- Multiphoton lithography (MPL), an emerging microfabrication technique, shows great potential in a variety of applications ranging from tissue engineering to soft micro-robotics. Fabricated micro-objects often are expected to undergo shape morphing or bending. Furthermore, ensuring precise property tuning becomes detrimental for the functionality of MPL microstructures. Herein, we present novel MPL materials based on interpenetrating networks (IPNs), which effectively combine the advantages of acrylate and epoxy thermoset systems. A library of 3D MPL IPN microstructures with high 3D structural stability and tailored thermal and micromechanical properties is achieved. MPL laser velocity and fabrication power can be used to tune the morphology and therefore properties of IPN. New IPN microstructures with materials Young's moduli of 4 to 6 MPa demonstrate susceptibility to deformation with high to fully elastic response. Such soft elastic materials hold immense promise within morphableMultiphoton lithography (MPL), an emerging microfabrication technique, shows great potential in a variety of applications ranging from tissue engineering to soft micro-robotics. Fabricated micro-objects often are expected to undergo shape morphing or bending. Furthermore, ensuring precise property tuning becomes detrimental for the functionality of MPL microstructures. Herein, we present novel MPL materials based on interpenetrating networks (IPNs), which effectively combine the advantages of acrylate and epoxy thermoset systems. A library of 3D MPL IPN microstructures with high 3D structural stability and tailored thermal and micromechanical properties is achieved. MPL laser velocity and fabrication power can be used to tune the morphology and therefore properties of IPN. New IPN microstructures with materials Young's moduli of 4 to 6 MPa demonstrate susceptibility to deformation with high to fully elastic response. Such soft elastic materials hold immense promise within morphable microsystems, soft micro-robotics and cell engineering applications.…