-range can lead to X-ray dose rates exceeding the permitted X-ray limits for members of the public. Especially the materials tungsten and steel show significant X-ray emission. Recently, the current state of the art in the field of undesired generation of X-ray radiation during ultrashort pulse laser processing in air was reviewed. In this presentation, important aspects of the measured X-ray doses, X-ray spectra, and practical issues of radiation protection are discussed.
Ultrashort laser pulses have found their way into industrial material processing. They take advantage of the fact that moderate laser fluences can produce high quality material removal without significant thermal influence. The growing availability of powerful, highly repeating laser sources and an advanced laser beam control have favored these developments. However, the laser-matter interaction can be accompanied by the production of X-rays. Small doses per laser pulse can accumulate to significant dose rates at high laser pulse repetition rates which may exceed the permitted X-ray limits for human exposure. Consequently, a proper radiation shielding must be considered in laser material processing. The paper summarizes the current state of the art in the field of undesired generation of X-ray radiation during ultrashort pulse laser material processing in air.
Ultrakurzpuls-Lasertechnik ist heute der Schlüssel für eine Vielzahl von Anwendungen in der industriellen Lasermaterialbearbeitung. Beim Einsatz hoher Laser-Intensitäten kann allerdings unerwünschte Röntgenstrahlung erzeugt werden. Die Röntgendosis und Energieverteilung ist von Laser-, Material- und Prozessparametern abhängig. Es können Röntgendosen über den erlaubten Grenzwerten für die Exposition des Menschen erreicht werden.
For pulse laser materials processing often optical step index and gradient index multimode fibers with core diameters ranging from 100 to 600 μm are used. The design of a high power fiber transmission system must take into account limitations resulting from both surface and volume damage effects. Especially, breakdown at the fiber end faces and self-focusing in the fiber volume critically influence the fiber performance. At least operation charts are desirable to select the appropriate fiber type for given laser parameters.
In industry-relevant studies the influence of fiber core diameter and end face preparation on laser-induced (surface) damage thresholds (LIDT) was investigated for frequently used all-silica fiber types (manufacturer LEONI). Experiments on preform material (initial fiber material) and compact specimens (models of the cladding and coating material) accompanied the tests performed in accordance with the relevant LIDT standards ISO 21254-1 and ISO 21254 2 for 1-on-1 and S-on-1 irradiation conditions, respectively. The relation beam diameter vs. LIDT was investigated for fused silica fibers. Additionally, laser-induced (bulk) damage thresholds of fused silica preform material F300 (manufacturer Heraeus) in dependence on external mechanical stress simulating fiber bending were measured. All experiments were performed with 10-ns laser pulses at 1064 and 532 nm wavelength with a Gaussian beam profile.