Optimization of local backside released micro-ring resonators for sensing applications using silicon photonic integrated circuits in a SOI technology

  • The integration of photonic sensors into compact systems requires space-efficient solutions, such as the backside release of waveguides on silicon-on-insulator (SOI) platforms. This study presents the design, fabrication, and characterization of fully backside-released micro-ring resonators (MRRs) using the IHP SG25H5EPIC technology. The performance of rib and strip waveguides released by either dry or wet etching of the buried oxide (BOX) layer is evaluated. While wet etching provides low-loss release of rib waveguides, dry etching is required for the release of strip waveguides but results in increased waveguide losses and reduced quality factors. The effects of these release methods on critical coupling conditions, extinction ratio (ER), full width at half maximum (FWHM), and sensor performance are analyzed. The findings confirm that both etching strategies yield structures suitable for photonic sensing, with backside release enabling co-integration with microfluidic andThe integration of photonic sensors into compact systems requires space-efficient solutions, such as the backside release of waveguides on silicon-on-insulator (SOI) platforms. This study presents the design, fabrication, and characterization of fully backside-released micro-ring resonators (MRRs) using the IHP SG25H5EPIC technology. The performance of rib and strip waveguides released by either dry or wet etching of the buried oxide (BOX) layer is evaluated. While wet etching provides low-loss release of rib waveguides, dry etching is required for the release of strip waveguides but results in increased waveguide losses and reduced quality factors. The effects of these release methods on critical coupling conditions, extinction ratio (ER), full width at half maximum (FWHM), and sensor performance are analyzed. The findings confirm that both etching strategies yield structures suitable for photonic sensing, with backside release enabling co-integration with microfluidic and optoelectronic components. These results contribute to the advancement of high-performance, integrated silicon photonic sensors.zeige mehrzeige weniger

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Autor*innen:Tabea Fünning
Koautor*innen:Anna Peczek, Aleksandra Kroh, Christian Mai, Martin Paul, Florian Thomsen, Robert Tannenberg, Christoph Schumann, Michael G. WellerORCiD, Andreas Mai, Patrick Steglich
Dokumenttyp:Posterpräsentation
Veröffentlichungsform:Präsentation
Sprache:Englisch
Jahr der Erstveröffentlichung:2025
Organisationseinheit der BAM:1 Analytische Chemie; Referenzmaterialien
1 Analytische Chemie; Referenzmaterialien / 1.5 Proteinanalytik
DDC-Klassifikation:Naturwissenschaften und Mathematik / Chemie / Analytische Chemie
Freie Schlagwörter:Biosensor; Germanium photodiode; Microfluidics; Q-Factor; Rib and strip waveguides; Wet and dry etching
Themenfelder/Aktivitätsfelder der BAM:Chemie und Prozesstechnik
Chemie und Prozesstechnik / Chemische Charakterisierung und Spurenanalytik
Veranstaltung:SPIE Optics + Optoelectronics 2025
Veranstaltungsort:Prague, Czech Republic
Beginndatum der Veranstaltung:23.05.2025
DOI:10.1117/12.3056481
URL:https://www.spiedigitallibrary.org/conference-proceedings-of-spie/13527/135270U/Optimization-of-local-backside-released-micro-ring-resonators-for-sensing/10.1117/12.3056481.short
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:03.07.2025
Referierte Publikation:Nein
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