TY - JOUR A1 - Strobl, Dominic A1 - Unger, Jörg F. A1 - Ghnatios, C. A1 - Robens-Radermacher, Annika T1 - PGD in thermal transient problems with a moving heat source: A sensitivity study on factors affecting accuracy and efficiency JF - Engineering Reports N2 - Thermal transient problems, essential for modeling applications like welding and additive metal manufacturing, are characterized by a dynamic evolution of temperature. Accurately simulating these phenomena is often computationally expensive, thus limiting their applications, for example for model parameter estimation or online process control. Model order reduction, a solution to preserve the accuracy while reducing the computation time, is explored. This article addresses challenges in developing reduced order models using the proper generalized decomposition (PGD) for transient thermal problems with a specific treatment of the moving heat source within the reduced model. Factors affecting accuracy, convergence, and computational cost, such as discretization methods (finite element and finite difference), a dimensionless formulation, the size of the heat source, and the inclusion of material parameters as additional PGD variables are examined across progressively complex examples. The results demonstrate the influence of these factors on the PGD model’s performance and emphasize the importance of their consideration when implementing such models. For thermal example, it is demonstrated that a PGD model with a finite difference discretization in time, a dimensionless representation, a mapping for a moving heat source, and a spatial domain non-separation yields the best approximation to the full order model. KW - Additive manufacturing KW - Mapping for unseparable load KW - Model order reduction (MOR) KW - Thermal transient problem KW - Sensitivity analysis KW - Proper generalized decomposition (PGD) PY - 2024 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-598001 DO - https://doi.org/10.1002/eng2.12887 IS - e12887 SP - 1 EP - 22 PB - John Wiley & Sons Ltd. CY - Berlin AN - OPUS4-59800 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -