Co-firing of LTCC modules with embedded ferrite layers
- Further miniaturization of electronic packaging calls for integration of magnetic functional components into LTCC modules. For integration of magnetic function into LTCC, low fired MnZn- and NiCuZn-ferrites which can be fully densified at the standard LTCC sintering temperature of 900°C were developed. To co-fire these ferrite tapes with dielectric tapes the sintering shrinkage and the coefficient of thermal expansion of ferrite and dielectric tapes must be matched. For each ferrite material a new LTCC dielectric material was designed. The embedded ferrite tapes into new LTCC dielectric tapes can be sufficiently densified during co-firing at 900°C without any cracking. Compared to separately sintered ferrites the permeability of embedded ferrite tapes is reduced. For embedded NiCuZn ferrites permeabilities between 230 and 570 (at 2 MHz) according to the thickness of the embedded ferrite layer were measured. For embedded MnZn ferrites a permeability of 300 was measured.
Autor*innen: | Hamid Naghib Zadeh, Torsten Rabe, J. Toepfer, R. Karmazin |
---|---|
Dokumenttyp: | Beitrag zu einem Tagungsband |
Veröffentlichungsform: | Verlagsliteratur |
Sprache: | Englisch |
Titel des übergeordneten Werkes (Englisch): | EMPC-2011 - 18th European microelectronics & packaging conference (Proceedings) |
Jahr der Erstveröffentlichung: | 2011 |
Herausgeber (Institution): | IMAPS-Europe |
Ausgabe/Heft: | TuA2 |
Erste Seite: | 1 |
Letzte Seite: | 6 |
Freie Schlagwörter: | Co-firing; Ferrite; LTCC |
Veranstaltung: | EMPC-2011 - 18th European microelectronics & packaging conference |
Veranstaltungsort: | Brighton, UK |
Beginndatum der Veranstaltung: | 12.09.2011 |
Enddatum der Veranstaltung: | 15.09.2011 |
ISBN: | 978-0-9568086-0-8 |
Verfügbarkeit des Dokuments: | Datei im Netzwerk der BAM verfügbar ("Closed Access") |
Datum der Freischaltung: | 19.02.2016 |
Referierte Publikation: | Nein |