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Electron probe microanalysis (EPMA) measurement of thin-film thickness in the nanometre range
(2002)
The thickness of thin films of platinum and nickel on fused silica and silicon substrates has been determined by EPMA using the commercial software STRATAGEM for calculation of film thickness. Film thickness ranged in the order 10 nm. An attempt was made to estimate the confidence range of the method by comparison with results from other methods of analysis. The data show that in addition to the uncertainty of the spectral intensity measurement and the complicated fitting routine, systematic deviation caused by the underlying model should be added. The scattering in the results from other methods does not enable specification of a range of uncertainty, but deviations from the real thickness are estimated to be less than 20%.
The electrical properties of solgel-derived films can be tailored by embedding conductive particles of ruthenium dioxide or carbon black in an insulating amorphous SiO2 silica matrix. The preparation process included an acid hydrolysis of tetraethoxysilane and methyltrimethoxysilane. Then alcohol solutions of ruthenium chloride or carbon black were added. Films of filler concentration up to 60 vol.% were prepared by dip coating and then dried and heat-treated at various temperatures up to 600_°C. The D.C. resistance of the films can be varied within the range of 109 to 102 OHgr sdot cm. A non-linear dependence on filler composition in the films was observed for both systems, which is explained by a modified percolation theory. A percolation threshold of 5.5 vol.% for SiO2-RuO2 or 50 vol.% for SiO2-C films, whereby the resistance drastically decreases, was determined. Moreover the temperature dependency of resistance and the current-voltage characteristics of the films can also be explained by this geometric model.