- The degradation mechanisms of state-of-the-art Nb-Ti/Cu superconductors are described, based on in-situ synchrotron X-ray diffraction measurements during heat treatment. A quantitative description of the Nb-Ti/Cu degradation in terms of critical current density, Cu stabiliser resistivity and mechanical composite strength is presented. In an applied magnetic field a significant critical current degradation is already observed after a 5-minute 400 °C heat treatment, due to variations of –Ti precipitate size and distribution within the Nb-Ti alloy filaments. A strong degradation of the strand mechanical properties is observed after several minutes heating above 550 °C, which is also the temperature at which the formation of Cu-Ti intermetallic phases is detected. Several minutes heating at 250 °C are sufficient to increase the RRR of the strongly cold work strands inside a Rutherford type cable from about 80 to about 240. Heating for several minutes at 400 °C does not cause a significantThe degradation mechanisms of state-of-the-art Nb-Ti/Cu superconductors are described, based on in-situ synchrotron X-ray diffraction measurements during heat treatment. A quantitative description of the Nb-Ti/Cu degradation in terms of critical current density, Cu stabiliser resistivity and mechanical composite strength is presented. In an applied magnetic field a significant critical current degradation is already observed after a 5-minute 400 °C heat treatment, due to variations of –Ti precipitate size and distribution within the Nb-Ti alloy filaments. A strong degradation of the strand mechanical properties is observed after several minutes heating above 550 °C, which is also the temperature at which the formation of Cu-Ti intermetallic phases is detected. Several minutes heating at 250 °C are sufficient to increase the RRR of the strongly cold work strands inside a Rutherford type cable from about 80 to about 240. Heating for several minutes at 400 °C does not cause a significant conductor degradation in self-field and, thus, leaves enough temperature margin for the electrical interconnection of Nb-Ti/Cu conductors with common low temperature solders.…
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