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The method of movable cellular automata (MCA) and method of molecular dynamics (MD) were applied to simulate the friction and sliding behavior of model-tribofilms formed from a nanocomposite consisting of an epoxy matrix, 10 vol % micron-sized carbon fibers and 5 vol. % silica nanoparticles. Whereas MCA considered the tribofilm as an agglomerate of silica nanoparticles released from the composite and mixed with graphite particles, MD simulated the sliding behavior of an amorphous silica layer supported by stiff crystalline substrates on both sides. The MCA model provided reasonable quantitative results which corroborate experimental findings at moderate stressing conditions. The very low coefficient of friction observed experimentally under severe stressing conditions was not explained by this model. This could be attributed to the lack of mechanical data at the high temperature expected under these conditions. Although based on a simpler assumption of the tribofilm composition, MD-modelling could be easily applied to the expected high flash temperature and was able to predict friction reduction and smooth sliding under these conditions.
Copper is one of the most important components in brake pads and its amount can reach up to 14%. In spite of a number of positive features copper usage in brake pad formulations has recently become the subject of considerable discussions, primarily due to concerns about potential risks related to environmental impacts of copper particles. So, for developing new pad formulations with possible replacements of copper content, it is very important to understand the functionality of copper additions to brake friction materials. In the paper theoretical investigation of the role of copper as a pad ingredient was carried out on the basis of modelling by the method of movable cellular automata (MCA). In the study the concentration of copper particles in a Fe3O4-matrix was varied. The sliding simulations were performed while assuming material properties at 500 degrees C in order to assess the beneficial role of copper during severe braking conditions corresponding to fading cycles during dynamometer testing.
The method of movable cellular automata (MCA) was applied to simulate the stress-strain behavior of a nano composite consisting of an epoxy matrix and 6 vol. % silica nano particles. The size of the elements used for modelling was fixed at 10 nm, corresponding approximately to the diameter of the filler particles. Since not only the stress-strain response of the two constituents but also debonding of neighboring particles and granular flow was taken into account, plastic deformation as well as crack initiation and propagation could be simulated with the model. Modelling results were compared with tensile test results of both, pure epoxy as well as the epoxy-6 vol. % SiO2 composite. Since assuming bulk properties of the two constituents did not yield satisfactory results, slight modifications of the nanoparticle response functions and nanostructures were tested numerically. Finally, it was observed that only the assumption of slightly increased strength properties of the epoxy yielded good correlation between experimental and modelling results. This was attributed to an increased cross linking of the epoxy caused by the presence of silica nano particles.
Weld metal microstructure for alloy 6060 aluminum welds, made using the gas-tungsten arc process and alloy 4043 filler metal, has been characterized using optical metallography, EPMA microprobe analysis, SEM/EBSD and STEM/EDX electron microscopy, and single-sensor differential thermal analysis (SS-DTA). In addition, alloy 6060 castings were solidified at variable cooling rates approaching that of welding, to provide a reference for comparison with weld microstructure. It was found that a major change in cast microstructure occurs at cooling rates higher than 27 K/s resulting in a structure similar to that observed in weld metal. Rapid cooling is believed to favor low temperature solidification reactions that normally would be achieved only at higher silicon content. Accordingly, additions of 4043 filler metal that increase the weld metal silicon content have only limited affect on weld solidification range and microstructure. This has direct implications regarding how 4043 filler additions improve weldability and weld quality.