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Organisationseinheit der BAM
- 8 Zerstörungsfreie Prüfung (921) (entfernen)
Neues aus der BAM 2019
(2019)
X-ray back scatter imaging is rarely applied compared to classical X-ray projection imaging. More than 20 years ago the company Philips developed “COMSCAN”, a first application case for aircraft industry, which allowed even a depth resolution using back scatter imaging. The company AS&E in Boston offers back scatter imaging solutions for the security market. The principle is to scan the object with a highly collimated X-ray needle beam from one side only and to detect the backscattered radiation by a large area detector side by side with the collimation wheel. A new prototype is investigated at BAM for application and optimization in non-destructive testing. As modern industrial application field in-situ inspection in additive manufacturing is targeted. The accessibility of the printed part during the production process is very limited. This prevent the application of a two sided X-ray inspection or Computed Tomography, were an rotation of the object is required to acquire projections from 360 degrees. An important advantage for the X-ray back scatter technique are also the materials used in additive manufacturing (polymers, ceramics, light metals like Aluminum or Titanium). These materials with lower density and lower Z values give better scatter signals than metals with higher densities and Z values. The back scatter intensity decreases with increasing density and Z value of the material. But the requirements on spatial resolution and contrast sensitivity are more stringent for non-destructive testing of additive manufactured parts compared to the security area. In NDT sizes of indications smaller than 1 mm have to be detected clearly. The investigation of these limits on a state-of-the-art prototype for X-ray back scattering using rotating collimated X-ray needle beams is a part of the BAM project “ProMoAM”. The contribution shows first results of the optimization for NDT and the achieved application limits for several example cases.
Der Ersatz von Röntgenfilmen durch digitale Detektoren in der Zerstörungsfreien Prüfung im Anlagenbau wird seit 2013 durch neue ISO-Normen unterstützt. Nach der Erfolgsgeschichte der digitalen Photographie und der fast voll-ständigen Ablösung der Filmtechnik in der optischen Bilderfassung wird erwartet, dass sich der Übergang von der Filmradiographie zur digitalen Radiographie schnell vollzieht. Dieser Trend ist derzeit so noch nicht zu beobachten. Zur mobilen Prüfung wird in Europa immer noch vorrangig die Filmradiographie und nur teilweise die Computerra-diographie mit Speicherfolien eingesetzt. Im Bereich der stationären Prüftechnik haben sich die Matrixdetektoren (DDA) weitgehend durchgesetzt, wobei es auch hier noch alternative Detektoren wie Bildverstärker und Fluorosko-pe gibt. Mit Einführung der DIN EN ISO 17636-2 zur Schweißnahtprüfung wird seit 2013 erstmalig geregelt, wie man einen digitalen Detektor für die technische Radiographie auswählen soll, um im Vergleich zur Filmradiographie eine äquivalente Bildqualität zu erhalten. Essentielle Parameter bestimmen, ob die geforderte Bildgüte (Fehlernachweiß-empfindlichkeit) erreicht wird. Ein Überblick zeigt, welche Parameter für den praktischen Einsatz wichtig sind und wie sie ermittelt werden. Praktische Einsatzbeispiele im Anlagenbau werden diskutiert.
Die Technologie der hybriden Teilchen (oder Photonen) zählenden Bilddetektoren wurde seit mehr als 2 Jahrzehnten durch Institutionen wie das CERN (MediPix-/ TimePix-Chips) oder das Paul-Scherrer-Institut (Pilatus-/ Eiger-Chips) entwickelt. Die Ursprünge dieser Technologie kommen aus der Hochenergie-Physik mit ihren Beschleuniger-basierten Experimenten, bei denen ein zuverlässiger und rauschfreier Nachweis jedes ionisierten Teilchens gefordert wird. Eine Energieauflösung wird ebenfalls oft verlangr. Das ist auch in der klassischen Radiographie von Nutzen, so wurden diese Detektoren auch dafür optimiert. Neueste Photonen zählenden Detektoren besitzen folgende exzellenten Bildeigenschaften: rauschfreie Photonen-Detektion in einem hohen Dynamikbereich (SNR >2500 erreichbar), hohe räumliche Auflösung (bis zu 10 µm Pixelgröße), Energieschwellen bis zur vollen spektralen Auflösung und eine sehr hohe Geschwindigkeit (bis zu Tausenden Bildern pro Sekunde). Diese hybriden Detektoren können mit hochabsorbierenden Sensorschichten aus CdTe, CZT oder GaAs bestückt werden, um bildgebende Anwendungen mit Gamma- oder harten Röntgenstrahlen zu realisieren, in denen bisher Szintillator basierende Bilddetektoren dominierten (z.B. für NDT, SPECT, PET). Im Beitrag wird der erste wirklich große Photonen zählende Detektor mit CdTe und einer lückenlosen Detektionsfläche, die aus einer theoretisch unbegrenzten Anzahl von MediPix-/ TimePix-Modulen besteht, gezeigt. Die erste kommerzielle Version eines solchen Detektors hat eine Fläche von 7cm x7cm, 1,6 Megapixel und erfüllt die Anforderungen der Prüfklasse „B“ in der industriellen Radiographie. Die Energie auflösenden Fähigkeiten dieses Detektors erlauben eine „Farb-Radiographie“, in der verschiedene Materialien in verschiedene Farben dargestellt werden. Der 2. Teil dieses Beitrags stellt einen voll spektral auflösenden Gamma- und Röntgen-Bilddetektor mit dickem CdTe und 2,4 Megapixel vor, der auf TimePix3-Chips basiert und eine sehr hohe Ortsauflösung von ~10 µm erreicht. Die hohe Zeitauflösung von TimePix3 wird mit großem Nutzen für eine substantielle Verbesserung der erhaltenen Bilder und Spektren zur Unterdrückung interner Fluoreszenzstrahlung sowie Comptonstreuungsanteilen, die die Bildinformation verschmieren, verwendet.
In den letzten zwei Jahren wurden 11 neue Standards/Standardrevisionen zur RT veröffentlicht (ohne Strahlenschutz) und 5 werden dafür gestrichen. Es wird über die neuen Anforderungen ausgewählter Normen bzw. Normrevisionen informiert und insbesondere auch über die veränderten Parameter, die bei Prüfpraxis und bei der Klassifizierung zu berücksichtigen sind. Das wichtigste Projekt ist die Revision der DIN EN ISO 17636-1, -2, RT von Schweißverbindungen, in ISO TC 44 SC 5 WG 1. Die Standards zur Schweißnahtprüfung in der Kerntechnik, DIN 25435, wurden ins Englische übertragen und bei ISO TC 85 SC 6 bearbeitet. Hauptaktivität bei ASTM ist gegenwärtig die Überarbeitung der CT-Standards und die Berücksichtigung der Anforderungen an das dimensionelle Messen. Der Guide ASTM E 1441 zur Bestimmung von MTF, Kontrast-Detail-Funktion (CDF) und Kontrast-Diskrimination-Diagramm (CDD) wird revidiert. E 2445 zur CR Long Term Stability wird ebenfalls revidiert. Die Revision soll auch in die ISO 16371-1 eingehen. Dazu ist ein Round Robin-Test geplant. Auch die Standards zur Durchstrahlungsprüfung auf Korrosion und Ablagerungen in Rohren mit Röntgen- und Gammastrahlen (EN 16407-1, -2, 2014) wurden revidiert. Diese Revision wurde als DIN EN ISO 20769-1, -2 2018 veröffentlicht und EN 16407 wird zurückgezogen. Die Revision der Standards EN 12543 und EN 12679 zur Messung der Brennfleckgröße und der Strahlergröße ist mit Verzögerung in Überarbeitung, um die digitalen Detektoren und Messmöglichkeiten mit Bildverarbeitungsprogrammen zu berücksichtigen. Ein Entwurf zur Messung der Brennfleckgröße von nano-Fokusröhren wird derzeit vom Europäischen Metrologie-Programm EMPIR gefördert. Zur radiographischen Gussteilprüfung wurde der Standard EN 12681 revidiert und 2018 veröffentlicht. Er wurde um Zulässigkeitsgrenzen erweitert und die digitale Radiographie wurde in Teil 2 berücksichtigt.
X-ray back scatter imaging is rarely applied compared to classical X-ray projection imaging. 20 years ago the company Philips developed “COMSCAN”, a first application case in the aircraft industry, which allowed even a depth resolution using back scatter imaging. The company AS&E in Boston offers back scatter imaging solutions for the security market. Their principle is to scan the object with a highly collimated X-ray needle beam from one side only and detect the backscattered radiation by a large area detector side by side with the collimation wheel. A new prototype is investigated at BAM for application and optimization in non-destructive testing. As modern industrial application field in-situ testing in additive manufacturing is targeted. The accessibility of the printed part during the production process is very limited. This prevent the application of a two sided X-ray inspection or Computed Tomography, were an rotation of the object is required to acquire projections from 360 degrees. An important advantage for the X-ray back scatter technique are also the materials used in additive manufacturing (polymers, ceramics, light metals like Aluminum or Titanium). These materials with lower density and lower Z values give better scatter signals than metals with higher densities and Z values. The back scatter intensity decreases with increasing density and Z value of the material. But the requirements on spatial resolution and contrast sensitivity are more stringent for non-destructive testing of additive manufactured parts compared to the security area. In NDT sizes of indications smaller than 1 mm have to be detected clearly. The investigation of these limits on a stateof-the-art prototype for X-ray back scattering using rotating collimated X-ray needle beams is a part of the BAM project “ProMoAM”. The contribution shows first results of the optimization for NDT and the achieved application limits for several example cases.
X-ray back scatter imaging is rarely applied compared to classical X-ray projection imaging. 20 years ago the company Philips developed “COMSCAN”, a first application case in the aircraft industry, which allowed even a depth resolution using back scatter imaging. The company AS&E in Boston offers back scatter imaging solutions for the security market. Their principle is to scan the object with a highly collimated X-ray needle beam from one side only and detect the backscattered radiation by a large area detector side by side with the collimation wheel. A new prototype is investigated at BAM for application and optimization in non-destructive testing. As modern industrial application field in-situ testing in additive manufacturing is targeted. The accessibility of the printed part during the production process is very limited. This prevent the application of a two sided X-ray inspection or Computed Tomography, were an rotation of the object is required to acquire projections from 360 degrees. An important advantage for the X-ray back scatter technique are also the materials used in additive manufacturing (polymers, ceramics, light metals like Aluminum or Titanium). These materials with lower density and lower Z values give better scatter signals than metals with higher densities and Z values. The back scatter intensity decreases with increasing density and Z value of the material. But the requirements on spatial resolution and contrast sensitivity are more stringent for non-destructive testing of additive manufactured parts compared to the security area. In NDT sizes of indications smaller than 1 mm have to be detected clearly. The investigation of these limits on a stateof-the-art prototype for X-ray back scattering using rotating collimated X-ray needle beams is a part of the BAM project “ProMoAM”. The contribution shows first results of the optimization for NDT and the achieved application limits for several example cases.
The revision of ISO 24497:2007 started in 2017 (by decision of Com-V at the IIW annual assembly in Shanghai). After 3 years of discussions and incorporation of many comments from all over the world the working group C-V-E-b headed by Uwe Zscherpel finalized the work with a final draft to be forwarded for final vote at ISO TC 44. The working group C-V-E-b finalised the work and can be resolved. The chair thanks for all the successfully work done, the vote to forward the latest draft to ISO for final vote was done without any negative.
The transition from X-ray film to digital detectors in radiography is accompanied by an increase of unsharpness due to the larger inherent digital detector unsharpness in comparison to film. The basic spatial resolution of digital detectors (see EN ISO 17636-2) is used today to describe this unsharpness. The geometrical unsharpness of the radiographic projection of object structures onto the detector plane is determined by the focal spot size of the X-ray tube and the magnification. The focal spot size is measured today (see ASTM E 1165) from pin hole camera exposures or edge unsharpness (see ASTM E 2903). The final image unsharpness is a result of a convolution of the geometrical and inherent detector unsharpness function, divided by the magnification factor of the object onto the detector plane. Different approximations of this convolution result in ASTM E 1000 and ISO 17636-2 in different optimum values for the magnification factor for a given focal spot size of a X—ray tube and the basic spatial resolution of the detector. The higher contrast sensitivity, an advantage of digital radiography, compared to film radiography is furthermore improved when using higher X-ray voltages as used with film and smaller focal spots of the X-ray tubes. This allows a higher distance between object and detector resulting in reduced object scatter in the image. The interactions between all these parameters will be discussed and simple rules for practitioners will be derived in this contribution.
Laser powder-based directed energy deposition (DED-L) is a technology that offers the possibility for 3D material deposition over hundreds of layers and has thus the potential for application in additive manufacturing (AM). However, to achieve broad industrial application as AM technology, more data and knowledge about the fabricated materials regarding the achieved properties and their relationship to the manufacturing process and the resulting microstructure is still needed. In this work, we present data regarding the low-cycle fatigue (LCF) behavior of Ti-6Al-4V. The material was fabricated using an optimized DED-L process. It features a low defect population and excellent tensile properties. To assess its LCF behavior two conventionally manufactured variants of the same alloy featuring different microstructures were additionally tested. The strain-controlled LCF tests were carried out in fully reversed mode with 0.3 % to 1.0 % axial strain amplitude from room temperature up to 400°C. The LCF behavior and failure mechanisms are described. For characterization, optical microscopy (OM), scanning electron microscopy (SEM), and micro-computed tomography (µCT) were used. The low defect population allows for a better understanding of the intrinsic material’s properties and enables a fairer comparison against the conventional variants. The fatigue lifetimes of the DED-L material are nearly independent of the test temperature. At elevated test temperatures, they are similar or higher than the lifetimes of the conventional counterparts. At room temperature, they are only surpassed by the lifetimes of one of them. The principal failure mechanism involves multiple crack initiation sites.
Eine kritische Aufgabe im Rahmen der Etablierung von Prozess-Struktur-Eigenschafts-Performance-Beziehungen bei der additiven Fertigung (AM) von Metallen ist die Ermittlung von zuverlässigen und gut dokumentierten Kennwerten zum Materialverhalten sowie das Schaffen von Wissen über die Struktur-Eigenschafts-Korrelation. Schließlich ist dies die Grundlage für die Entwicklung gezielterer Prozessoptimierungen und zuverlässigerer Lebensdauer-Vorhersagen. In diesem Zusammenhang zielt dieser Beitrag darauf ab, Daten und Erkenntnisse über das Kriechverhalten des austenitischen Edelstahls 316L zu liefern, der mittels Laser-Powder-Bed-Fusion (L-PBF) hergestellt wird. Um dieses Ziel zu erreichen, wurden Proben aus konventionellem warmgewalztem sowie AM-Material gemäß den bestehenden Normen für konventionelles Material geprüft und vor und nach dem Versagen mikrostrukturell charakterisiert. Die Probekörper wurden aus einzelnen Blöcken des AM-Materials gefertigt. Die Blöcke wurden mit einer Standard-Scan- und Aufbaustrategie hergestellt und anschließend wärmebehandelt. Das Kriechverhalten wird anhand der Kriechlebensdauer und ausgewählter Kriechkurven und Kennwerte beschrieben und vergleichend bewertet. Der Einfluss von Defekten und Mikrostruktur auf das Materialverhalten wird anhand von zerstörenden und zerstörungsfreien Auswertungen an ausgewählten Proben analysiert. Der AM-Werkstoff zeigt kürzere Kriechlebensdauern, erreicht das sekundäre Kriechstadium deutlich schneller und bei geringerer Dehnung und weist eine geringere Kriechduktilität im Vergleich zu seinem konventionellen Gegenstück auf. Das Kriechschädigungsverhalten des AM-Werkstoffs ist eher mikrostruktur- als defektgesteuert und ist durch die Bildung intergranularer Kriechrisse gekennzeichnet. Als kritische Merkmale werden die Versetzungsdichte sowie die Versprödung der Korngrenzen identifiziert. Die Mikro-Computertomographie (µCT) erweist sich als Alternative zur Metallographie, um die Kriechschädigung zu analysieren.
Creep and fracture behavior of conventionally and additively manufactured stainless steel 316L
(2020)
A critical task within the frame of establishing process-structure-property-performance relationships in additive manufacturing (AM) of metals is producing reliable and well-documented material behavior’s data and knowledge regarding the structure-property correlation, including the role of defects. After all, it represents the basis for developing more targeted process optimizations and more reliable predictions of performance in the future. Within this context, this contribution aims to close the actual gap of limited historical data and knowledge concerning the creep behavior of the widely used austenitic stainless steel 316L, manufactured by Laser-Powder-Bed-Fusion (L-PBF). To address this objective, specimens from conventional hot-rolled and AM material were tested under application-relevant conditions according to existing standards for conventional material, and microstructurally characterized before and after failure. The test specimens were machined from single blocks from the AM material. The blocks were manufactured using a standard scan and build-up strategy and were subsequently heat-treated. The creep behavior is described and comparatively assessed based on the creep lifetime and selected creep curves and characteristic values. The effect of defects and microstructure on the material’s behavior is analyzed based on destructive and non-destructive evaluations on selected specimens. The AM material shows shorter creep lives, reaches the secondary creep stage much faster and at a lower strain, and features lower creep ductility compared to its conventional counterpart. The creep damage behavior of the AM material is more microstructure than defect controlled and is characterized by the formation and accumulation of single intergranular damage along the whole volume. Critical features identified are the grain morphology and the grain-boundary as well as the dislocation’s density. Micro-computed tomography (µCT) proves to be an alternative to metallography to analyze the creep damage.