TY - JOUR ED - Krüger, Jörg ED - Bonse, Jörn T1 - Special Issue "Advanced Pulse Laser Machining Technology" T2 - Materials N2 - Advanced Pulse Laser Machining Technology is a rapidly growing field to tailor special industrial and scientific applications. This is significantly driven by the availability of high-repetition rate laser sources and novel beam delivery concepts. This Special Issue focuses on developments in areas of surface and volume laser material processing, including spatial and temporal beam shaping, Bessel-beam dicing, direct laser interference patterning (DLIP), laser-induced forward transfer (LIFT), pulse burst machining, waveguide writing, and two-photon polymerization. Additionally, limitations of modern laser processing caused by failure of laser optics or unwanted secondary hazards like X-ray emission are addressed. Here, we would like to attract contributors from industry and academics. This Special Issue shall bundle original research and review articles of the latest achievements. KW - Advanced ultrashort-laser technology KW - Bessel-beam laser dicing KW - Direct laser interference patterning (DLIP) KW - High-repetition rate ultrafast laser processing KW - Laser-induced forward transfer (LIFT) KW - X-ray hazards during ultrafast laser processing KW - Volume processing, waveguide writing KW - Temporal beam shaping for precision machining PY - 2023 UR - https://www.mdpi.com/journal/materials/special_issues/pulse_laser_machining SN - 1996-1944 PB - MDPI CY - Basel AN - OPUS4-56842 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -