Optimization of local backside released micro-ring resonators for sensing applications using silicon photonic integrated circuits in a SOI technology
- The integration of photonic sensors into compact systems requires space-efficient solutions, such as the backside release of waveguides on silicon-on-insulator (SOI) platforms. This study presents the design, fabrication, and characterization of fully backside-released micro-ring resonators (MRRs) using the IHP SG25H5EPIC technology. The performance of rib and strip waveguides released by either dry or wet etching of the buried oxide (BOX) layer is evaluated. While wet etching provides low-loss release of rib waveguides, dry etching is required for the release of strip waveguides but results in increased waveguide losses and reduced quality factors. The effects of these release methods on critical coupling conditions, extinction ratio (ER), full width at half maximum (FWHM), and sensor performance are analyzed. The findings confirm that both etching strategies yield structures suitable for photonic sensing, with backside release enabling co-integration with microfluidic andThe integration of photonic sensors into compact systems requires space-efficient solutions, such as the backside release of waveguides on silicon-on-insulator (SOI) platforms. This study presents the design, fabrication, and characterization of fully backside-released micro-ring resonators (MRRs) using the IHP SG25H5EPIC technology. The performance of rib and strip waveguides released by either dry or wet etching of the buried oxide (BOX) layer is evaluated. While wet etching provides low-loss release of rib waveguides, dry etching is required for the release of strip waveguides but results in increased waveguide losses and reduced quality factors. The effects of these release methods on critical coupling conditions, extinction ratio (ER), full width at half maximum (FWHM), and sensor performance are analyzed. The findings confirm that both etching strategies yield structures suitable for photonic sensing, with backside release enabling co-integration with microfluidic and optoelectronic components. These results contribute to the advancement of high-performance, integrated silicon photonic sensors.…


| Autor*innen: | Tabea Fünning |
|---|---|
| Koautor*innen: | Anna Peczek, Aleksandra Kroh, Christian Mai, Martin Paul, Florian Thomsen, Robert Tannenberg, Christoph Schumann, Michael G. WellerORCiD, Andreas Mai, Patrick Steglich |
| Dokumenttyp: | Posterpräsentation |
| Veröffentlichungsform: | Präsentation |
| Sprache: | Englisch |
| Jahr der Erstveröffentlichung: | 2025 |
| Organisationseinheit der BAM: | 1 Analytische Chemie; Referenzmaterialien |
| 1 Analytische Chemie; Referenzmaterialien / 1.5 Proteinanalytik | |
| DDC-Klassifikation: | Naturwissenschaften und Mathematik / Chemie / Analytische Chemie |
| Freie Schlagwörter: | Biosensor; Germanium photodiode; Microfluidics; Q-Factor; Rib and strip waveguides; Wet and dry etching |
| Themenfelder/Aktivitätsfelder der BAM: | Chemie und Prozesstechnik |
| Chemie und Prozesstechnik / Chemische Charakterisierung und Spurenanalytik | |
| Veranstaltung: | SPIE Optics + Optoelectronics 2025 |
| Veranstaltungsort: | Prague, Czech Republic |
| Beginndatum der Veranstaltung: | 23.05.2025 |
| DOI: | 10.1117/12.3056481 |
| URL: | https://www.spiedigitallibrary.org/conference-proceedings-of-spie/13527/135270U/Optimization-of-local-backside-released-micro-ring-resonators-for-sensing/10.1117/12.3056481.short |
| Verfügbarkeit des Dokuments: | Datei im Netzwerk der BAM verfügbar ("Closed Access") |
| Datum der Freischaltung: | 03.07.2025 |
| Referierte Publikation: | Nein |

