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Paper des Monats
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Zusammenfassung
Laser pulses in the 10-fs domain provide a quality of micromachining of fused silica and borosilicate glass that is unobtainable with longer pulses in the range of several 100 femtoseconds up to picoseconds. The shortening of the pulses reduces the statistical behavior of the material removal and the ablation process thus attains a more deterministic and reproducible character. The improved reproducibility of ablation is accompanied by significantly smoother morphology. This offers the potential for lateral and vertical machining precision of the order of 100 nm and 10 nm, respectively.
Ablation of indium phosphide wafers in air was performed with low repetition rate ultrashort laser pulses (130 fs, 10 Hz) of 800 nm wavelength. The relationships between the dimensions of the craters and the ablation parameters were analyzed. The ablation threshold fluence depends on the number of pulses applied to the same spot. The single-pulse ablation threshold value was estimated to be fth(1)=0.16 J/cm2. The dependence of the threshold fluence on the number of laser pulses indicates an incubation effect. Morphological and chemical changes of the ablated regions were characterized by means of scanning electron microscopy and Auger electron spectroscopy.
Abstract Femtosecond laser micromachining has excited vivid attention in various industri-
al fields and in medicine owing to the advantages of ultrashort laser pulses compared to
long-pulse treatment.These are mainly the reduction of the laser fluence needed to induce
ablation and the improvement of the contour sharpness of the laser-generated structures.
Recently,special attention was paid to femtosecond laser experiments on nonabsorbing in-
organic dielectrics.This is due to the fact that optical damage in dielectric optical elements
limits the performance of high-power laser systems.Despite the fact that a large variety of
organic polymers can be machined with excimer lasers successfully,the involvement of
thermal processes can lead to an unsatisfactory quality of the structures.Ultrashort,fs-laser
pulses might be an alternative for the treatment of polymers.Therefore,femtosecond laser
machining investigations of dielectrics and polymers are reviewed in this paper.Similarities
and differences of the ablation behavior of both material classes are discussed.The influ-
ence of the bandgap on the ablation threshold in dependence on the pulse duration,the en-
hancement of the machining precision with a shortening of the pulse duration,incubation
phenomena,and morphological features appearing on the surface after femtosecond laser
treatment are mentioned.Possible applications,e.g.,in medicine and biosensors,are de-
scribed.
We present surface micro-modifications of bariumalumoborosilicate glasses with a high transformation temperature near 700 °C. Laser processing of the glass substrate was realized by using ultra-short laser pulses at 800 nm. The morphological conversion of the laser-treated surfaces was characterized by scanning force microscopy and nano-indentation. A hardness increase by at least a factor of six on the laser ablation crater edge relative to illuminated non- ablated areas shows that the material in the crater walls underwent drastic morphological and mechanical changes. In this heat- and shock-affected zone, the material became more elastic as a result of increased stress.
Femtosecond-pulse laser ablation of dental hydroxyapatite and single-crystalline fluoroapatite
(1999)
Laser microdrilling of healthy human enamel and dentine using 300 fs pulses at a wavelength of 615 nm and 3 Hz repetition rate leads to an enhanced structuring quality in comparison with nanosecond-laser results. Microcracking and damage to neighboring tissue can be reduced. Ablation threshold fluences for 100 laser pulses of 0.3 J cm-2 (human dentine), 0.6 J cm-2 (human enamel) and 0.8 J cm-2 (single crystalline fluoroapatite) could be determined. Ablation depths per pulse below 1 7m were observed.