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Quantifying the coupling strength of adhesively bonded materials by investigating mode repulsion regions

  • In the field of non-destructive testing, Lamb waves are often used for material characterisation. The increasing computational capabilities further enable complex and detailed simulations to predict the material behaviour in reality. Since adhesive bonding of different materials is a widely used method in modern applications, a reliable measurement system to determine the quality of these adhesive bonds is needed. Investigations of the dispersive behaviour of acoustic waves in adhesively bonded multi-layered waveguides show mode repulsions in the dispersion diagrams in regions where the modes of the single materials would otherwise intersect. In previous works, changes of the distance between those modes with respect to the bonding quality are observed. The experimental data for this investigation is generated using pulsed laser radiation to excite broadband acoustic waves in plate like specimens which are detected by a piezoelectric ultrasonic transducer. Numerical data is generatedIn the field of non-destructive testing, Lamb waves are often used for material characterisation. The increasing computational capabilities further enable complex and detailed simulations to predict the material behaviour in reality. Since adhesive bonding of different materials is a widely used method in modern applications, a reliable measurement system to determine the quality of these adhesive bonds is needed. Investigations of the dispersive behaviour of acoustic waves in adhesively bonded multi-layered waveguides show mode repulsions in the dispersion diagrams in regions where the modes of the single materials would otherwise intersect. In previous works, changes of the distance between those modes with respect to the bonding quality are observed. The experimental data for this investigation is generated using pulsed laser radiation to excite broadband acoustic waves in plate like specimens which are detected by a piezoelectric ultrasonic transducer. Numerical data is generated using simulations via a semi-analytical finite element method. Using a combination of experimental and numerical data, the present work introduces an approach to determine a parameter which indicates the bonding quality in relation to an ideal material coupling.zeige mehrzeige weniger

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Metadaten
Autor*innen:H. Zeipert, S. Johannesmann, Marcel Nicolai, Yevgeniya LugovtsovaORCiD, Jens PragerORCiD, B. Henning
Dokumenttyp:Beitrag zu einem Tagungsband
Veröffentlichungsform:Graue Literatur
Sprache:Englisch
Titel des übergeordneten Werkes (Englisch):Tagungsband DAGA 2021 - 47. Jahrestagung für Akustik
Jahr der Erstveröffentlichung:2021
Organisationseinheit der BAM:8 Zerstörungsfreie Prüfung
8 Zerstörungsfreie Prüfung / 8.4 Akustische und elektromagnetische Verfahren
Erste Seite:1532
Letzte Seite:1535
DDC-Klassifikation:Naturwissenschaften und Mathematik / Chemie / Analytische Chemie
Freie Schlagwörter:Laser excited ultrasonic waves; Multi-layered structures; Ultrasonic guided waves
Themenfelder/Aktivitätsfelder der BAM:Chemie und Prozesstechnik
Veranstaltung:DAGA 2021
Veranstaltungsort:Vienna, Austria
Beginndatum der Veranstaltung:15.08.2021
Enddatum der Veranstaltung:18.08.2021
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:25.10.2021
Referierte Publikation:Nein
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