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Mechanical properties, i.e. hardness and elastic modulus, of amorphous SiO2 and Si3N4 PE-CVD coatings have been studied for two coating thicknesses (0.1 and 1.0 µm) and two substrate materials (fused silica, i.e. Herasil, and borosilicate glass, i.e., BK7) using low load instrumented indentation. The coating systems are being considered for possible use as reference materials for thin film mechanical property test methods. Single layers of SiO2 and Si3N4 and a multilayer stack consisting of five double layers of SiO2/Si3N4 (individual layer thickness: 0.1 µm) were investigated on both substrate materials. A special plasma pre-treatment of the substrates prior to deposition ensured that coating adhesion exceeded inner film stress for all systems considered. The applied indentation load ranged from 700 down to 0.1 mN and resulted in indentation depths from more than 1 µm to about 15 nm. The influence of coating thickness and the effect of the substrate on the measurement of hardness and elastic modulus of the films are discussed, with emphasis on the effects of indentation depth vs. coating thickness on the observed coating properties. One coatingsubstrate system (1.0 µm Si3N4 on Herasil) out of ten was found to be above a critical threshold for tensile cracking of the coating. In this system, termed overcritical, tensile cracks occurred both prior to, and as a result of, indentation, indicating that Berkovich indentation may also be used to probe residual film stress.
We report measurements of the optical breakdown threshold and ablation depth in dielectrics with different band gaps for laser pulse durations ranging from 5 ps to 5 fs at a carrier wavelength of 780 nm. For tau <100 fs, the dominant channel for free electron generation is found to be either impact or multiphoton ionization (MPI) depending on the size of the band gap. The observed MPI rates are substantially lower than those predicted by the Keldysh theory. We demonstrate that sub-10-fs laser pulses open up the way to reversible nonperturbative nonlinear optics (at intensities greater than 1014 W/cm2 slightly below damage threshold) and to nanometer-precision laser ablation (slightly above threshold) in dielectric materials.
Laser cleaning of delicate biological composite materials such as ancient parchment manuscripts from the 15th and 16th century and printed paper from the 19th century is demonstrated with an ultraviolet excimer pulsed laser at 308 nm. Laser fluence levels must stay below the ablation and destruction threshold of the parchment or paper substrate, and have to surpass the threshold of the contaminant matter. Foreign layers to be removed must exhibit a higher optical density than the artifact substrates. Synthetic carbonaceous dirt modelled by water-soluble black crayons showed a characteristically weak featureless laser-induced plasma spectroscopy spectrum near the noise limit. It turned out that laser-induced plasma spectroscopy is of limited use in monitoring halting points (or etch-stops) because it relies on the destruction not only of the laterally inhomogenously distributed contaminant but also of pigment phases on a microscopically rough parchment substrate. Laser-induced fluorescence spectroscopy, however, promises to be a valuable non-destructive testing technique for etch-stop monitoring.
Different types of plasma, irradiative and chemical activation were compared in terms of surface functionalization. Corona and spark jet plasmas are characterized by low gas temperatures and high rates in surface modification. UV irradiation in the presence of ozone does not involve any particle bombardment and acts only by enhanced photooxidative processes. Although ion implantation can be avoided, this method is not free of radiative damage in both the surface-near region and the bulk of polymers. Furthermore, its functionalization rate is low. In relation to low-pressure O2 plasma modification, all treatments mentioned here have a low efficiency in adhesion promotion due to oxidative degradation of macromolecules and formation of molecular debris known as the ''weak boundary layer''.