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For the vast majority of ellipsometric measurements, the application of planar substrates is mandatory and requires a proper sample alignment prior to the measurement. Here, the authors present a generalized approach of how to extract the isotropic ellipsometric sample parameters from an imaging Mueller-matrix measurement even if the sample is significantly misaligned. They validate the method by layer-thickness calculations based on imaging Mueller-matrix measurements of flat crystalline silicon samples that were misaligned on purpose. Furthermore, they also exploit this method’s capabilities to perform spatially resolved layer-thickness measurements of a single-layer indium-tin-oxide coating on a fused-silica microlens without the need of realignment or repositioning of the sample during the measurement.
Up until several years ago, tensile and compressive tests have been exclusively carried out as single-sample tests within a tensile, hardness or universal testing machine. The availability of centrifuge technology changed this situation in 2013 in several ways because centrifugal force is used as testing force within a rotational reference frame.
Firstly, multiple-sample strength testing became feasible for both tensile load condi-tions, e.g. determination of composite, bonding or adhesive strength, and compressive load conditions, e.g. hardness, compressibility and compactibility. Secondly, there is no need for a two-sided sample clamping and double-cardanic suspensions as samples are simply inserted using a one-sided sample support. Thirdly, shear forces can be avoided by means of guiding sleeves which steer test stamps acting as mass bodies for either tensile or compressive testing. Fourthly, up to eight samples can be tested under identical conditions within a very short period of time, typically within 15 minutes including sample loading and unloading. Hence, either a reliable statistics (of identical samples) or a ranking (of different samples) can be derived from one test run.
The bench-top test system is described in detail and demonstrated that centrifugal force acts as testing force in an appropriate way because Euler and Coriolis force do not affect the testing results. Examples for both tensile strength testing, i.e. bonding strength of adhesives-bonded joints and adhesive strength of coatings, and compres-sive strength testing, i.e. Vickers-, Brinell- and ball indentation hardness and deter-mination of spring constants, are presented, discussed and compared with conven-tional tests within tensile, hardness or universal testing machines.
At present, a maximum testing force of 6.5 kN can be realized which results at test stamp diameters of 5 mm, 7 mm, and 10 mm in tensile or compressive stress values of 80 MPa, 160 MPa, and 320 MPa. For tensile strength, this is already beyond bonding strength of cold- and warm-curing adhesives. Moreover, centrifuge technology is compliant to standards such as EN 15870, EN ISO 4624, EN ISO 6506/6507 and VDI/VDE 2616. Programmable test cycles allow both short-term stress and log-term fatigue tests. Based on a variety of examples of surface and bonding technology, applications in both fields R&D and QC are presented. Meanwhile, centrifuge technology is also accredited according to DIN EN ISO/IEC 17025.
The authors describe and interpret curvature-related changes to the ellipsometric readout. As model system for a concave curvature, a set of three spherical microscopic indents in silicon (100) of different sizes was prepared by instrumented indentation testing using a spherical indenter. For reference, these samples were characterized by AFM to reveal the topography of each structure. The concavelike indents were analyzed by Mueller-Matrix imaging ellipsometry to extract lateral intensity images of 12 elements of the Mueller-Matrix. As a result of the detailed analysis of the image elements m22, m23, and m14, it was possible to correlate intensity changes and symmetry properties to depolarization and cross polarization induced by the edge threshold and the curved surface of the indent.
The in-situ monitoring of electrochemical deposition (ECD) processes is still a challenge regarding the measurement of the effective temperature of the substrate and the formation of mechanical stress in the layer under given plating conditions. Monitoring problems can be solved by applying a pre-coated fiber Bragg grating (FBG) to the electrolytic process as the shift of the Bragg wavelength is affected by both the temperature of the electrolyte near the substrate and the stress formation in the growing layer. The experimental FBG set-up and the quantitative determination of temperature- and stress-related strain is described for a nickel-iron electrolyte.