TY - JOUR A1 - Zerbst, Uwe A1 - Klinger, Christian T1 - Material defects as cause for the fatigue failure of metallic components JF - International Journal of Fatigue N2 - The paper provides an overview on material defects which may serve as fatigue crack initiation sites and can cause final fatigue failure of a component. These comprise nonmetallic inclusions in Steel and aluminum alloys, cavities such as pores, micro-shrinkages and un-welded regions in cast, sinter and additively manufactured alloys, graphite nodules, shrinkages and other items in modular cast iron, regions of defective microstructure, microcracks and secondary notches such as undercuts and surface roughness. Besides their origin, the effect and mechanisms on fatigue crack initiation and propagation are discussed. The considerations are proceeded and accompanied by a Brief discussion of some Basic aspects such as the stages of crack propagation along their length scale, the overcoming of crack arrest and the question when a secondary notch can be treated as a crack. KW - Material defects KW - Fatigue strength and life KW - Non-metallic inclusions KW - Pores KW - Shrinkages KW - Graphite modules KW - Surface roughness PY - 2019 DO - https://doi.org/10.1016/j.ijfatigue.2019.06.024 SN - 0142-1123 SN - 1879-3452 VL - 127 SP - 312 EP - 323 PB - Elsevier AN - OPUS4-49127 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Zerbst, Uwe A1 - Klinger, Christian A1 - Bettge, Dirk T1 - Defects as a root cause for fatigue failure of metallic components N2 - The Topic of the presentationis a discussion on defects which can cause failure in cyclically loaded metallic components. Although also touching Features such as material defects such as pores or micro-shrinkages, etc. and geometric defects such as surface roughness and secondary notches (which are not considered in the design process) which origin in manufacturing, and others the presentation concentrates on non-metallic inclusions. It is prefaced by an introduction to the life cycle of a fatigue crack from initiation up to fracture. Special emphasis is put on the fact that only cracks which are not arrested during one of their distinct Propagation stages can grow to a critical size. T2 - VIII. International Conference on Engineering Failure Analysis CY - Budapest, Ungarn DA - 08.06.2018 KW - Metallic components KW - Material defects KW - Micro-shrinkages PY - 2018 AN - OPUS4-46875 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Grundmann, Jana A1 - Bodermann, Bernd A1 - Ermilova, Elena A1 - Weise, Matthias A1 - Hertwig, Andreas A1 - Klapetek, Petr A1 - Rafighdoost, Jila A1 - Pereira, Silvania F. T1 - Optical and tactile measurements on SiC sample defects JF - Journal of Sensors and Sensor Systems N2 - Abstract. In power electronics, compound semiconductors with large bandgaps, like silicon carbide (SiC), are increasingly being used as material instead of silicon. They have a lot of advantages over silicon but are also intolerant of nanoscale material defects, so that a defect inspection with high accuracy is needed. The different defect types on SiC samples are measured with various measurement methods, including optical and tactile methods. The defect types investigated include carrots, particles, polytype inclusions and threading dislocations, and they are analysed with imaging ellipsometry, coherent Fourier scatterometry (CFS), white light interference microscopy (WLIM) and atomic force microscopy (AFM). These different measurement methods are used to investigate which method is most sensitive for which type of defect to be able to use the measurement methods more effectively. It is important to be able to identify the defects to classify them as critical or non-critical for the functionality of the end product. Once these investigations have been completed, the measurement systems can be optimally distributed to the relevant defects in further work to realize a hybrid analysis of the defects. In addition to the identification and classification of defects, such a future hybrid analysis could also include characterizations, e.g. further evaluation of ellipsometric data by using numerical simulations. KW - Compound semiconductors KW - Hybrid metrology KW - Material defects KW - Spectroscopic Ellipsometry KW - Scanning Probe Microscopy KW - White-light Interference Microscopy PY - 2024 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-601220 DO - https://doi.org/10.5194/jsss-13-109-2024 SN - 2194-878X VL - 13 IS - 1 SP - 109 EP - 121 PB - Copernicus GmbH AN - OPUS4-60122 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -