Final report of CCQM-K157 for the measurement of the amount of substance of HfO2 expressed as the thickness of nm films

  • The key comparison CCQM-K157 for the thickness measurement of HfO2 films was performed by the Surface Analysis Working Group (SAWG) of the Consultative Committee for Amount of Substance (CCQM). The aim of CCQM-K157 is to establish the measurement traceability and to ensure the equivalency in the measurement capability of national metrology institutes for the thickness measurement of HfO2 films. In this key comparison, the thicknesses of six HfO2 films with the nominal thickness range from 0.7 nm to 6 nm were compared by x-ray photoelectron spectroscopy (XPS), x-ray reflectometry (XRR), transmission electron microscopy (TEM), spectroscopic ellipsometry (SE) and medium energy ion scattering spectrometry (MEIS). To reach the main text of this paper, click on Final Report. Note that this text is that which appears in Appendix B of the BIPM key comparison database https://www.bipm.org/kcdb/. The final report has been peer-reviewed and approved for publication by the CCQM, according toThe key comparison CCQM-K157 for the thickness measurement of HfO2 films was performed by the Surface Analysis Working Group (SAWG) of the Consultative Committee for Amount of Substance (CCQM). The aim of CCQM-K157 is to establish the measurement traceability and to ensure the equivalency in the measurement capability of national metrology institutes for the thickness measurement of HfO2 films. In this key comparison, the thicknesses of six HfO2 films with the nominal thickness range from 0.7 nm to 6 nm were compared by x-ray photoelectron spectroscopy (XPS), x-ray reflectometry (XRR), transmission electron microscopy (TEM), spectroscopic ellipsometry (SE) and medium energy ion scattering spectrometry (MEIS). To reach the main text of this paper, click on Final Report. Note that this text is that which appears in Appendix B of the BIPM key comparison database https://www.bipm.org/kcdb/. The final report has been peer-reviewed and approved for publication by the CCQM, according to the provisions of the CIPM Mutual Recognition Arrangement (CIPM MRA).zeige mehrzeige weniger

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Metadaten
Autor*innen:K. J. Kim, H. Yu, S. M. Lee, J. H. Kwon, H. Ruh, Jörg RadnikORCiD, B. S. Archanjo, E. Annese, J. C. Damasceno, C. A. Achete, Y. Yao, L. Ren, H. Gao, D. Windover, H. Matsuzaki, Y. Azuma, L. Zhang, T. Fujimoto, W. A. Jordaan, B. Reed, A. G. Shard, L. Cibik, C. Gollwitzer, M. Krumrey
Dokumenttyp:Forschungsbericht
Veröffentlichungsform:Verlagsliteratur
Sprache:Englisch
Titel des übergeordneten Werkes (Englisch):Metrologia
Jahr der Erstveröffentlichung:2023
Organisationseinheit der BAM:6 Materialchemie
6 Materialchemie / 6.1 Oberflächen- und Dünnschichtanalyse
Verlag:IOP
Jahrgang/Band:60
Aufsatznummer:1A
Erste Seite:08010
DDC-Klassifikation:Technik, Medizin, angewandte Wissenschaften / Ingenieurwissenschaften / Ingenieurwissenschaften und zugeordnete Tätigkeiten
Freie Schlagwörter:CCQM; HfO2; Thin Films; XPS; thickness
Themenfelder/Aktivitätsfelder der BAM:Material
Material / Advanced Materials
DOI:10.1088/0026-1394/60/1A/08010
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:07.05.2025
Referierte Publikation:Nein
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