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Interpenetrating networks with tuned thermal and mechanical properties

  • Text Multiphoton lithography (MPL) has recently attracted significant research interest as a versatile tool capable of producing 2D and 3D micro- and nanoscopic features with high spatial resolution. The integrity of MPL microstructures, or their ability to respond to external stimuli, is of critical importance. However, achieving the desired properties of fabricated microcomponents for a specific application remains a challenge. In this work, we present new MPL materials based on epoxy-acrylate interpenetrating networks (IPNs). We aim at 3D microstructures, whose properties can be easily tuned by varying the ratio of the IPN components and fabrication parameters (Figure 1). The resulting library of 3D microstructures was investigated for their thermal and mechanical properties using highly-sensitive space-resolved methods. Flash scanning calorimetry revealed the influence of both, IPN composition and fabrication parameters, on glass transition temperature and material fragility.Text Multiphoton lithography (MPL) has recently attracted significant research interest as a versatile tool capable of producing 2D and 3D micro- and nanoscopic features with high spatial resolution. The integrity of MPL microstructures, or their ability to respond to external stimuli, is of critical importance. However, achieving the desired properties of fabricated microcomponents for a specific application remains a challenge. In this work, we present new MPL materials based on epoxy-acrylate interpenetrating networks (IPNs). We aim at 3D microstructures, whose properties can be easily tuned by varying the ratio of the IPN components and fabrication parameters (Figure 1). The resulting library of 3D microstructures was investigated for their thermal and mechanical properties using highly-sensitive space-resolved methods. Flash scanning calorimetry revealed the influence of both, IPN composition and fabrication parameters, on glass transition temperature and material fragility. AFM force-distance curve and intermodulation methods were used to characterize the mechanical properties with a lateral resolution of 1 micron and 4 nm, respectively. The deformation, stiffness and elastic behavior are discussed in detail in relation to the morphology. Moreover, we found that some 3D IPN microstructures exhibit fully elastic behavior. Our funding encourages the further development of IPN systems as versatile and easily tunable MPL materials.zeige mehrzeige weniger

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Autor*innen:Dorothee Silbernagl, Paulina Szymoniak, Zeynab Tavasolyzadeh, Heinz Sturm, Ievgeniia Topolniak
Dokumenttyp:Posterpräsentation
Veröffentlichungsform:Präsentation
Sprache:Englisch
Jahr der Erstveröffentlichung:2023
Organisationseinheit der BAM:6 Materialchemie
6 Materialchemie / 6.6 Physik und chemische Analytik der Polymere
DDC-Klassifikation:Technik, Medizin, angewandte Wissenschaften / Ingenieurwissenschaften / Ingenieurwissenschaften und zugeordnete Tätigkeiten
Freie Schlagwörter:Direct laser writing; Interpenetrating polymer network; Multiphoton Lithography; Polyethylene glycol diacrylate; Two photon polymerisation
Themenfelder/Aktivitätsfelder der BAM:Material
Material / Additive Fertigung
Material / Materialdesign
Material / Nano
Veranstaltung:Micro Nano Engineering (MNE conference)
Veranstaltungsort:Berlin, Germany
Beginndatum der Veranstaltung:25.09.2023
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:22.11.2023
Referierte Publikation:Nein
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