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Automatic improved-resolution imaging of composite adhesive joints using time-frequency-wavenumber filtering applied to ultrasonic guided wavefields

  • This paper presents an automatic damage imaging technique by employing a signal processing approach based on applying hierarchically clustered filters across different domains. The technique involves time-frequency-wavenumber filter banks which are applied sequentially to ultrasonic guided wave (UGW) data. The study is conducted for a single lap joint composite specimen with a special focus on small voids which were formed due to manual adhesive component mixing. UGW data are acquired with a 3D Scanning Laser Doppler Vibrometer (LDV) over the scan area of the bonded plate. UGWs are excited at the central frequency of 100 kHz by a single piezoelectric transducer mounted on the surface of the single plate. Within each domain of time, frequency, and wavenumber, four filters are designed which results in 64 distinct filtered wavefields. From each filtered wavefield, an image is obtained by using root-mean-square (RMS) calculation of the signals. The obtained results are then combined toThis paper presents an automatic damage imaging technique by employing a signal processing approach based on applying hierarchically clustered filters across different domains. The technique involves time-frequency-wavenumber filter banks which are applied sequentially to ultrasonic guided wave (UGW) data. The study is conducted for a single lap joint composite specimen with a special focus on small voids which were formed due to manual adhesive component mixing. UGW data are acquired with a 3D Scanning Laser Doppler Vibrometer (LDV) over the scan area of the bonded plate. UGWs are excited at the central frequency of 100 kHz by a single piezoelectric transducer mounted on the surface of the single plate. Within each domain of time, frequency, and wavenumber, four filters are designed which results in 64 distinct filtered wavefields. From each filtered wavefield, an image is obtained by using root-mean-square (RMS) calculation of the signals. The obtained results are then combined to create a final, improved-resolution image of the scan area. The final image is compared to the image obtained through RMS calculation of full wavefield with interpolation through Delaunay triangulation and the image obtained by X-ray radiography. The results show that the smallest void that could be detected has a diameter of 2.14 mm.zeige mehrzeige weniger

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Metadaten
Autor*innen:M. Barzegar, Yevgeniya Lugovtsova, Jannis Bulling, Tatiana Mishurova, D. Pasadas, A. Ribeiro, H. Ramos
Dokumenttyp:Beitrag zu einem Tagungsband
Veröffentlichungsform:Verlagsliteratur
Sprache:Englisch
Titel des übergeordneten Werkes (Englisch):2023 IEEE International Ultrasonics Symposium (IUS)
Jahr der Erstveröffentlichung:2023
Organisationseinheit der BAM:8 Zerstörungsfreie Prüfung
8 Zerstörungsfreie Prüfung / 8.4 Akustische und elektromagnetische Verfahren
8 Zerstörungsfreie Prüfung / 8.5 Röntgenbildgebung
Verlag:IEEE
Erste Seite:1
Letzte Seite:4
DDC-Klassifikation:Naturwissenschaften und Mathematik / Chemie / Analytische Chemie
Freie Schlagwörter:Adhesive joints; Damage imaging; Laser Doppler vibrometer; Non-destructive testing; Porosity analysis; Ultrasonic guided waves
Themenfelder/Aktivitätsfelder der BAM:Chemie und Prozesstechnik
Veranstaltung:2023 IEEE International Ultrasonics Symposium (IUS)
Veranstaltungsort:Montreal, QC, Canada
Beginndatum der Veranstaltung:03.09.2023
Enddatum der Veranstaltung:08.09.2023
DOI:10.1109/IUS51837.2023.10307423
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:13.11.2023
Referierte Publikation:Nein
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