Reliability of sputtered thin aluminium films under accelerated stress testing by vibration loading and modeling
- Aluminium is still one of the most important contact metallisations for power electronic chips like MOSFETs or IGBTs. With a large difference in thermal expansion coefficients (CTEs) between aluminium and silicon and the temperatures generated in hot-spots during high power transients, these layers are prone to failure due to thermo-mechanical fatigue. Usually lifetime assessment is done by subjecting dedicated test specimens to standardised stress tests as e.g. active or passive thermal cycling. This paper proposes a novel method for accelerated stress testing and lifetime modelling of thin aluminium films in the high-cycle fatigue regime by isothermal mechanical loading. The proposed novel test method is suggested to complement or replace resource-demanding thermal cycling tests and allow simple in-situ monitoring of failure.
Autor*innen: | B. Wunderle, T. Onken, J. Heilmann, Dorothee SilbernaglORCiD, J. Arnold, T. Bieniek, R. Pufall |
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Dokumenttyp: | Beitrag zu einem Tagungsband |
Veröffentlichungsform: | Verlagsliteratur |
Sprache: | Englisch |
Titel des übergeordneten Werkes (Englisch): | Reliability of sputtered thin aluminium films under accelerated stress testing by vibration loading and modeling |
Jahr der Erstveröffentlichung: | 2016 |
Verlag: | IEEE |
Erste Seite: | 1 |
Letzte Seite: | 14 |
DDC-Klassifikation: | Naturwissenschaften und Mathematik / Chemie / Analytische Chemie |
Technik, Medizin, angewandte Wissenschaften / Ingenieurwissenschaften / Ingenieurwissenschaften und zugeordnete Tätigkeiten | |
Freie Schlagwörter: | AFM; Accelerated stress testing; Active thermal cycling; Nanoroughness; Power electronic chips; Semiconductor device reliability; Sputtered thin aluminium film; Thermal expansion; Thermomechanical fatigue; Vibrations |
Veranstaltung: | 6th Electronic System-Integration Technology Conference (ESTC) |
Veranstaltungsort: | Grenoble, France |
Beginndatum der Veranstaltung: | 13.09.2016 |
Enddatum der Veranstaltung: | 15.09.2016 |
DOI: | 10.1109/ESTC.2016.7764458 |
Verfügbarkeit des Dokuments: | Datei im Netzwerk der BAM verfügbar ("Closed Access") |
Datum der Freischaltung: | 08.01.2018 |
Referierte Publikation: | Nein |