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Structuring of LTCC substrates by a combination of pressure-assisted sintering and hot-embossing

  • A novel technology for the structuring of LTCC surfaces is introduced. The material is shaped in a zero-shrinkage process by embossing a glassy carbon mold into the softened LTCC directly after termination of the shrinkage. Three commercially available LTCC compositions (Ceramtape GC, Heratape CT707, and DP951) were tested. Diverse raised and lowered structures including rings, grids, and characters were fabricated. Different material behavior was observed for the tested compositions. Promising results were achieved with Ceramtape GC. Embossing of precise, 40 µm deep circular cavities and 50 µm high raised characters is demonstrated. Processing of 100 × 100 mm² substrates is possible. DP951 showed very good moldability, but also unwanted material displacement due to evaporating lead. A high displacement capacity but uneven heights of embossed structures were observed on CT707 samples. SEM investigations proved the precise transfer of surface contours from the mold to the LTCC. Thereby,A novel technology for the structuring of LTCC surfaces is introduced. The material is shaped in a zero-shrinkage process by embossing a glassy carbon mold into the softened LTCC directly after termination of the shrinkage. Three commercially available LTCC compositions (Ceramtape GC, Heratape CT707, and DP951) were tested. Diverse raised and lowered structures including rings, grids, and characters were fabricated. Different material behavior was observed for the tested compositions. Promising results were achieved with Ceramtape GC. Embossing of precise, 40 µm deep circular cavities and 50 µm high raised characters is demonstrated. Processing of 100 × 100 mm² substrates is possible. DP951 showed very good moldability, but also unwanted material displacement due to evaporating lead. A high displacement capacity but uneven heights of embossed structures were observed on CT707 samples. SEM investigations proved the precise transfer of surface contours from the mold to the LTCC. Thereby, the high potential of the hot-embossing process for micro-patterning of LTCC is illustrated.zeige mehrzeige weniger

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Metadaten
Autoren/innen:Björn Mieller, Torsten Rabe
Dokumenttyp:Beitrag zu einem Tagungsband
Veröffentlichungsform:Graue Literatur
Sprache:Englisch
Titel des übergeordneten Werkes (Englisch):Additional Conferences (Device Packaging, HiTEC, HiTEN, CICMT)
Jahr der Erstveröffentlichung:2015
Organisationseinheit der BAM:5 Werkstofftechnik
5 Werkstofftechnik / 5.5 Technische Keramik
Jahrgang/Band:2015
Ausgabe/Heft:CICMT
Erste Seite:000297
Letzte Seite:000303
DDC-Klassifikation:Technik, Medizin, angewandte Wissenschaften / Ingenieurwissenschaften / Ingenieurwissenschaften und zugeordnete Tätigkeiten
Freie Schlagwörter:Glass-like carbon; LTCC
Themenfelder/Aktivitätsfelder der BAM:Material
Veranstaltung:11th International Conference and Exhibition on Ceramic Interconnects and Ceramic Microsystem Technologies (CICMT 2015)
Veranstaltungsort:Dresden, Germany
Beginndatum der Veranstaltung:20.04.2015
Enddatum der Veranstaltung:23.04.2015
DOI:https://doi.org/10.4071/CICMT-THA24
ISSN:2380-4491
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:09.05.2017
Referierte Publikation:Nein