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Deposition and Characterization of Cu-Enhanced High-Entropy Alloy Coatings via DC Magnetron Sputtering

  • Protection against microbiologically influenced corrosion (MIC) is critical for materials used in aquatic environments, as MIC accelerates material degradation and leads to faster structural failure. Copper (Cu) has the potential to substantially improve the MIC resistance in alloys. In this study, high-entropy alloy (HEA) coatings containing Cu were deposited using DC (Direct Current) magnetron sputtering to enhance the corrosion resistance and mechanical properties of various substrates. Two CuCrFeMnNi HEA compositions in the form of bulk alloys and PVD (Physical Vapor Deposition) coatings, with 5% and 10% Cu, were analyzed for their microstructural, mechanical, and anticorrosive characteristics. Deposition parameters were varied to select the optimal values. Microstructural evaluations using SEM-EDS (scanning electron microscopy and energy dispersive X-ray spectroscopy), XRD (X-ray diffraction), and AFM (atomic force microscopy) revealed uniform, dense coatings with good adhesionProtection against microbiologically influenced corrosion (MIC) is critical for materials used in aquatic environments, as MIC accelerates material degradation and leads to faster structural failure. Copper (Cu) has the potential to substantially improve the MIC resistance in alloys. In this study, high-entropy alloy (HEA) coatings containing Cu were deposited using DC (Direct Current) magnetron sputtering to enhance the corrosion resistance and mechanical properties of various substrates. Two CuCrFeMnNi HEA compositions in the form of bulk alloys and PVD (Physical Vapor Deposition) coatings, with 5% and 10% Cu, were analyzed for their microstructural, mechanical, and anticorrosive characteristics. Deposition parameters were varied to select the optimal values. Microstructural evaluations using SEM-EDS (scanning electron microscopy and energy dispersive X-ray spectroscopy), XRD (X-ray diffraction), and AFM (atomic force microscopy) revealed uniform, dense coatings with good adhesion composed of dendritic and interdendritic BCC (body-centered cubic) and FCC (face centered cubic) structures, respectively. Microhardness tests indicated improved mechanical properties for the samples coated with developed HEAs. The coatings exhibited improved corrosion resistance in NaCl solution, the 10% Cu composition displaying the highest polarization resistance and lowest corrosion rate. These findings suggest that Cu-containing HEA coatings are promising candidates for applications requiring enhanced corrosion protection.zeige mehrzeige weniger

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Autor*innen:Arcadii Sobetkii, Laurentiu-Florin MosinoiuORCiD, Stefania CaramarinORCiD, Dumitru MitricaORCiD, Laura-Madalina CursaruORCiD, Alexandru-Cristian Matei, Ioan-Albert TudorORCiD, Beatrice-Adriana Serban, Mihai Ghita, Nicoleta Vitan, Julia WittORCiD, Özlem Özcan SandikciogluORCiD, Bogdan PostolnyiORCiD, Alexander Pogrebnjak
Dokumenttyp:Zeitschriftenartikel
Veröffentlichungsform:Verlagsliteratur
Sprache:Englisch
Titel des übergeordneten Werkes (Englisch):Applied Sciences
Jahr der Erstveröffentlichung:2025
Organisationseinheit der BAM:6 Materialchemie
6 Materialchemie / 6.2 Material- und Oberflächentechnologien
Veröffentlichende Institution:Bundesanstalt für Materialforschung und -prüfung (BAM)
Verlag:MDPI
Jahrgang/Band:15
Ausgabe/Heft:4
Aufsatznummer:1917
Erste Seite:1
Letzte Seite:14
DDC-Klassifikation:Technik, Medizin, angewandte Wissenschaften / Ingenieurwissenschaften / Ingenieurwissenschaften und zugeordnete Tätigkeiten
Freie Schlagwörter:Corrosion resistance; Cu-enhanced coatings; DC magnetron sputtering; High-entropy alloys (HEAs); Microstructural characterization
Themenfelder/Aktivitätsfelder der BAM:Material
Material / Materialdesign
DOI:10.3390/app15041917
URN:urn:nbn:de:kobv:b43-625561
ISSN:2076-3417
Verfügbarkeit des Dokuments:Datei für die Öffentlichkeit verfügbar ("Open Access")
Lizenz (Deutsch):License LogoCreative Commons - CC BY - Namensnennung 4.0 International
Datum der Freischaltung:19.02.2025
Referierte Publikation:Ja
Datum der Eintragung als referierte Publikation:10.03.2025
Schriftenreihen ohne Nummerierung:Wissenschaftliche Artikel der BAM
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