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Stiffness variation in the interphase of amine-cured epoxy adjacent to copper microstructures

  • In an effort to expand the understanding of the mechanical properties of the polymeric interphase on a metal surface, a composite consisting of epoxy and copper was prepared and analyzed. Scanning force microscopy-based force modulation microscopy (SFM-FMM) was employed along with dynamic mechanical analysis (DMA) and energy dispersive X-ray analysis (EDX). Diglycidyl ether of bisphenol A (DGEBA)-based epoxy resins were applied with amine curing agents. The samples were made taking advantage of electron beam lithography (EBL) in order to produce sharp edges of copper structures and a flat surface suitable for the SFM-FMM analysis, which was able to depict the stiffness within the interphase. It is considered significant information because the mechanical characteristic within the narrow interphase was revealed. Comparing with DMA and EDX, the stiffness information of SFM-FMM demonstrated a matching correlation and agreement in terms of preferential adsorption of the curing agent in theIn an effort to expand the understanding of the mechanical properties of the polymeric interphase on a metal surface, a composite consisting of epoxy and copper was prepared and analyzed. Scanning force microscopy-based force modulation microscopy (SFM-FMM) was employed along with dynamic mechanical analysis (DMA) and energy dispersive X-ray analysis (EDX). Diglycidyl ether of bisphenol A (DGEBA)-based epoxy resins were applied with amine curing agents. The samples were made taking advantage of electron beam lithography (EBL) in order to produce sharp edges of copper structures and a flat surface suitable for the SFM-FMM analysis, which was able to depict the stiffness within the interphase. It is considered significant information because the mechanical characteristic within the narrow interphase was revealed. Comparing with DMA and EDX, the stiffness information of SFM-FMM demonstrated a matching correlation and agreement in terms of preferential adsorption of the curing agent in the vicinity of the interface. The stiffness profiles of the two epoxy systems turned out to be different, and it shows the material dependence of the interphase characteristics.zeige mehrzeige weniger

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Metadaten
Autor*innen:Jae Un Chung, Martin Munz, Heinz SturmORCiD
Dokumenttyp:Zeitschriftenartikel
Veröffentlichungsform:Verlagsliteratur
Sprache:Englisch
Titel des übergeordneten Werkes (Englisch):Surface and interface analysis
Jahr der Erstveröffentlichung:2007
Verlag:Wiley
Verlagsort:Chichester
Jahrgang/Band:39
Ausgabe/Heft:7
Erste Seite:624
Letzte Seite:633
Freie Schlagwörter:Copper; DMA; EDX; Epoxy; Interphase; Polymer-metal; SFM/AFM; Stiffness
ISSN:0142-2421
ISSN:1096-9918
Verfügbarkeit des Dokuments:Physisches Exemplar in der Bibliothek der BAM vorhanden ("Hardcopy Access")
Bibliotheksstandort:Sonderstandort: Publica-Schrank
Datum der Freischaltung:19.02.2016
Referierte Publikation:Ja
Datum der Eintragung als referierte Publikation:21.06.2007
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