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We report on the mechanical properties of Cu–Nb alloys produced by combinatorial magnetron sputtering.
Depending on the composition, the microstructure is either fully amorphous (~30–65 at.% Cu), a dispersion of Cu crystallites in an amorphous matrix (~70 at.%), or a dominant crystalline phase with separated nanoscale amorphous zones (~80 at.% Cu). Nanomechanical probing of the different microstructures reveals that the hardness of the fully amorphous alloy is much higher than a rule of mixture would predict. We further demonstrate a remarkable tunability of the resistance to plastic flow, ranging from ca. 9 GPa in the amorphous regime to ca. 2 GPa in the fully crystalline regime. We rationalize these findings based on fundamental structural considerations, thereby highlighting the vast structure-property design space that this otherwise immiscible binary alloy provides.
The present work shows results on elemental distribution analyses in Cu(In,Ga)Se2 thin films for solar cells performed by use of wavelength-dispersive and energy-dispersive X-ray spectrometry (EDX) in a scanning electron microscope, EDX in a transmission electron microscope, X-ray photoelectron, angle-dependent soft X-ray emission, secondary ion-mass (SIMS), time-of-flight SIMS, sputtered neutral mass, glow-discharge optical emission and glow-discharge mass, Auger electron, and Rutherford backscattering spectrometry, by use of scanning Auger electron microscopy, Raman depth profiling, and Raman mapping, as well as by use of elastic recoil detection analysis, grazing-incidence X-ray and electron backscatter diffraction, and grazing-incidence X-ray fluorescence analysis. The Cu(In,Ga)Se2 thin films used for the present comparison were produced during the same identical deposition run and exhibit thicknesses of about 2 µm. The analysis techniques were compared with respect to their spatial and depth resolutions, measuring speeds, availabilities, and detection limits.
Mechanical properties, i.e. hardness and elastic modulus, of amorphous SiO2 and Si3N4 PE-CVD coatings have been studied for two coating thicknesses (0.1 and 1.0 µm) and two substrate materials (fused silica, i.e. Herasil, and borosilicate glass, i.e., BK7) using low load instrumented indentation. The coating systems are being considered for possible use as reference materials for thin film mechanical property test methods. Single layers of SiO2 and Si3N4 and a multilayer stack consisting of five double layers of SiO2/Si3N4 (individual layer thickness: 0.1 µm) were investigated on both substrate materials. A special plasma pre-treatment of the substrates prior to deposition ensured that coating adhesion exceeded inner film stress for all systems considered. The applied indentation load ranged from 700 down to 0.1 mN and resulted in indentation depths from more than 1 µm to about 15 nm. The influence of coating thickness and the effect of the substrate on the measurement of hardness and elastic modulus of the films are discussed, with emphasis on the effects of indentation depth vs. coating thickness on the observed coating properties. One coatingsubstrate system (1.0 µm Si3N4 on Herasil) out of ten was found to be above a critical threshold for tensile cracking of the coating. In this system, termed overcritical, tensile cracks occurred both prior to, and as a result of, indentation, indicating that Berkovich indentation may also be used to probe residual film stress.
Modern life and global communication would not be possible without technologically tailored thin films; they are omnipresent in daily life applications. In most cases, the films are deposited entirely at the carrying substrates in a specific processing step of the device or sample. In some cases, however, removal or modification must be performed locally, i.e., site-controlled and material selective through an additional laser processing step. For that ultrashort laser pulses with durations in the femtosecond and picosecond range can provide unique advantages and capabilities in industrially scalable schemes. This article reviews the current state of the research and corresponding industrial transfer related to the structuring of thin films by ultrashort pulsed lasers. It focuses on the pertinent historic developments, reveals the relevant physical and chemical effects, explores the ultimate limits, and discusses selected industrial and scientific applications.
For the vast majority of ellipsometric measurements, the application of planar substrates is mandatory and requires a proper sample alignment prior to the measurement. Here, the authors present a generalized approach of how to extract the isotropic ellipsometric sample parameters from an imaging Mueller-matrix measurement even if the sample is significantly misaligned. They validate the method by layer-thickness calculations based on imaging Mueller-matrix measurements of flat crystalline silicon samples that were misaligned on purpose. Furthermore, they also exploit this method’s capabilities to perform spatially resolved layer-thickness measurements of a single-layer indium-tin-oxide coating on a fused-silica microlens without the need of realignment or repositioning of the sample during the measurement.
Degradation behavior of thin polystyrene films on exposure to Ar plasma and its emitted radiation
(2013)
Spin-coated films of amorphous polystyrene (PS) were exposed to argon plasma for a few seconds to several minutes. The PS film was either in direct contact with the plasma or was shielded from the direct plasma contact by filters with different cutoff wavelengths in the vacuum UV region or by a Faraday cage (FC) made from metal mesh to prevent the impinging of charged species. Only energy-rich neutrals and plasma radiation may be operative in presence of the FC. lithium fluoride (LiF) filter protects the sample from direct contact with the plasma. Wavelengths of plasma radiation shorter than c. 105 nm (≈ 11.8 eV) were cut off. Glass filters made of fused SiO2 have a cutoff at λ ≈175?nm completely the vacuum UV radiation of plasma (ca. 175 nm ≈ 7.0 eV). These energies are sufficient to produce C–C, C–H bond scissions in case of direct Ar plasma exposure and Ar plasma exposure with use of the LiF filter. Only quartz glass shielding did not produce significant effects on the polymer surface in comparison to the reference PS, either in surface energy or O/C ratio or in IR spectra. Oxygen plasma has worked most aggressive and had etched the PS film, thus establishing a steady state between introduction of new oxygen functionalities and polymer etching. Ar plasma exposure produces also oxidation and etching of the polymer films as the oxygen plasma. Using of a FC during Ar plasma exposure or the LiF filter a slightly weaker oxidation was observed.
Tetraethyl orthosilicate (TEOS) was used as a chemical precursor to deposit ultra-thin SiO x C y plasma polymer films onto mild steel surfaces for preventing the corrosion process. The structure–property relationships of the coatings were evaluated by X-ray Photo Spectroscopy (XPS), X-Ray Diffraction (XRD), Fourier Transform InfraRed spectroscopy (ATR-FTIR) and Energy Dispersive X-ray spectroscopy (EDX) completed with Scanning Electron Microscopy (SEM). The SEM micrographs confirmed a pinhole-free surface morphology of the low-pressure deposited plasma polymer films. The TEOS molecules become fragmented in the plasma by numerous collisions with energy-rich electrons and heavier particles. Recombination of fragments and condensation onto the steel substrate is responsible for the formation of organic SiO containing plasma polymer layers. Such thin layers consist of predominantly SiO x structures. Their properties are determined largely by the gap distance between the two samples used as electrodes in the plasma. The efficiency of the corrosion-protecting coating was compared with uncoated samples. The corrosion protection was determined by exposure of samples to 3.5% NaCl aqueous solutions. For this purpose, polarization and Electrochemical Impedance Spectroscopy (EIS) were used to monitor the corrosion. The optimal gap distance between the electrodes was determined for corrosion protection. The best protective efficiency reached more than 97% of the total protection as measured at room temperature.
Background: Gas sensors are very important in several fields like gas monitoring, safety and environmental applications. In this approach, a new gas sensing concept is investigated which combines the powerful adsorption probability of metal oxide conductive sensors (MOS) with an optical ellipsometric readout. This concept Shows promising results to solve the problems of cross sensitivity of the MOS concept.
Results: Undoped tin oxide (SnOx) and iron doped tin oxide (Fe:SnOx) thin add-on films were prepared by magnetron sputtering on the top of the actual surface plasmon resonance (SPR) sensing gold layer. The films were tested for their sensitivity to several gas species in the surface plasmon resonance enhanced (SPREE) gas measurement. It was found that the undoped tin oxide (SnOx) shows higher sensitivities to propane (C3H8) then to carbon monoxide (CO). By using Fe:SnOx, this relation is inverted. This behavior was explained by a change of the amount of binding sites for CO in the layer due to this iron doping. For hydrogen (H2) no such relation was found but the sensing ability was identical for both layer materials. This observation was related to a different sensing mechanism for H2 which is driven by the Diffusion into the layer instead of adsorption on the surface.
Conclusion: The gas sensing selectivity can be enhanced by tuning the properties of the thin film overcoating. A relation of the binding sites in the doped and undoped SnOx films and the gas sensing abilities for CO and C3H8 was found. This could open the path for optimized gas sensing devices with different coated SPREE sensors.
The composition of the surface layer in dependence from the distance of the polymer/air interface in thin films with thicknesses below 100 nm of miscible polymer blends in a spatial region of a few nanometers is not investigated completely. Here, thin films of the blend poly vinyl methyl ether) (PVME)/polystyrene (PS) with a composition of 25/75 wt% are investigated by Energy Resolved X-ray Photoelectron Spectroscopy (ER-XPS) at a synchrotron storage ring using excitation energies lower than 1 keV. By changing the energy of the photons the information depth is varied in the range from ca. 1 nm to 10 nm. Therefore, the PVME concentration could be estimated in dependence from the distance of the polymer/air interface for film thicknesses below 100 nm. Firstly, as expected for increasing information depth the PVME concentration decreases. Secondly, it was found that the PVME concentration at the surface has a complicated dependence on the film thickness. It increases with decreasing film thickness until 30 nm where a maximum is reached. For smaller film thicknesses the PVME concentration decreases. A simplified layer model is used to calculate the effective PVME concentration in the different spatial regions of the surface layer.
The elemental composition of thin Fe-Ni alloy films deposited on silicon substrates were determined by electron probe microanalysis with an energy dispersive spectrometer using the STRATAGem software. The work was part of ample inter-laboratory comparisons organized in the frame of CCQM/SAWG (Consultative Committee for Amount of Substance/Surface Analysis Working Group). Therefore, the evaluation of the measurement uncertainties is treated in detail. By having the mass coverage and estimating a layer density, the layer thickness could be derived.