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Hot-embossing of low temperature co-fired ceramics during pressure-assisted sintering

  • A novel process to structure the surfaces of low temperature co-fired ceramics (LTCC) is presented. Lowered and raised structures are formed by hot-embossing with glass-like carbon molds during pressure-assisted sintering. Molding is driven by viscous flow of the LTCC glassy phase above the glass transition temperature. For accurate molding of embossments on the LTCC surface, proper filling of cavities in the glass-like carbon mold is necessary. Therefore, de-airing of the mold cavity has to be assured. Two strategies have been investigated: (i) hot-embossing at 850 °C after termination of LTCC shrinkage with de-airing through vent holes in the mold; and (ii) hot-embossing of open porous LTCC at 775 °C with dense molds, de-airing through pore channels in the LTCC, and subsequent densification by further heating to 850 °C. Circular embossments with 10 mm diameter were molded on a commercially available LTCC (Ceramtape GC, CeramTec GmbH, Marktredwitz, Germany). The sintered height wasA novel process to structure the surfaces of low temperature co-fired ceramics (LTCC) is presented. Lowered and raised structures are formed by hot-embossing with glass-like carbon molds during pressure-assisted sintering. Molding is driven by viscous flow of the LTCC glassy phase above the glass transition temperature. For accurate molding of embossments on the LTCC surface, proper filling of cavities in the glass-like carbon mold is necessary. Therefore, de-airing of the mold cavity has to be assured. Two strategies have been investigated: (i) hot-embossing at 850 °C after termination of LTCC shrinkage with de-airing through vent holes in the mold; and (ii) hot-embossing of open porous LTCC at 775 °C with dense molds, de-airing through pore channels in the LTCC, and subsequent densification by further heating to 850 °C. Circular embossments with 10 mm diameter were molded on a commercially available LTCC (Ceramtape GC, CeramTec GmbH, Marktredwitz, Germany). The sintered height was measured using optical profilometry. Image processing was used to evaluate porosity distributions in the sintered structures. The influence of embossing temperature on LTCC viscosity and mold filling behavior is discussed. Successful molding of 47 µm high raised grids and characters by hot embossing with 0.41 MPa at 775 °C and further heating to 850 °C under constant load is demonstrated. Thereby, the high potential of hot-embossing for precise structuring of LTCC surfaces is illustrated.zeige mehrzeige weniger

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Metadaten
Autoren/innen:Björn Mieller, Torsten Rabe
Dokumenttyp:Vortrag
Veröffentlichungsform:Präsentation
Sprache:Englisch
Jahr der Erstveröffentlichung:2016
Organisationseinheit der BAM:5 Werkstofftechnik
5 Werkstofftechnik / 5.5 Technische Keramik
DDC-Klassifikation:Technik, Medizin, angewandte Wissenschaften / Ingenieurwissenschaften / Ingenieurwissenschaften und zugeordnete Tätigkeiten
Freie Schlagwörter:Glass-like carbon; Hot-embossing; Low temperature co-fired ceramics; Pressure-assisted sintering; Structuring
Themenfelder/Aktivitätsfelder der BAM:Material
Material / Materialien und Stoffe
Veranstaltung:91. Jahrestagung der Deutschen Keramischen Gesellschaft
Veranstaltungsort:Freiberg
Beginndatum der Veranstaltung:07.03.2016
Enddatum der Veranstaltung:09.03.2016
Bemerkung:
Geburtsname von Mieller, Björn: Brandt, Björn
Birth Name of Mieller, Björn: Brandt, Björn
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:29.03.2016
Referierte Publikation:Nein