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Temperature induced degradation of Nb-Ti/Cu composite superconductors

  • The degradation mechanisms of state-of-the-art Nb-Ti/Cu superconductors are described, based on in-situ synchrotron X-ray diffraction measurements during heat treatment. A quantitative description of the Nb-Ti/Cu degradation in terms of critical current density, Cu stabiliser resistivity and mechanical composite strength is presented. In an applied magnetic field a significant critical current degradation is already observed after a 5-minute 400 °C heat treatment, due to variations of –Ti precipitate size and distribution within the Nb-Ti alloy filaments. A strong degradation of the strand mechanical properties is observed after several minutes heating above 550 °C, which is also the temperature at which the formation of Cu-Ti intermetallic phases is detected. Several minutes heating at 250 °C are sufficient to increase the RRR of the strongly cold work strands inside a Rutherford type cable from about 80 to about 240. Heating for several minutes at 400 °C does not cause a significantThe degradation mechanisms of state-of-the-art Nb-Ti/Cu superconductors are described, based on in-situ synchrotron X-ray diffraction measurements during heat treatment. A quantitative description of the Nb-Ti/Cu degradation in terms of critical current density, Cu stabiliser resistivity and mechanical composite strength is presented. In an applied magnetic field a significant critical current degradation is already observed after a 5-minute 400 °C heat treatment, due to variations of –Ti precipitate size and distribution within the Nb-Ti alloy filaments. A strong degradation of the strand mechanical properties is observed after several minutes heating above 550 °C, which is also the temperature at which the formation of Cu-Ti intermetallic phases is detected. Several minutes heating at 250 °C are sufficient to increase the RRR of the strongly cold work strands inside a Rutherford type cable from about 80 to about 240. Heating for several minutes at 400 °C does not cause a significant conductor degradation in self-field and, thus, leaves enough temperature margin for the electrical interconnection of Nb-Ti/Cu conductors with common low temperature solders.zeige mehrzeige weniger

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Metadaten
Autor*innen:C. Scheuerlein, I. Ping, C. Senatore, M. Di Michiel, L. Thilly, A. Gerardin, Birgit RehmerORCiD, L. Oberli, G. Willering, L. Bottura
Dokumenttyp:Zeitschriftenartikel
Veröffentlichungsform:Verlagsliteratur
Sprache:Englisch
Titel des übergeordneten Werkes (Englisch):Journal of physics / Conference series
Jahr der Erstveröffentlichung:2010
Verlag:IOP Publ.
Verlagsort:Bristol, UK
Jahrgang/Band:234
Ausgabe/Heft:2
Erste Seite:022031-1 - 022031-5
Freie Schlagwörter:Supraleiter
DOI:10.1088/1742-6596/234/2/022031
ISSN:1742-6588
ISSN:1742-6596
Verfügbarkeit des Dokuments:Physisches Exemplar in der Bibliothek der BAM vorhanden ("Hardcopy Access")
Bibliotheksstandort:Sonderstandort: Publica-Schrank
Datum der Freischaltung:19.02.2016
Referierte Publikation:Ja
Datum der Eintragung als referierte Publikation:02.12.2010
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