TY - JOUR A1 - Pech May, Nelson Wilbur A1 - Ziegler, Mathias T1 - Detection of surface breaking cracks using flying line laser thermography: A Canny-based algorithm JF - Engineering proceedings N2 - In this work, we introduce a new algorithm for effectual crack detection using flying line laser thermography, based on the well-known Canny approach. The algorithm transforms the input thermographic sequence into an edge map. Experimental measurements are performed on a metallic component that contains surface breaking cracks due to industrial use. The specimen is tested using flying line thermography at different scanning speeds and laser input powers. Results obtained with the proposed algorithm are additionally compared with a previously established algorithm for flying spot thermography. The proposed Canny-based algorithm can be used in automated systems for thermographic non-destructive testing. T2 - Advanced Infrared Technology and Applications 2021 CY - Online meeting DA - 26.10.2021 KW - Canny approach KW - Flying line thermography KW - Crack detection PY - 2021 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-539628 DO - https://doi.org/10.3390/engproc2021008022 SN - 2673-4591 VL - 8 IS - 1 SP - 1 EP - 4 PB - MDPI CY - Basel AN - OPUS4-53962 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Herrmann, K. A1 - Pech May, Nelson Wilbur A1 - Retsch, M. T1 - Photoacoustic thermal characterization of low thermal diffusivity thin films JF - Photoacoustics N2 - The photoacoustic measurement technique is a powerful yet underrepresented method to characterize the thermal transport properties of thin films. For the case of isotropic low thermal diffusivity samples, such as glasses or polymers, we demonstrate a general approach to extract the thermal conductivity with a high degree of significance. We discuss in particular the influence of thermal effusivity, thermal diffusivity, and sample layer thickness on the significance and accuracy of this measurement technique. These fundamental thermal properties guide sample and substrate selection to allow for a feasible thermal transport characterization. Furthermore, our data evaluation allows us to directly extract the thermal conductivity from this transient technique, without separate determination of the volumetric heat capacity, when appropriate boundary conditions are fulfilled. Using silica, poly(methyl methacrylate) (PMMA) thin films, and various substrates (quartz, steel, and silicon), we verify the quantitative correctness of our analytical approach. KW - Thermal conductivity KW - Photoacoustic characterization KW - Thin film characterization PY - 2021 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-528743 DO - https://doi.org/10.1016/j.pacs.2021.100246 SN - 2213-5979 VL - 22 SP - 100246 PB - Elsevier AN - OPUS4-52874 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Pech May, Nelson Wilbur A1 - Tabasco-Novelo, Carolina A1 - Quintana, Patricia A1 - Rodriguez-Gattorno, Geonel A1 - Alvarado-Gil, Juan J. T1 - Evidence of a Thermal Diffusivity Gap in Sintered Li–Co–Sb–O Solid Solutions JF - ACS Omega N2 - In this work, the thermal properties of ternary Li₃ₓCo₇₋₄ₓSb₂₊ₓO₁₂ solid solutions are studied for different concentrations in the range 0 ≤ x ≤ 0.7. Samples are elaborated at four different sintering temperatures: 1100, 1150, 1200 and 1250 °C. The effect of increasing the content of Li⁺ and Sb⁵⁺, accompanied by the reduction of Co²⁺, on the thermal properties is studied. It is shown that a thermal diffusivity gap, which is more pronounced for low values of x, can be triggered at a certain threshold sintering temperature (around 1150 °C in this study). This effect is explained by the increase of contact area between adjacent grains. Nevertheless, this effect is found to be less pronounced in the thermal conductivity. Moreover, a new framework for heat diffusion in solids is presented that establishes that both the heat flux and the thermal energy (or heat) satisfy a diffusion equation and therefore highlights the importance of thermal diffusivity in transient heat conduction phenomena. KW - General Chemical Engineering KW - General Chemistry PY - 2023 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-593248 DO - https://doi.org/10.1021/acsomega.2c07557 SN - 2470-1343 VL - 8 IS - 8 SP - 7808 EP - 7815 PB - American Chemical Society (ACS) CY - Washington, DC AN - OPUS4-59324 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -