A unique authenticator for additively manufactured parts derived from their microstructure

  • The international research community is currently devoting extensive resources to the development of digital material data spaces and the associated digital twins and product passports of materials and components. A common weak link in these projects to date has been the connection between physical components / samples and their digital data and documents. This is where the concept of the unique identification comes in. Components produced using additive manufacturing can be marked for unique identification and secure authentication [1,2]. Serial numbers and machine-readable codes can be used to identify the component, and link digital product-related data (i.e., a digital product passport) to the actual components. The most prevailing solution consists of local process manipulation, such as printing a quick response (QR) code [3] or a set of blind holes on the surface or the internal cavity of hollow components. However, local manipulation of components may alter the properties, andThe international research community is currently devoting extensive resources to the development of digital material data spaces and the associated digital twins and product passports of materials and components. A common weak link in these projects to date has been the connection between physical components / samples and their digital data and documents. This is where the concept of the unique identification comes in. Components produced using additive manufacturing can be marked for unique identification and secure authentication [1,2]. Serial numbers and machine-readable codes can be used to identify the component, and link digital product-related data (i.e., a digital product passport) to the actual components. The most prevailing solution consists of local process manipulation, such as printing a quick response (QR) code [3] or a set of blind holes on the surface or the internal cavity of hollow components. However, local manipulation of components may alter the properties, and external tagging features can be altered or even removed by post-processing treatments. This work provides a new methodology for identification, authentication, and traceability of additively manufactured (AM) components using microstructural features that are unique to each part. X-ray computed tomography (XCT) was employed to image the microstructural features of a batch of AlSi10Mg parts. Based on size and geometry, the most prominent features were selected to create a unique digital authenticator. We implemented a framework in Python using open-access modules that can successfully create a digital object authenticator using the segmented microstructure information from XCT. We show that this method allows to authenticate individual parts from the build job based on its microstructural fingerprint. This is our contribution to enhancing the security and product protection of additively manufactured components.zeige mehrzeige weniger

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Metadaten
Autor*innen:Anja Waske
Koautor*innen:Kanhaiya Gupta, Konstantin Poka, Alexander Ulbricht, Heike Quosdorf
Dokumenttyp:Vortrag
Veröffentlichungsform:Präsentation
Sprache:Englisch
Jahr der Erstveröffentlichung:2025
Organisationseinheit der BAM:6 Materialchemie
6 Materialchemie / 6.0 Abteilungsleitung und andere
8 Zerstörungsfreie Prüfung
8 Zerstörungsfreie Prüfung / 8.5 Röntgenbildgebung
9 Komponentensicherheit
9 Komponentensicherheit / 9.6 Additive Fertigung metallischer Komponenten
DDC-Klassifikation:Technik, Medizin, angewandte Wissenschaften / Ingenieurwissenschaften / Ingenieurwissenschaften und zugeordnete Tätigkeiten
Freie Schlagwörter:Authentication; Fingerprint; Non-destructive testing
Themenfelder/Aktivitätsfelder der BAM:Material
Material / Additive Fertigung
Veranstaltung:FEMS EUROMAT
Veranstaltungsort:Granada, Spain
Beginndatum der Veranstaltung:15.09.2025
Enddatum der Veranstaltung:18.09.2025
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:19.12.2025
Referierte Publikation:Nein
Eingeladener Vortrag (wissenschaftliche Konferenzen):Nein
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