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Eingeladener Vortrag
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Silver in LTCC - Interfacial reactions, transport processes and influence on properties of ceramics
(2009)
LTCC-Modules with Integrated Ferritic Layers - Strategies for Material Development and Co-Sintering
(2008)
LTCC-modules with integrated ferrite layers - Strategies for material development and co-sintering
(2008)
LTCC-Modules with integrated ferrite layers - Strategies for material development and co-sintering
(2009)
The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties.
By addition of LiF-containing sintering additives to commercial BaTiO3 powder, more than 98% of the theoretical density was reached at a sintering temperature of 900 °C both on powder compacts and laminates. Dielectric measurements were performed on ceramic samples in the temperature and frequency ranges from -20 °C to 125 °C and from 103 to 106 Hz, respectively. High relative permittivity (εr ~ 3160) and low dielectric loss (tan δ ~ 0.014) were measured for tapes of the favoured material. The breakdown strength for tapes with a thickness of about 80 µm is 30 kV/mm. The microprobe analysis showed, that no interfacial reaction between the dielectric layer and the Ag-electrode had occurred.
The newly developed barium titanate ceramics completely densifying at 900 °C turned out to be promising for integration of buried capacitors in LTCC multilayers.
The sintering temperature of BaTiO3 powder was reduced to 900 °C due to the ZnO-B2O3-Li2O-Nb2O5-Co2O3 addition. Excellent densification was achieved after sintering at 900 °C for 2 h. The low sintering temperature of newly developed capacitor materials allows a co-firing with pure silver electrodes. The dielectric constant and the temperature stability of the dielectric constant are strongly correlated with the composition of the ZnO-B2O3-Li2O additives. A high dielectric constant up to 3000 and a dielectric loss less than 0.024 were measured on multilayer capacitors sintered at 900 °C with silver inner electrodes.
Due to addition of minor amounts of suitable additive combinations to BaTiO3 powder the sintering temperature was reduced to 900 °C. Excellent densification (more than 98% of theoretical density) and good dielectric properties were achieved after sintering at 900 °C for 2 hours. Dielectric properties can be improved by modifying the composition of sintering additives and additon of further dopants. The low sintering temperature of newly developed capacitor material allows a co-sintering with pure silver electrodes. No interfacial reaction between silver electrodes and ceramics was observed by microprobe analysis. The dielectric constants of about 1200 to 3000 and the dielectric losses of about 0.008 to 0.02 were measured (f = 1 kHz, T = 25 °C). The temperature dependency of dielectric constant for new capacitor materials is low, almost X7R characteristics. Furthermore, the densification and the dielectric properties of embedded capacitors in LTCC were investigated.
Integration of magnetic functional components in LTCC circuit boards calls for co-firing of dielectric and ferrite tapes. Ni-Cu-Zn ferrites with permeability of µ = 900 were fully densified at the standard LTCC sintering temperature of 900°C. Co-firing of this ferrite with dielectric tapes requires the adaptation of the shrinkage behavior of the materials as well as the thermal contraction during the cooling period – especially in the temperature range below the transformation point of the glass phase of the dielectric tape. To match these preconditions, a new dielectric LTCC material with steep sintering curve and high thermal expansion coefficient was designed. Sintered multilayer laminates composed of Ni-Cu-Zn ferrite and tailored dielectric tapes are free of cracks and possess no open porosity. No significant interdiffusion between the ferrite and dielectric tapes was found using microprobe analysis. Pure ferrite laminates show homogeneous microstructure with large grains up to 50 µm in diameter. However, growth of ferrite grains does not take place near the interface between ferrite and release or dielectric tapes. There is a strong correlation between permeability and volume fraction of large ferrite grains. Compared to pure ferrite laminates the permeability of co-sintered Ni-Cu-Zn ferrite layers is drastically reduced to 400, that is a decrease of more than 50%.