Filtern
Dokumenttyp
Referierte Publikation
- nein (5)
Schlagworte
- LTCC (3)
- Coefficient of thermal expansion (CTE) (2)
- Cofiring (2)
- Ferrite (2)
- Shrinkage (2)
- Co-firing (1)
- Ferrites (1)
- Hexagonal ferrites (1)
- Integrated inductors (1)
- LTCC modules (1)
We have studied the integration of Ni-Cu-Zn ferrite spinels as well as substituted hexagonal Co2Y-and M-type ferrites into LTCC (Low Temperature Ceramic Co-firing) modules. The cofiring behavior and the magnetic properties of these materials were investigated and evaluated for multilayer applications. Ni-Cu-Zn ferrites exhibit permeabilities of µ=300–500 for operating frequencies in the MHz range. Cu-substituted Y-type ferrites Ba2Co2-x-yZnxCuyFe12O22 in combination with sintering additives display sufficient shrinkage and densification at 900°C. A permeability of µ=10 is observed; however, substituted Co2Y-type ferrites do not exhibit long-term stability at 900°C. Co/Ti-substituted M-type ferrites BaFe12-2yCoyTiyO19 (y=1.2) with planar magneto-crystalline anisotropy exhibit excellent soft magnetic behavior. Using sintering additives, complete densification is reached at 900°C and a permeability of µ=15 and a resonance frequency of larger than 1?GHz are observed. Integration of ferrite multilayer inductor components into LTCC modules using free and constrained cofiring technologies is demonstrated.
LTCC-Modules with integrated ferrite layers - Strategies for material development and co-sintering
(2009)
The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties.