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- 2015 (1) (entfernen)
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- Bonding strength (1) (entfernen)
A new technology for strength determination of adhesive-bonded joints based on analytical centrifugatioon is introduced. Tensile as well as shear strength can be measured for multiple test specimens simultaneously within a very short time. The experimental procedure is described from sample preparation, application of adhesives, sample mounting within the centrifuge to testing parameters and sequences. All requirements of DIN EN 15870 are fulfilled and, in addition, a higher throughput and a better reproducibility can be obtained. The experimental results are discussed regarding bonding strength development over time, comparison of tensile and shear strength and various testing conditions. Furthermore, an additional application field of centrifuge technology is described with respect to the determination of the adhesive strength of coatings. The novel centrifuge based technology provides the determination of bonding, adhesive and shear strength on a statistical basis under identical testing conditions for up to eight samples. Moreover, sophisticated two-sided sample clamping, necessary for a tensile testing machine, is replaced by a simple plug-in procedure.